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(R2021) MIL-PRF-19500R-002.pdf
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(R2021) MIL-PRF-19500R-002.pdf
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MIL-PRF-19500R
24 July 2021
SUPERSEDING
MIL-PRF-19500P
w/AMENDMENT 4
18 May 2018
PERFORMANCE SPECIFICATION
SEMICONDUCTOR DEVICES,
GENERAL SPECIFICATION FOR
AMSC N/A FSC 5961
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
Comments, suggestions, or questions on this document should be addressed to: DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990 or emailed to semiconductor@dla.mil. Since
contact information can change, you may want to verify the currency of this address information using the
ASSIST Online database at https://assist.dla.mil.
INCH-POUND
The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 24 January 2022.
Source: https://assist.dla.mil -- Downloaded: 2021-09-15T14:01Z
Check the source to verify that this is the current version before use.
MIL-PRF-19500R
ii
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Source: https://assist.dla.mil -- Downloaded: 2021-09-15T14:01Z
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MIL-PRF-19500R
CONTENTS
PARAGRAPH PAGE
iii
1. SCOPE ..................................................................................................................................................................... 1
1.1 Scope .................................................................................................................................................................. 1
1.2 Description ........................................................................................................................................................... 1
1.3 Identification ........................................................................................................................................................ 1
1.3.1.1 Quality level for encapsulated devices ....................................................................................................... 1
1.3.1.2 Quality level for non-hermetic encapsulated devices ................................................................................. 1
1.3.2 Quality level for unencapsulated devices. ..................................................................................................... 1
1.3.3 Manufacturers and critical interface identifiers .............................................................................................. 2
1.3.4 RHA designator. ............................................................................................................................................ 2
1.3.5 Component designation ................................................................................................................................ 2
1.3.6 Identification number ..................................................................................................................................... 2
1.3.7 Suffix letters .................................................................................................................................................. 2
1.3.8 Device substitutions. ..................................................................................................................................... 2
2. APPLICABLE DOCUMENTS .................................................................................................................................... 3
2.1 General ................................................................................................................................................................ 3
2.2 Government documents ...................................................................................................................................... 3
2.2.1 Specifications, standards, and handbooks .................................................................................................... 3
2.3 Non-Government publications. ............................................................................................................................ 3
2.4 Order of precedence. ........................................................................................................................................... 3
3. REQUIREMENTS ..................................................................................................................................................... 4
3.1 Specification sheets ............................................................................................................................................. 4
3.1.1 Implementation date...................................................................................................................................... 4
3.2 Qualification ......................................................................................................................................................... 4
3.2.1 Certification options ...................................................................................................................................... 4
3.2.1.1 Non-hermetic certification ....................................................................................................................... 4
3.2.2 Allowable alternate design, materials, and construction ................................................................................ 4
3.3 Performance requirements for JAN, JANTX, JANTXV, and JANS devices, and JANHC and JANKC die ........... 5
3.4 Reference to specification sheets ........................................................................................................................ 5
3.5 Certification .......................................................................................................................................................... 5
3.5.1 Transitional certification to appendix C ......................................................................................................... 5
3.5.2 DMS approval ............................................................................................................................................... 5
3.5.3 DMS listing .................................................................................................................................................... 6
3.5.4 MIL-STD-750 laboratory suitability. ............................................................................................................... 6
3.6 Traceability. ......................................................................................................................................................... 6
3.7 Certification of conformance and acquisition traceability. .................................................................................... 6
3.8 Critical interface and materials ............................................................................................................................ 7
3.9 Lead and terminal finish ...................................................................................................................................... 7
3.10 Marking .............................................................................................................................................................. 7
3.10.1 Marking on each device .............................................................................................................................. 7
3.10.2 Marking on initial container (unit package). ................................................................................................. 8
3.10.3 Special marking .......................................................................................................................................... 8
3.10.3.1 ESDS identifier ..................................................................................................................................... 8
3.10.3.2 Beryllium oxide package identifier ........................................................................................................ 8
3.10.4 Marking legibility ......................................................................................................................................... 8
3.10.5 Polarity marking of unidirectional diodes and thyristors. ............................................................................. 8
3.10.5.1 Diodes. ................................................................................................................................................. 8
3.10.5.2 Thyristors .............................................................................................................................................. 9
3.10.6 PIN .............................................................................................................................................................. 9
3.10.6.1 JAN and J marking ............................................................................................................................... 9
3.10.6.1.1 JAN branded prefix ........................................................................................................................ 9
3.10.7 Manufacturer's designating symbol. ............................................................................................................ 9
3.10.8 Lot identification code ................................................................................................................................. 9
3.10.8.1 Lot identification code suffix letter ......................................................................................................... 9
3.10.8.2 Code for plants ..................................................................................................................................... 9
