TI-TPA0112.pdf
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TPA0112
2-W STEREO AUDIO POWER AMPLIFIER
WITH FOUR SELECTABLE GAIN SETTINGS
SLOS204B – MAY 1999 – REVISED MARCH 2000
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Compatible With PC 99 Desktop Line-Out
Into 10-kΩ Load
D
Internal Gain Control, Which Eliminates
External Gain-Setting Resistors
D
2-W/Ch Output Power Into 3-Ω Load
D
PC-Beep Input
D
Depop Circuitry
D
Stereo Input MUX
D
Fully Differential Input
D
Low Supply Current and Shutdown Current
D
Surface-Mount Power Packaging
24-Pin TSSOP PowerPAD
description
The TPA0112 is a stereo audio power amplifier in a 24-pin TSSOP thermally enhanced package capable of
delivering 2 W of continuous RMS power per channel into 3-Ω loads. This device minimizes the number of
external components needed, simplifying the design, and freeing up board space for other features. When
driving 1 W into 8-Ω speakers, the TPA0112 has less than 0.8% THD+N across its specified frequency range.
Included within this device is integrated depop circuitry that virtually eliminates transients that cause noise in
the speakers.
Amplifier gain is internally configured and controlled by way of two terminals (GAIN0 and GAIN1). BTL gain
settings of –2, –6, –12, and –24 V/V are provided, while SE gain is always configured as –1 V/V for headphone
drive. An internal input MUX allows two sets of stereo inputs to the amplifier. In notebook applications, where
internal speakers are driven as BTL and the line outputs (often headphone drive) are required to be SE, the
TPA0112 automatically switches into SE mode when the SE/BTL
input is activated, and this reduces the gain
to –1 V/V.
The TPA0112 consumes only 6 mA of supply current during normal operation. A miserly shutdown mode
reduces the supply current to less than 150 µA.
The PowerPAD package (PWP) delivers a level of thermal performance that was previously achievable only
in TO-220-type packages. Thermal impedances of approximately 35°C/W are readily realized in multilayer PCB
applications. This allows the TPA0112 to operate at full power into 8-Ω loads at an ambient temperature of 85°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2000, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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PWP PACKAGE
(TOP VIEW)
GND
GAIN0
GAIN1
LOUT+
LLINEIN
LHPIN
PV
DD
RIN
LOUT–
LIN
BYPASS
GND
GND
RLINEIN
SHUTDOWN
ROUT+
RHPIN
V
DD
PV
DD
PCB ENABLE
ROUT–
SE/BTL
PC-BEEP
GND
PowerPAD is a trademark of Texas Instruments Incorporated.
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