TI-BUF16821-Q1.pdf资源-CSDN文库

Analog

(9 V to 20 V)

Digital

(2.0 V to 5.5 V)

BKSEL

A0

SCL

SDA

VCOM2

VCOM1

DAC Registers

Control IF

OUT15

OUT16

¼

BUF16821-Q1

16x Nonvolatile Memory BANK1

16x Nonvolatile Memory BANK0

OUT1

OUT2

DAC Registers

1

¼

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BUF16821-Q1

ZHCSCF9 –MAY 2014

BUF16821-Q1 可可编编程程伽伽马马电电压压生生成成器器和和

具具有有集集成成型型 2 组组存存储储器器的的 VCOM 校校准准器器

1 特特性性 3 说说明明

1

• 具有符合 AEC-Q100 标准的以下结果：

BUF16821-Q1 提供 16 条可编程伽马通道，以及两个

可编程 VCOM 通道。最终的伽马和 VCOM 值可被存

– 温度等级 3：-40°C 至 85°C

储在片上、非易失性存储器中。为了应对编程错误时

– 人体模型 (HBM) 静电放电 (ESD) 分类等级 2

或使液晶显示屏 (LCD) 面板重新开始工作，此器件支

– 充电器件模型 (CDM) ESD 分类等级 C4B

持多达 16 个对片上存储器的写操作。

• 16 通道 P 伽马，2 通道 P-VCOM，10 位分辨率

• 16x 可重写非易失性存储器

此器件具有两个独立的存储器组，可实现两个不同伽马

• 两个独立的引脚可选存储器组

曲线的同时存储，从而使伽马曲线之间的切换更加便

• 轨至轨输出：

捷。所有伽马和 VCOM 通道提供一个轨到轨输出，此

– 300mV（最小值）电源轨摆幅 (10mA)

输出在 10mA 负载时，通常在任一电源轨的 150mV 内

– > 300mA（最大值）I

OUT

摆动。可使用一个 I

2

C 接口对所有通道进行编程，这

• 电源电压：9V 至 20V

个接口支持高达 400kHz 的标准运行，以及高达

• 数字电源：2V 至 5.5V

2.7MHz 的高速数据传输。

• I

2

C™ 接口：支持 400kHz 和 2.7MHz

此器件使用德州仪器 (TI) 专有的、最先进的高压

CMOS 工艺制造。这一工艺提供高达 20V 的高密度逻

2 应应用用范范围围

辑和高电源电压运行。此器件采用带散热片薄型小外形

TFT-LCD 基准驱动器

尺寸 (HTSSOP)-28 PowerPAD™ 封装，并且在 -40°C

功功能能方方框框图图

至 +85°C 的温度范围内额定运行。

器器件件信信息息

(1)

产产品品型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

BUF16821-Q1 HTSSOP (28) 9.70mm x 4.40mm

(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。

1

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

English Data Sheet: SBOS712

BUF16821-Q1

ZHCSCF9 –MAY 2014

www.ti.com.cn

目目录录

7.4 Device Functional Modes........................................ 19

1 特特性性.......................................................................... 1

7.5 Programming .......................................................... 20

2 应应用用范范围围................................................................... 1

7.6 Register Maps......................................................... 24

3 说说明明.......................................................................... 1

8 Application and Implementation ........................ 25

4 修修订订历历史史记记录录 ........................................................... 2

8.1 Application Information............................................ 25

5 Pin Configuration and Functions......................... 3

8.2 Typical Application .................................................. 25

6 Specifications......................................................... 5

9 Power Supply Recommendations...................... 26

6.1 Absolute Maximum Ratings ...................................... 5

10 Layout................................................................... 27

6.2 Handling Ratings....................................................... 5

10.1 Layout Guidelines ................................................. 27

6.3 Recommended Operating Conditions....................... 5

10.2 Layout Example .................................................... 29

6.4 Thermal Information.................................................. 5

11 器器件件和和文文档档支支持持 ..................................................... 30

6.5 Electrical Characteristics........................................... 6

11.1 文档支持................................................................ 30

6.6 Timing Requirements................................................ 7

11.2 Trademarks........................................................... 30

6.7 Typical Characteristics.............................................. 8

11.3 Electrostatic Discharge Caution............................ 30

7 Detailed Description............................................ 10

11.4 Glossary................................................................ 30

7.1 Overview ................................................................. 10

12 机机械械封封装装和和可可订订购购信信息息 .......................................... 30

7.2 Functional Block Diagram ....................................... 10

7.3 Feature Description................................................. 10

4 修修订订历历史史记记录录

日日期期修修订订版版本本注注释释

2014 年 5 月 * 最初发布。

BUF16821-Q1

www.ti.com.cn

ZHCSCF9 –MAY 2014

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

V

S

Supply voltage 22 V

DVDD Digital power supply (VSD pin) 6 V

SCL, SDA, AO, BKSEL: voltage –0.5 6 V

Digital input pins

SCL, SDA, AO, BKSEL: current ±10 mA

Output pins, OUT1 through OUT16, VCOM1 and VCOM2

(2)

(V–) – 0.5 (V+) + 0.5 V

Output short-circuit

(3)

Continuous

Ambient operating temperature –40 95 °C

T

J

Junction temperature 125 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) See the Output Protection section.

(3) Short-circuit to ground, one amplifier per package.

6.2 Handling Ratings

MIN MAX UNIT

T

stg

Storage temperature range –65 150 °C

Human body model (HBM), per AEC Q100-002

(1)

–2000 2000

Corner pins (1, 14, 15,

V

(ESD)

Electrostatic discharge –750 750 V

Charged device model (CDM), per

and 28)

AEC Q100-011

Other pins –500 500

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

V

S

Supply voltage 9.0 18.0 20.0 V

DVDD Digital power supply (VSD pin) 2.0 3.3 5.5 V

6.4 Thermal Information

BUF16821-Q1

THERMAL METRIC

(1)

PWP (HTSSOP) UNIT

28 PINS

R

θJA

Junction-to-ambient thermal resistance 34.3

R

θJC(top)

Junction-to-case (top) thermal resistance 19.9

R

θJB

Junction-to-board thermal resistance 17.4

°C/W

ψ

JT

Junction-to-top characterization parameter 0.7

ψ

JB

Junction-to-board characterization parameter 17.2

R

θJC(bot)

Junction-to-case (bottom) thermal resistance 3.0

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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