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TS5MP645

4-Data Lane

MIPI Switch

VDD

2.2 µF

1.65 V ± 5.5 V

100 nF

Processor

MIPI Module 1

MIPI Module 2

SEL

/OE

CLK

Data[1:4]

CLK

Data[1:4]

CLK

Data[1:4]

Product

Folder

Order

Now

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SCDS385

TS5MP645

ZHCSHH3B –JANUARY 2018–REVISED JULY 2018

TS5MP645 4 数数据据通通道道 2:1 MIPI 开开关关（（10 通通道道，，2:1 模模拟拟开开关关））

1 特特性性

• 电源电压范围 1.65V 至 5.5V

• 10 通道 2:1 开关

• 关断保护

= 0V 时，I/O 类型为 Hi-Z

• 低 R

，典型值 2.45Ω

• 低 C

，为 1.5pF

• 1.5GHz 最小带宽

• -40dB 超低串扰

• 低功耗禁用模式

• 1.8V 兼容型逻辑输入

• ESD 保护性能超出 JESD 22 标准

– 2000V 人体放电模型 (HBM)

2 应应用用

• 移动电话

• 平板电脑

• 台式机/笔记本电脑

• 虚拟现实

• 扩增实境

3 说说明明

TS5MP645 是一款四数据通道 MIPI 开关。此器件是一

款经优化的 10 通道（包含 5 个差动通道）单极双投开

关，适用于高速应用。TS5MP645 可方便地将多个符

合 MIPI 标准的器件与单个 CSI/DSI、C-PHY/D-PHY

模块相连接。

此器件具有出色的带宽、几乎不会造成信号恶化的低通

道间偏斜以及可补偿布局损失的宽裕量。其低电流消耗

可满足低功率应用供电。

器器件件信信息息

(1)

器器件件编编号号封封装装封封装装尺尺寸寸（（标标称称值值））

TS5MP645 DSBGA (YFP) 2.42mm x 2.42mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

简简化化原原理理图图

TS5MP645

ZHCSHH3B –JANUARY 2018–REVISED JULY 2018

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用.......................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 5

6.1 Absolute Maximum Ratings ...................................... 5

6.2 ESD Ratings.............................................................. 5

6.3 Recommended Operating Conditions....................... 5

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics........................................... 6

6.6 Typical Characteristics.............................................. 9

7 Parameter Measurement Information ................ 10

8 Detailed Description............................................ 16

8.1 Overview ................................................................. 16

8.2 Functional Block Diagram ....................................... 16

8.3 Feature Description................................................. 17

8.4 Device Functional Modes........................................ 19

9 Application and Implementation ........................ 20

9.1 Application Information............................................ 20

9.2 Typical Application ................................................. 20

10 Power Supply Recommendations ..................... 21

11 Layout................................................................... 22

11.1 Layout Guidelines ................................................. 22

11.2 Layout Example .................................................... 22

12 器器件件和和文文档档支支持持 ..................................................... 23

12.1 文档支持 ............................................................... 23

12.2 接收文档更新通知 ................................................. 23

12.3 社区资源................................................................ 23

12.4 商标 ....................................................................... 23

12.5 静电放电警告......................................................... 23

12.6 术语表 ................................................................... 23

13 机机械械、、封封装装和和可可订订购购信信息息....................................... 24

4 修修订订历历史史记记录录

注：之前版本的页码可能与当前版本有所不同。

Changes from Revision A (March 2018) to Revision B Page

• Changed the I

OFF

Test conditions From: V

= 1.65 V to 5.5 V To: V

= 0 V, 1.65 V to 5.5 V in the Electrical

Characteristics table .............................................................................................................................................................. 6

Changes from Original (January 2018) to Revision A Page

• 将“器件信息”表中的“封装尺寸（标称值）”从 2.459 x 2.459 更改成了 2.42 x 2.42................................................................. 1

TS5MP645

www.ti.com.cn

ZHCSHH3B –JANUARY 2018 –REVISED JULY 2018

(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage are with respect to ground, unless otherwise specified

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN MAX UNIT

Supply Voltage -0.5 6 V

I/O

Analog voltage range (DxN, CLKN, DxP, CLKP, DAxN, CLKAN, DAxP, CLKAP, DBxN,

CLKBN, DBxP, CLKBP)

-0.5 4 V

SEL

, V

Digital Input Voltage (SEL, OE) -0.5 6 V

Junction temperature -65 150 °C

stg

Storage temperature -65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human body model (HBM), per

ANSI/ESDA/JEDEC JS-001, all pins

(1)

±2000

Charged device model (CDM), per JEDEC

specification JESD22-C101, all pins

(2)

±250

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

Supply Voltage 1.65 5.5 V

I/O

Analog voltage range (DxN, CLKN, DxP, CLKP, DAxN, CLKAN, DAxP,

CLKAP, DBxN, CLKBN, DBxP, CLKBP)

0 3.6 V

SEL

, V

Digital Input Voltage (SEL, OE) 0 5.5 V

I/O

Continuous I/O current -35 35 mA

Operating ambient temperature -40 85 °C

Junction temperature -65 150 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC

(1)

TS5MP645

UNITYFP

θJA

Junction-to-ambient thermal resistance 57.6 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 0.3 ° C/W

θJB

Junction-to-board thermal resistance 12.6 °C/W

Junction-to-top characterization parameter 0.2 ° C/W

Junction-to-board characterization parameter 12.7 °C/W

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