5.2 Shipping containers ............................................................................................................................................. 9
3.10.9 Serialization .............................................................................................................................................. 10
Source: https://assist.dla.mil -- Downloaded: 2021-09-15T14:01Z
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MIL-PRF-19500R
CONTENTS
PARAGRAPH PAGE
iv
3.10.10 DMS marking .......................................................................................................................................... 10
3.10.11 Country of origin. ..................................................................................................................................... 10
3.10.12 Manufacturer's name, abbreviation, or trademark ................................................................................... 10
3.10.13 Marking option ........................................................................................................................................ 10
3.11 Solderability ..................................................................................................................................................... 10
3.12 ESD control. .................................................................................................................................................... 10
3.13 Recycled, recovered, environmentally preferable or biobased materials ......................................................... 10
3.14 Pure tin ............................................................................................................................................................ 10
3.15 Workmanship ................................................................................................................................................... 11
4. VERIFICATION ....................................................................................................................................................... 11
4.1 Classification of inspections ............................................................................................................................... 11
4.2 Quality system ................................................................................................................................................... 11
4.3 Device verification ............................................................................................................................................. 11
4.4 Test modification, reduction, or elimination. ....................................................................................................... 11
5. PACKAGING ........................................................................................................................................................... 11
5.1 Packaging .......................................................................................................................................................... 11
6. NOTES .................................................................................................................................................................... 11
6.1 Intended use ...................................................................................................................................................... 11
6.2 Acquisition requirements ................................................................................................................................... 12
6.2.1 Order requirements ..................................................................................................................................... 12
6.2.2 Relife ........................................................................................................................................................... 12
6.3 Qualification ....................................................................................................................................................... 13
6.4 Supersession information .................................................................................................................................. 13
6.4.1 Methods of qualification .............................................................................................................................. 13
6.4.2 QML format ................................................................................................................................................. 14
6.5 Subject term (key word) listing ........................................................................................................................... 14
6.6 PIN .................................................................................................................................................................... 14
6.7 Tin whisker growth ............................................................................................................................................. 14
6.8 Changes from previous issue ............................................................................................................................ 14
DEFINITIONS .............................................................................................................................................................. 15
A.1 SCOPE.............................................................................................................................................................. 15
A.1.1 Scope ......................................................................................................................................................... 15
A.2 APPLICABLE DOCUMENTS ............................................................................................................................ 15
A.3 SEMICONDUCTOR COMMON DEFINITIONS ................................................................................................. 15
A.3.1 Absolute maximum ratings ......................................................................................................................... 15
A.3.2 Ambient temperature .................................................................................................................................. 15
A.3.3 Anode ......................................................................................................................................................... 15
A.3.4 Assembly lot. .............................................................................................................................................. 15
A.3.4.1 Sublot ................................................................................................................................................... 15
A.3.5 Specification sheet. .................................................................................................................................... 15
A.3.5.1 MIL-STD-750 details ............................................................................................................................ 16
A.3.6 Blocking ...................................................................................................................................................... 16
A.3.7 Breakdown voltage ..................................................................................................................................... 16
A.3.8 Case mount. ............................................................................................................................................... 16
A.3.9 Case outline. ............................................................................................................................................... 16
A.3.10 Case temperature ..................................................................................................................................... 16
A.3.11 Cathode .................................................................................................................................................... 16
A.3.12 Characteristic ............................................................................................................................................ 16
A.3.13 Control plans ............................................................................................................................................ 16
A.3.14 Constant current source ........................................................................................................................... 16
A.3.15 Constant voltage source ........................................................................................................................... 17
A.3.16 Disc type ................................................................................................................................................... 17
A.3.17 Electrostatic discharge sensitivity (ESDS) ................................................................................................ 17
A.3.18 Engineering evaluation ............................................................................................................................. 17
A.3.19 Expanded metallization ............................................................................................................................. 18
A.3.20 Failure analysis ......................................................................................................................................... 18
Source: https://assist.dla.mil -- Downloaded: 2021-09-15T14:01Z
Check the source to verify that this is the current version before use.
