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TI-TS3A225E 音频头戴式耳机开关器件 TI-TS3A225E 是一款音频头戴式耳机开关器件,具有降噪、低电阻和高灵敏度的特点。该器件主要用于音频头戴式耳机的开关控制,能够检测模拟麦克风是否存在,并在音频立体声插孔中的不同接头之间切换系统模拟麦克风引脚。 TI-TS3A225E 采用 QFN 封装,具有小型化、低电阻和高灵敏度的特点,适用于音频头戴式耳机、笔记本电脑、平板电脑等设备。该器件还具有 ESD 性能,能够保护音频头戴式耳机免受静电放电的影响。 TI-TS3A225E 的主要特点包括: * 低电阻(<100mΩ) * 高灵敏度 * 降噪 * ESD 性能 * 小型化 QFN 封装 * 广泛的供电电压范围(2.7V 到 4.5V) TI-TS3A225E 的应用场景包括: * 音频头戴式耳机 * 笔记本电脑 * 平板电脑 * 手机 * 其他音频设备 TI-TS3A225E 的工作原理是通过 I2C 或外部触发引脚来控制音频立体声插孔中的不同接头之间的切换。该器件还能够检测模拟麦克风是否存在,并将麦克风线路连接到适当的引脚。 TI-TS3A225E 的技术参数包括: * 供电电压:2.7V 到 4.5V * 电流:≤100mA * 输入电阻:<100mΩ * 输出电阻:<100mΩ * 工作温度:-40°C 到 85°C TI-TS3A225E 是一款功能强大、灵敏度高、电阻低的音频头戴式耳机开关器件,适用于音频头戴式耳机、笔记本电脑、平板电脑等设备。
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S1
VDD
SCL
SDA
I2C_ADDR_SEL
MICp
MICn / HP_REF
SLEEVE_SENSE
RING2_SENSE
SLEEVE
RING2
GND
Control
Logic
TS3A225E
FET2 FET1
TIP
RING1
MIC_BIAS
MICI
MIC_REF
R1
C1
C2
C3
/MIC_PRESENT
DET_TRIGGER
TIP_SENSE
TS3A225E
www.ti.com.cn
ZHCS506A –AUGUST 2012–REVISED MAY 2013
自自主主音音频频头头戴戴式式耳耳机机开开关关
查查询询样样品品: TS3A225E
1
特特性性
应应用用范范围围
• V
DD
范范围围 = 2.7V 至至 4.5V • 手手机机/平平板板电电脑脑
• 打打开开立立体体声声插插孔孔开开关关前前断断开开 • 笔笔记记本本电电脑脑
• 针针对对接接地地场场效效应应晶晶体体管管 (FET) 开开关关的的 Ron
说说明明
– 晶晶圆圆级级芯芯片片封封装装 (WCSP)::70mΩ
TS3A225E 是一个音频头戴式耳机开关器件。 此器件
– 四四方方扁扁平平无无引引线线 (QFN) 封封装装::100mΩ
可检测模拟麦克风是否存在,并在音频立体声插孔中的
• GND 和和麦麦克克风风连连接接的的自自主主检检测测
不同接头之间切换系统模拟麦克风引脚。 立体声接头
• 由由 I
2
C 或或外外部部触触发发引引脚脚触触发发的的检检测测
中的麦克风连接可与接地连接互换,具体取决于制造
• HDA 兼兼容容麦麦克克风风插插入入指指示示器器
商。 当 TAS3A225E 检测到一个特定配置时,器件会
• 1.8V 兼兼容容 I
2
C 开开关关控控制制
自动将麦克风线路连接到适当的引脚。 此器件还报告
• 静静电电放放电电 (ESD) 性性能能测测试试符符合合 JESD 22 标标准准::
音频立体声插孔上插入的模拟麦克风。
– 2000V 人人体体模模型型((A114-B,,II 类类))
– 500V 充充电电器器件件模模型型 (C101)
在某些系统中,需要将立体声插孔引脚接地。
• ESD 性性能能 (SLEEVE ,,RING2,,TIP) TS3A225E 提供用于接地短路的两个内部低电阻
(<100mΩ) FET 开关。
– ±8kV 接接触触放放电电 (IEC 61000-4-2)
ORDERING INFORMATION
T
A
PACKAGE
(1)(2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
RTE - QFN Tape and reel TS3A225ERTER ZTL
–40°C to 85°C
YFF - WCSP Tape and reel TS3A225EYFFR YP225E
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not English Data Sheet: SCDS329
necessarily include testing of all parameters.
A1
D
C
B
A
1 2
3
4
A2 A3 A4
B1 B2 B3 B4
C1 C2 C3 C4
D1 D2 D3 D4
A4
D
C
B
A
4 3
2
1
A3 A2
B4 B3 B2 B1
C4 C3 C2 C1
D4 D3 D2 D1
A1
Top View/Footprint Bump View
Die Size: 1.56mm x 1.56mm (+ 0.03mm)
Bump Size: 0.25mm
Bump Pitch: 0.4mm
TS3A225E
ZHCS506A –AUGUST 2012–REVISED MAY 2013
www.ti.com.cn
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PACKAGE OPTION #1: YFF- WCSP
Table 1. TS3A225E Pin Mapping (Top View)
4 3 2 1
D /MIC_PRESENT TIP_SENSE MICp MICn
C RING2 GND
(1)
VDD
(1)
RING2_SENSE
B SLEEVE GND
(1)
VDD
(1)
SLEEVE_SENSE
A DET_TRIGGER ADDR_SEL SDA SCL
(1) To ensure proper operation at least 1 of the VDD balls and at least 1 of the GND balls must be pad-
connected.
