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TI-BUF634.pdf
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OPA132
Drives headphones
or small speakers.
5kΩ
BUF634
100kΩ
1µF
R
L
= 100Ω
f
1kHz
20kHz
THD+N
0.015%
0.02%
250Ω
G = +21
V
IN
V–
BW
V+
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
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Community
BUF634
SBOS030A –SEPTEMBER 2000–REVISED NOVEMBER 2015
BUF634 250-mA High-Speed Buffer
1 Features 3 Description
The BUF634 device is a high speed, unity-gain open-
1
• High Output Current: 250 mA
loop buffer recommended for a wide range of
• Slew Rate: 2000 V/µs
applications. The BUF634 device can be used inside
• Pin-Selected Bandwidth: 30 MHz to 180 MHz
the feedback loop of op amps to increase output
current, eliminate thermal feedback, and improve
• Low Quiescent Current: 1.5 mA (30 MHz BW)
capacitive load drive.
• Wide Supply Range: ±2.25 to ±18 V
For low power applications, the BUF634 device
• Internal Current Limit
operates on 1.5-mA quiescent current with 250-mA
• Thermal Shutdown Protection
output, 2000-V/ µs slew rate, and 30-MHz bandwidth.
• 8-Pin PDIP, SOIC-8, 5-Lead TO-220, 5-Lead
Bandwidth can be adjusted from 30 MHz to 180 MHz
DDPAK-TO-263 Surface-Mount
by connecting a resistor between V– and the BW Pin.
Output circuitry is fully protected by internal current
2 Applications
limit and thermal shut-down, making it rugged and
• Valve Driver
easy to use.
• Solenoid Driver
The BUF634 device is available in a variety of
packages to suit mechanical and power dissipation
• Op Amp Current Booster
requirements. Types include 8-pin PDIP, SOIC-8
• Line Driver
surface-mount, 5-lead TO-220, and a 5-lead DDPAK-
• Headphone Driver
TO-263 surface-mount plastic power package.
• Video Driver
Device Information
(1)
• Motor Driver
PART
• Test Equipment
PACKAGE BODY SIZE (NOM)
NUMBER
• ATE Pin Driver
SOIC (8) 3.91 mm × 4.90 mm
PDIP (8) 6.35 mm × 9.81 mm
BUF634
TO-220 (5) 8.51 mm × 10.16 mm
DDPAK/TO-263 (5) 8.42 mm × 10.16 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Boost the Output Current of any Operational Amplifier
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
BUF634
SBOS030A –SEPTEMBER 2000–REVISED NOVEMBER 2015
www.ti.com
Table of Contents
1 Features.................................................................. 1 8 Application and Implementation ........................ 12
8.1 Application Information............................................ 12
2 Applications ........................................................... 1
8.2 Typical Application ................................................. 13
3 Description ............................................................. 1
9 Power Supply Recommendations...................... 15
4 Revision History..................................................... 2
10 Layout................................................................... 15
5 Pin Configuration and Functions......................... 3
10.1 Layout Guidelines ................................................. 15
6 Specifications......................................................... 4
10.2 Layout Example .................................................... 16
6.1 Absolute Maximum Ratings ...................................... 4
10.1 Power Dissipation ................................................. 17
6.2 ESD Ratings ............................................................ 4
11 Device and Documentation Support ................. 18
6.3 Recommended Operating Conditions....................... 4
11.1 Device Support .................................................... 18
6.4 Thermal Information.................................................. 4
11.2 Documentation Support ....................................... 18
6.5 Electrical Characteristics........................................... 5
11.3 Community Resource............................................ 18
6.6 Typical Characteristics.............................................. 6
11.4 Trademarks........................................................... 18
7 Detailed Description............................................ 10
11.5 Electrostatic Discharge Caution............................ 19
7.1 Overview ................................................................. 10
11.6 Glossary................................................................ 19
7.2 Functional Block Diagram ....................................... 10
12 Mechanical, Packaging, and Orderable
7.3 Feature Description................................................. 10
Information ........................................................... 19
