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TI-HDC2080.pdf
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HDC2080 低功耗湿度和温度数字传感器
1 特性
• 相对湿度范围:0% 至 100%
• 湿度精度:±2%(典型值),±3%(最大值)
• 温度精度:±0.2°C(典型值),±0.4°C(最大值)
• 睡眠模式电流:50nA(典型值),100nA(最大
值)
• 平均电源电流(每秒测量 1 次)
– 300nA:仅 RH%(11 位)
– 550nA:RH%(11 位)+ 温度(11 位)
• 温度范围:
– 工作:–40°C 至 85°C
– 可使用:–40°C 至 125°C
• 电源电压范围:1.62V 至 3.6V
• 具有自动测量模式
• I
2
C 接口兼容性
2 应用
• 智能恒温器
• 智能家居助理
• 洗衣机/烘干机
• HVAC 系统
• 喷墨打印机
RH
Sensor
Temperature
Sensor
Registers
+
Logic
Calibration
I
2
C
ADC
ADC
SCL
SDA
DRDY/INT
ADDR
HDC2080
V
DD
MCU
V
DD
GPIO
I
2
C
Master
GND GND
1.80V
典型应用
3 说明
HDC2080 器件是一款采用小型 DFN 封装的集成式湿
度和温度传感器,能够以超低功耗提供高准确度测量。
这款电容式传感器包括新的集成数字功能和用于消散冷
凝和湿气的加热元件。HDC2080 数字功能包括可编程
中断阈值,因此能够提供警报和系统唤醒,而无需微控
制器持续对系统进行监控。同时,HDC2080 还具有可
编程采样间隔,功耗较低,并且支持 1.8V 电源电压,
因此非常适合电池供电型系统。
HDC2080 为各种环境监测和物联网 (IoT) 应用(如智
能恒温器和智能家居助理)提供高准确度测量功能。对
于印刷电路板 (PCB) 区域较小的设计,可以通过使用
与 HDC2080 完全软件兼容的 HDC2010 获得较小的芯
片级封装 (CSP) 选项。
对于具有严格功率预算限制的应用,HDC2080 可通过
自动测量模式自动开启温度和湿度测量。有了该特性,
用户便可以将微控制器配置为深度睡眠模式,因为
HDC2080 不再需要依赖微控制器来开启测量过程。
器件信息
(1)
器件型号 封装
封装尺寸(标称值)
HDC2080 WSON (6) 3.00mm × 3.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
RH (%RH)
Accuracy (r%RH)
0 10 20 30 40 50 60 70 80 90 100
0
1
2
3
4
5
6
7
8
9
10
Typical
RH 精度 (T
A
= 30°C)
HDC2080
ZHCSIA1C – MAY 2018 – REVISED JULY 2021
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SNAS678
Table of Contents
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 说明(续).........................................................................4
6 Pin Configuration and Functions...................................4
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings ....................................... 5
7.2 ESD Ratings .............................................................. 5
7.3 Recommended Operating Conditions ........................5
7.4 Thermal Information ...................................................5
7.5 Electrical Characteristics ............................................6
7.6 Switching Characteristics ...........................................7
7.7 Timing Diagram...........................................................7
7.8 Typical Characteristics................................................ 8
8 Detailed Description........................................................9
8.1 Overview..................................................................... 9
8.2 Functional Block Diagram........................................... 9
8.3 Feature Description.....................................................9
8.4 Device Functional Modes..........................................16
8.5 Programming............................................................ 16
8.6 Register Maps...........................................................17
9 Application and Implementation ................................. 30
9.1 Application Information............................................. 30
9.2 Typical Application.................................................... 30
10 Power Supply Recommendations..............................32
11 Layout........................................................................... 32
11.1 Layout Guidelines................................................... 32
11.2 Layout Example...................................................... 34
12 Device and Documentation Support..........................35
12.1 Documentation Support.......................................... 35
12.2 接收文档更新通知................................................... 35
12.3 支持资源..................................................................35
12.4 Trademarks............................................................. 35
12.5 静电放电警告.......................................................... 35
12.6 术语表..................................................................... 35
13 Mechanical, Packaging, and Orderable
Information.................................................................... 35
4 Revision History
Changes from Revision B (May 2019) to Revision C (July 2021) Page
• Removed GND pin absolute maximum rating.................................................................................................... 5
• Added DRDY/INT pin absolute maximum rating................................................................................................ 5
• Added information from multiple table footnotes to Recommended Operating Conditions table....................... 5
• Changed temperature accuracy maximum for 5℃ < TA < 60℃.........................................................................6
• Added TEMP
PSRR
parameter..............................................................................................................................6
• Changed reference material for Storage and Handling ..................................................................................... 9
• Added content to the Heater section................................................................................................................ 10
• Added 0.5 to make 方程式 1 –40.5 match more closely to the silicon and added PSSR equation.................18
• Added 0.5 to make 方程式 4 –40.5 match more closely to the silicon and added PSSR equation.................21
• Added 0.5 to make 方程式 7 –40.5 match more closely to the silicon and added PSSR equation ................25
• Added 0.5 to make 方程式 9 –40.5 match more closely to the silicon and added PSSR equation.................25