2 Copyright © 2012–2013, Texas Instruments Incorporated
TS3A225E
www.ti.com.cn
ZHCS506A –AUGUST 2012–REVISED MAY 2013
PIN DESCRIPTION – WCSP
PIN # PIN
WCSP NAME TYPE DESCRIPTION
A1 SCL I/O Clock from I
2
C bus. This can be connected to VDD if I
2
C is not used.
A2 SDA I/O Bidirectional data from/to I
2
C bus. This can be connected to VDD if I
2
C is not used.
This pin is used to change the device I2C address in an I
2
C system to avoid address conflict.
A3 ADDR_SEL I/O Please see the External Pin Connection section for more details. This pin can be grounded if
not needed.
A rising edge from low to high on this pin triggers the detection. This pin can be connected to
A4 DET_TRIGGER I/O the headset jack to allow automatic pull-up to supply after headset insertion to initialize
detection sequence. The detection trigger can be disabled or activated in I
2
C
Connected to the SLEEVE segment of the jack. If SLEEVE segment on plug is MIC signal,
B1 SLEEVE_SENSE I/O this is connected to MICp. If not, this is connected to MICn and becomes the remote sensing
feedback for the headphone.
B2 VDD Supply Power supply
Headphone ground connection (Current return path to headphone amplifier), switch ground
B3 GND Ground
reference.
Headphone current return path if SLEEVE is GND for headset. Connect to SLEEVE with low
B4 SLEEVE I/O
DCR trace.
Connected to the RING2 segment of the jack. If RING2 segment on plug is MIC signal, this
C1 RING2_SENSE I/O is connected to MICp. If not, this is connected to MICn and becomes the remote sensing
feedback for the headphone.
C2 VDD Supply Power supply
Headphone ground connection (Current return path to headphone amplifier), switch ground
C3 GND Ground
reference.
Headphone current return path if RING2 is GND for headset. Connect to RING2 with low
C4 RING2 I/O
DCR trace.
D1 MICn I/O Microphone signal reference connection to codec.
D2 MICp I/O Microphone signal connection to codec. Microphone bias should be fed into this pin.
D3 TIP_SENSE I/O Connected to the TIP segment of the headphone jack
Open Drain output. When pulled-low, it indicate that a mic is detected on the headset (switch
D4 /MIC_PRESENT Output for HDA sense resistor or INT output in an I2S based system. Default behavior is a hardware
pulldown for HDA resistor. Programmable through I2C into an interrupt.)
Copyright © 2012–2013, Texas Instruments Incorporated 3
16
13
12
9
85
4
1
2
3
6 7
10
11
14
15
MICN
MICP
GND
TIP_SENSE
ADDR_SEL
GND
SDA
SCL
DET_TRIGGER
SLEEVE
RING2
MIC_PRESENT
VDD
SLEEVE_SENSE
RING2_SENSE
VDD
Top View
Package Size: 3 mm x 3 mm
Pitch: 0.5 mm
TS3A225E
ZHCS506A –AUGUST 2012–REVISED MAY 2013
www.ti.com.cn
PACKAGE OPTION #2: RTE- QFN
4 Copyright © 2012–2013, Texas Instruments Incorporated
TS3A225E
www.ti.com.cn
ZHCS506A –AUGUST 2012–REVISED MAY 2013
PIN DESCRIPTION – QFN
PIN # PIN
QFN NAME TYPE DESCRIPTION
1 SCL I/O Clock from I
2
C bus. This can be connected to VDD if I
2
C is not used.
2 SDA I/O Bidirectional data from/to I
2
C bus. This can be connected to VDD if I
2
C is not used.
Headphone ground connection (Current return path to headphone amplifier), switch ground
3 GND Ground
reference.
This pin is used to change the device I2C address in an I
2
C system to avoid address conflict.
4 ADDR_SEL I/O Please see the External Pin Connection section for more details. This pin can be grounded if
not needed.
A rising edge from low to high on this pin triggers the detection. This pin can be connected to
5 DET_TRIGGER I/O the headset jack to allow automatic pull-up to supply after headset insertion to initialize
detection sequence. The detection trigger can be disabled or activated in I
2
C
Headphone current return path if SLEEVE is GND for headset. Connect to SLEEVE with low
6 SLEEVE I/O
DCR trace.
Headphone current return path if RING2 is GND for headset. Connect to RING2 with low DCR
7 RING2 I/O
trace.
Open Drain output. When pulled-low, it indicate that a mic is detected on the headset (switch
8 /MIC_PRESENT Output for HDA sense resistor or INT output in an I2S based system. Default behavior is a hardware
pulldown for HDA resistor. Programmable through I2C into an interrupt.)
9 TIP_SENSE I/O Connected to the TIP segment of the headphone jack
Headphone ground connection (Current return path to headphone amplifier), switch ground
10 GND Ground
reference.
11 MICp I/O Microphone signal connection to codec. Microphone bias should be fed into this pin.
12 MICn I/O Microphone signal reference connection to codec.
13 VDD Supply Power supply
Connected to the RING2 segment of the jack. If RING2 segment on plug is MIC signal, this is
14 RING2_SENSE I/O connected to MICp. If not, this is connected to MICn and becomes the remote sensing
feedback for the headphone.
Connected to the SLEEVE segment of the jack. If SLEEVE segment on plug is MIC signal,
15 SLEEVE_SENSE I/O this is connected to MICp. If not, this is connected to MICn and becomes the remote sensing
feedback for the headphone.
16 VDD Supply Power supply
Copyright © 2012–2013, Texas Instruments Incorporated 5
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