7.4 Device Functional Modes........................................ 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (September 2000) to Revision A Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
2 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: BUF634
G = 1
V–
V
O
V+
V
IN
BW
1 2 3 4
5
G = 1
V–
V
O
V+
V
IN
BW
1 2 3 4
5
BW
NC
V
IN
V–
NC
V+
V
O
NC
1
2
3
4
8
7
6
5
G = 1
BUF634
www.ti.com
SBOS030A –SEPTEMBER 2000–REVISED NOVEMBER 2015
5 Pin Configuration and Functions
P and D Package
KC Package
8-Pin PDIP and SOIC
5-Pin TO-220
Top View
Top View
KTT Package
5-Pin DDPAK/TO-263
Top View
Pin Functions
PIN
NO. I/O DESCRIPTION
NAME
8 PINS 5 PINS
BW 1 1 I Bandwidth adjust pin
NC 2, 5, 8 – – No internal connection
V+ 7 5 I Positive power supply
V
IN
3 2 I Input
V
O
6 4 O Output
V– 4 3 I Negative power supply
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: BUF634
BUF634
SBOS030A –SEPTEMBER 2000–REVISED NOVEMBER 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
Supply voltage ±18 V
Input voltage ±V
S
Output short-circuit (to ground) Continuous
Operating temperature –40 125 °C
Junction temperature 150 °C
Lead temperature (soldering, 10 s) 300 °C
Storage temperature, T
stg
–55 125 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE UNIT
BUF634F in PDIP and SOIC Packages
V
(ESD)
Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2500 V
BUF634F in SOIC-8 Package Only
V
(ESD)
Electrostatic discharge, Charged-device model (CDM), per JEDEC specification JESD22-C101
(2)
±1000 V
BUF634F in TO-220 and DDPAK Packages
V
(ESD)
Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001
(1)
±2500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
±2.25 ±15 ±18
Vs = (V+) - (V-) Supply voltage V
(4.5) (30) (36)
T
A
Operating temperature -40 +25 +85 °C
6.4 Thermal Information
BUF634
THERMAL METRIC
(1)
PDIP SOIC TO-220 DDPAK-TO-263 UNIT
8 PINS 8 PINS 5 PINS 5 PINS
R
θJA
Junction-to-ambient thermal resistance 46.5 103.4 32.1 41.8 °C/W
R
θJC(top)
Junction-to-case (top) thermal resistance 34.8 44.2 25.6 45 °C/W
R
θJB
Junction-to-board thermal resistance 23.8 44.5 18.3 24.8 °C/W
ψ
JT
Junction-to-top characterization parameter 12 5.4 8.5 13.1 °C/W
ψ
JB
Junction-to-board characterization parameter 23.6 43.8 17.7 23.8 °C/W
R
θJC(bot)
Junction-to-case (bottom) thermal resistance n/a n/a 0.7 2.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953
4 Submit Documentation Feedback Copyright © 2000–2015, Texas Instruments Incorporated
Product Folder Links: BUF634
BUF634
www.ti.com
SBOS030A –SEPTEMBER 2000–REVISED NOVEMBER 2015
6.5 Electrical Characteristics
At T
A
= +25°C
(1)
, V
S
= ±15 V, specifications are for both low quiescent-current mode and wide-bandwidth mode unless
otherwise specified.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT
Offset Voltage ±30 ±100 mV
Offset Voltage vs Temperature Specified Temperature Range ±100 µV/°C
Offset Voltage vs Power Supply V
S
= ±2.25 V
(2)
to ±18 V 0.1 1 mV/V
Low Quiescent
±0.5 ±2
Current Mode
Input Bias Current V
IN
= 0V µA
Wide Bandwidth
±5 ±20
Mode
Low Quiescent
80 || 8
Current Mode
Input Impedance R
L
= 100 Ω MΩ || pF
Wide Bandwidth
8 || 8
Mode
Noise Voltage f = 10 kHz 4 nV/√Hz
GAIN
R
L
= 1 kΩ, V
O
= ±10 V 0.95 0.99
Gain R
L
= 100 Ω, V
O
= ±10 V 0.85 0.93 V/V
R
L
= 67 Ω, V
O
= ±10 V 0.8 0.9
OUTPUT
Current Output, Continuous ±250 mA
Positive I
O
= 10 mA (V+) –2.1 (V+) –1.7
Negative I
O
= –10 mA (V–) +2.1 (V–) +1.8
Positive I
O
= 100 mA (V+) –3 (V+) –2.4
Voltage Output V
Negative I
O
= –100 mA (V–) +4 (V–) +3.5
Positive I
O
= 150 mA (V+) –4 (V+) –2.8
Negative I
O
= –150 mA (V–) +5 (V–) +4
Low Quiescent Current Mode ±350 ±550
Short-Circuit Current mA
Wide Bandwidth Mode ±400 ±550
DYNAMIC RESPONSE
Low Quiescent
30
Current Mode
R
L
= 1 kΩ
Wide Bandwidth
180
Mode
Bandwidth, –3dB MHz
Low Quiescent
20
Current Mode
R
L
= 100 Ω
Low Quiescent
160
Current Mode
Slew Rate 20 Vp-p, R
L
= 100 Ω 2000 V/µs
0.1% 200
Settling Time 20-V Step, R
L
= 100 Ω ns
1% 50
Low Quiescent
4%
Current Mode
3.58 MHz, V
O
= 0.7 V,
Differential Gain
R
L
= 150 Ω
Wide Bandwidth
0.4%
Mode
Low Quiescent
2.5
Current Mode
3.58 MHz, V
O
= 0.7 V,
Differential Phase °
R
L
= 150 Ω
Wide Bandwidth
0.1
Mode
POWER SUPPLY
Specified Operating Voltage ±15 V
Operating Voltage Range ±2.25
(2)
±18 V
(1) Tests are performed on high speed automatic test equipment, at approximately 25°C junction temperature. The power dissipation of this
product will cause some parameters to shift when warmed up. SeeTypical Characteristics for over-temperature performance.
(2) Limited output swing available at low supply voltage. See Output voltage specifications.
Copyright © 2000–2015, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: BUF634
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