• Changed reference material in the Storage and Handling section................................................................... 32
• Added Typical Relative Humidity Accuracy Range Limits graphic....................................................................32
Changes from Revision A (October 2018) to Revision B (May 2019) Page
• Added the pin type for DRDY/INT pin ................................................................................................................4
• Changed description of behavior of TH_STATUS bit when INT_MODE is set to 1.......................................... 12
• Changed description of behavior of TH_STATUS bit when INT_MODE is set to 0 ......................................... 12
• Changed description of behavior of TL_STATUS bit when INT_MODE is set to 1...........................................13
• Changed description of behavior of TL_STATUS bit when INT_MODE is set to 0 ..........................................13
• Changed description of behavior of HH_STATUS bit when INT_MODE is set to 1..........................................14
• Changed description of behavior of HH_STATUS bit when INT_MODE is set to 0..........................................14
• Changed description of behavior of HL_STATUS bit when INT_MODE is set to 1.......................................... 15
• Changed description of behavior of HL_STATUS bit when INT_MODE is set to 0 ......................................... 15
• Changed the units for Humidity threshold low from: °C to: %RH......................................................................26
• Changed the temperature resolution decoding from: 8 bit to: 9 bit ..................................................................28
• Changed the humidity resolution decoding from: 8 bit to: 9 bit ........................................................................28
HDC2080
ZHCSIA1C – MAY 2018 – REVISED JULY 2021
www.ti.com.cn
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Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: HDC2080
• Changed the measurement configuration "10" bit encoding from: Humidity Only to: NA for field
MEAS_CONF[1:0] ........................................................................................................................................... 28
Changes from Revision * (May 2018) to Revision A (October 2018) Page
• Changed header cell in the Read Single Byte table from: Slave address (R) to: Slave address (W)...............16
• Changed header cell in the Read Multi Byte table from: Slave address (R) to: Slave address (W)................. 16
www.ti.com.cn
HDC2080
ZHCSIA1C – MAY 2018 – REVISED JULY 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: HDC2080
5 说明(续)
HDC2080 具有可编程温度和湿度阈值,因此可在需要时发送硬件中断来唤醒微控制器。此外,HDC2080 的功耗
大幅减少,这有助于更大限度地减少自发热并可提高测量精度。
HDC2080 在温度精度和相对湿度精度上的出厂校准水平分别为 0.2°C 和 2%。
6 Pin Configuration and Functions
Top View
1
SDA
2
GND
ADDR
3
DRDY/INT
4
VDD
5
SCL
6
RH
SENSOR
图 6-1. DMB Package 6-Pin PWSON Top View
表 6-1. Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
SDA 1 I/O Serial data line for I
2
C, open-drain; requires a pullup resistor to V
DD
GND 2 G Ground
ADDR 3 I
Address select pin – leave unconnected or hardwired to V
DD
or GND.
Unconnected slave address: 1000000
GND: slave address: 1000000
V
DD
: slave address: 1000001
DRDY/INT 4 O Data ready/Interrupt. Push-pull output
V
DD
5 P Positive Supply Voltage
SCL 6 I Serial clock line for I
2
C, open-drain; requires a pullup resistor to V
DD
HDC2080
ZHCSIA1C – MAY 2018 – REVISED JULY 2021
www.ti.com.cn
4 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: HDC2080
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
DD
Applied Voltage on VDD pin
–0.3
3.9 V
ADDR Applied Voltage on ADDR pin
–0.3
3.9 V
SCL Applied Voltage on SCL pin
–0.3
3.9 V
SDA Applied Voltage on SDA pin
–0.3
3.9 V
DRDY/INT Applied Voltage on DRDY/INT PIN -0.3 V
DD
+ 0.3 V
T
stg
Storage temperature
–65
150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
7.2 ESD Ratings
VALUE UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101
(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
PARAMETER MIN MAX UNIT
V
DD
Supply voltage 1.62 3.6 V
T
TEMP
Temperature Sensor - Operating free-air temperature
–40
125 °C
T
RH
Relative Humidity Sensor - Operating free-air temperature
(1)
–20
70 °C
T
HEATER
Integrated Heater - Operating free-air temperature
–40
85 °C
RH
OR
Relative Humidity Sensor (Non-condensing)
(1)
0 100 %RH
(1) Prolonged operation outside the recommended temperature operating conditions and/or at >80%RH with temperature in the higher
recommended operating range can result in a shift of sensor reading, with slow recovery time. See High Temperature and Humidity
Exposure for more details.
7.4 Thermal Information
THERMAL METRIC
(1)
HDC2080
UNITWSON (DMB)
6 PINS
R
θJA
Junction-to-ambient thermal resistance 56.4 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 73.6 °C/W
R
θJB
Junction-to-board thermal resistance 24.0 °C/W
Ψ
JT
Junction-to-top characterization parameter 3.8 °C/W
Ψ
JB
Junction-to-board characterization parameter 24.0 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 13.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
www.ti.com.cn
HDC2080
ZHCSIA1C – MAY 2018 – REVISED JULY 2021
Copyright © 2021 Texas Instruments Incorporated
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Product Folder Links: HDC2080
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