MIL-PRF-19500R
CONTENTS
PARAGRAPH PAGE
v
A.3.21 Forward bias ............................................................................................................................................. 18
A.3.22 Failure mode and effects analysis (FMEA) ............................................................................................... 18
A.3.23 Hermetically sealed package .................................................................................................................... 18
A.3.24 Impulse waveform..................................................................................................................................... 18
A.3.24.1 Virtual front duration ........................................................................................................................... 18
A.3.24.2 Impulse duration ................................................................................................................................. 18
A.3.25 Internal Free Cavity Volume ..................................................................................................................... 18
A.3.26 Line ........................................................................................................................................................... 18
A.3.27 Metallurgical bond, diode construction, and thermal matching. ................................................................ 19
A.3.27.1 Double plug construction .................................................................................................................... 19
A.3.27.2 Dash-one construction ....................................................................................................................... 19
A.3.27.3 Category I metallurgical bond ............................................................................................................ 19
A.3.27.4 Category II metallurgical bond ........................................................................................................... 19
A.3.27.5 Category III metallurgical bond .......................................................................................................... 19
A.3.27.6 Non-cavity double plug diode ............................................................................................................. 19
A.3.27.7 Thermally matched axial leaded diodes ............................................................................................. 19
A.3.27.8 Metallurgically bonded-thermally matched-noncavity double plug construction. ................................ 19
A.3.27.9 Soft glass. .......................................................................................................................................... 19
A.3.27.10 Hard glass. ....................................................................................................................................... 19
A.3.28 Noise figure .............................................................................................................................................. 19
A.3.29 Open circuit. ............................................................................................................................................. 20
A.3.30 Package type. ........................................................................................................................................... 20
A.3.30.1 Case isolated package. ...................................................................................................................... 20
A.3.30.2 Metal Electrode Leadless Face (MELF). ............................................................................................ 20
A.3.31 Power device. ........................................................................................................................................... 20
A.3.32 Pulse ......................................................................................................................................................... 20
A.3.33 Pulse average time ................................................................................................................................... 21
A.3.34 Pulse delay time ....................................................................................................................................... 21
A.3.35 Pulse fall time. .......................................................................................................................................... 21
A.3.36 Pulse rise time. ......................................................................................................................................... 21
A.3.37 Pulse storage time .................................................................................................................................... 21
A.3.38 Pulse time ................................................................................................................................................. 21
A.3.39 Quality level certification mark .................................................................................................................. 22
A.3.39.1 Quality level JAN ................................................................................................................................ 22
A.3.39.2 Quality level JANTX ........................................................................................................................... 22
A.3.39.3 Quality level JANTXV ......................................................................................................................... 22
A.3.39.4 Quality level JANS ............................................................................................................................. 22
A.3.39.5 Quality level JANP ............................................................................................................................. 22
A.3.39.6 Quality level JANPTX ......................................................................................................................... 22
A.3.39.7 Quality level JANPTXV ...................................................................................................................... 22
A.3.39.8 Quality level JANHC ........................................................................................................................... 22
A.3.39.9 Quality level JANS ............................................................................................................................. 22
A.3.40 Radiation failures ...................................................................................................................................... 22
A.3.41 Radiation hardness assurance (RHA). ..................................................................................................... 22
A.3.42 Rating ....................................................................................................................................................... 23
A.3.42.1 Targeted parameter ........................................................................................................................... 23
A.3.43 Reverse bias ............................................................................................................................................. 23
A.3.44 Semiconductor devices ............................................................................................................................. 23
A.3.44.1 Die design .......................................................................................................................................... 23
A.3.45 Semiconductor diode ................................................................................................................................ 23
A.3.46 Semiconductor junction ............................................................................................................................ 23
A.3.47 Short circuit ............................................................................................................................................... 23
A.3.48 Small signal .............................................................................................................................................. 23
A.3.49 Stack junction rectifier diode ..................................................................................................................... 23
A.3.50 Storage temperature ................................................................................................................................. 23
A.3.51 Temperature coefficient ............................................................................................................................ 23
Source: https://assist.dla.mil -- Downloaded: 2021-09-15T14:01Z
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