Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings ....................................... 5
7.2 ESD Ratings .............................................................. 5
7.3 Recommended Operating Conditions ........................5
7.4 Thermal Information ...................................................5
7.5 Electrical Characteristics: V
S+
– V
S–
= 5 V to
12 V .............................................................................. 7
7.6 Typical Characteristics: (V
S+
) – (V
S–
) = 12 V..........11
7.7 Typical Characteristics: (V
S+
) – (V
S–
) = 5 V........... 14
7.8 Typical Characteristics: (V
S+
) – (V
S–
) = 3 V........... 17
7.9 Typical Characteristics: (V
S+
) – (V
S–
) = 3-V to
12-V Supply Range..................................................... 18
8 Parameter Measurement Information.......................... 22
8.1 Example Characterization Circuits............................22
8.2 Output Interface Circuit for DC-Coupled
Differential Testing.......................................................24
8.3 Output Common-Mode Measurements.....................24
8.4 Differential Amplifier Noise Measurements...............25
8.5 Balanced Split-Supply Versus Single-Supply
Characterization.......................................................... 25
8.6 Simulated Characterization Curves.......................... 25
8.7 Terminology and Application Assumptions............... 26
9 Detailed Description......................................................27
9.1 Overview................................................................... 27
9.2 Functional Block Diagram......................................... 27
9.3 Feature Description...................................................28
9.4 Device Functional Modes..........................................28
10 Application and Implementation................................ 31
10.1 Application Information........................................... 31
10.2 Typical Application.................................................. 36
11 Power Supply Recommendations..............................37
12 Layout...........................................................................38
12.1 Layout Guidelines................................................... 38
12.2 Layout Examples.................................................... 38
13 Device and Documentation Support..........................40
13.1 接收文档更新通知................................................... 40
13.2 支持资源..................................................................40
13.3 Trademarks.............................................................40
13.4 静电放电警告.......................................................... 40
13.5 术语表..................................................................... 40
14 Mechanical, Packaging, and Orderable
Information.................................................................... 40
4 Revision History
Changes from Revision C (December 2020) to Revision D (February 2021) Page
• Changed the status of the RGT package from preview to production ............................................................... 4
Changes from Revision B (August 2020) to Revision C (December 2020) Page
• 将
特性
部分的压摆率从 315V/µs 更改为 230V/µs...............................................................................................1
• 更新了
特性
部分中的“增益为 10V/V 且具有二阶 MFB 滤波器的 PCM 音频 DAC 输出”.................................1
• 为 THS4561 器件发布了 WQFN (10) 封装......................................................................................................... 1
• Changed the status of the RUN package from preview to production ...............................................................4
• Seperated slew rate specification into rising and falling specifications lines...................................................... 5
• Changed the VOCM small-signal bandwidth test condition from 100 mV
PP
to 10 mV
PP
and the typical value
from 23 MHz to 22 MHz .....................................................................................................................................5
• Changed the VOCM large-signal bandwidth typical value from 10 MHz to 1.9 MHz .........................................5
• Changed the maximum VOCM drift specification from 300 µV/°C .................................................................... 5
• Updated the Common-Mode Voltage, Small-Signal and Large-Signal Response (VOCM Pin Driven) figure in
the Typical Characteristics: (V
S+
)
–
(V
S
–
) = 3-V to 12-V Supply Range section ............................................18
• Updated the MFB Filter Driving an ADC Application figure in the Typical Application section ........................ 36
Changes from Revision A (December 2019) to Revision B (August 2020) Page
• 更新了整个文档的表、图和交叉参考的编号格式................................................................................................ 1
• Added the VQFN-10 and VQFN-16 Package Outlines.....................................................................................40
Changes from Revision * (August 2017) to Revision A (December 2019) Page
• 将器件状态从“预告信息”更改为“量产数据”................................................................................................ 1
THS4561
ZHCSGR2D – AUGUST 2017 – REVISED FEBRUARY 2021
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