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TI-LM5050-2.pdf
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V
IN
V
OUT
GND
OFF
OUT
IN
GATE
LM5050-2
Shutdown
GND
GND
nFGD
Low= FET On, High= FET Off
+6V to +75V
Status
V
LOGIC
Low= OK, High= Fault
R
PULL-UP
LM5050-2
www.ti.com
SNVS679B –NOVEMBER 2010–REVISED MARCH 2013
LM5050-2 High Side OR-ing FET Controller
Check for Samples: LM5050-2
1
FEATURES
DESCRIPTION
The LM5050-2 High Side OR-ing FET Controller
2
• Wide Operating Input Voltage Range: +6V to
operates in conjunction with an external MOSFET as
+75V
an ideal diode rectifier when connected in series with
• +100 Volt Transient Capability
a power source. This OR-ing controller allows
• Charge Pump Gate Driver for External N-
MOSFETs to replace diode rectifiers in power
distribution networks thus reducing both power loss
Channel MOSFET
and voltage drops.
• MOSFET Diagnostic Test Mode
The LM5050-2 controller provides charge pump gate
• Fast 50ns Response to Current Reversal
drive for an external N-Channel MOSFET and a fast
• 2A Peak Gate Turn-off Current
response comparator to turn off the FET when
• Minimum V
DS
Clamp for Faster Turn-off
current flows in the reverse direction. The LM5050-2
can connect power supplies ranging from +6V to
• Package: SOT-6 (Thin SOT23-6)
+75V and can withstand transients up to +100V.
APPLICATIONS
The LM5050-2 also provides a FET test diagnostic
mode which allows the system controller to test for
• Active OR-ing of Redundant (N+1) Power
shorted MOSFETs.
Supplies
Typical Application Circuits
Figure 1. Full Application with MOSFET Diagnostic
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
OFF
GATE
OUT
IN
1
2
3
6
5
4
nFGD
GND
LM5050MK-2
PS1
PS2
IN
GATE
OUT
IN GATE OUT
R
LOAD
C
LOAD
LM5050-2
LM5050-2
GND
GND
LM5050-2
SNVS679B –NOVEMBER 2010–REVISED MARCH 2013
www.ti.com
Figure 2. Typical Redundant Supply Configuration
Connection Diagram
Figure 3. LM5050MK-2
SOT-6 Package (Top View)
PIN DESCRIPTIONS
Pin # Name Function
Open drain output for the FET Test circuit. Status pin used in
conjunction with the OFF test mode pin. When the OFF pin is in the
logic high state, an active low state on nFGD indicates that the forward
1 nFGD
voltage (from source to drain) of the external MOSFET is greater than
350 mV. The nFGD pin requires an external pull-up resistor to a voltage
not higher than 5.5V.
2 GND Ground return for the controller
FET Test Mode control input. Logic low or open state at the OFF pin
will deactivate the FET Test Mode. A logic high state at the OFF pin will
pull the GATE pin low and turn off the external MOSFET. If the body
3 OFF diode forward voltage of the MOSFET (from source to drain) is greater
than 350mV when the OFF pin is in the high state, the nFGD pin will
indicate that the MOSFET is not shorted by pulling to the active low
state.
Voltage sense connection to the external MOSFET Source pin and
4 IN
supply input to the internal charge pump.
5 GATE Connection to the external MOSFET Gate.
Voltage sense connection to the external MOSFET Drain pin and
6 OUT
supply pin for biasing the internal control circuitry.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM5050-2
LM5050-2
www.ti.com
SNVS679B –NOVEMBER 2010–REVISED MARCH 2013
Absolute Maximum Ratings
(1)(2)
IN, OUT Pins to Ground
(3)
-0.3V to 100V
GATE Pin to Ground
(3)
-0.3V to 100V
OFF Pin to Ground -0.3V to 7V
nFGD Pin to Ground (Off) -0.3V to 7V
Storage Temperature Range −65°C to 150°C
ESD
HBM
(4)
2 kV
MM
(5)
150V
Peak Reflow Temperature
(6)
260°C, 30sec
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including in-operability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Operating Range conditions indicate
the conditions at which the device is functional and the device should not be operated beyond such conditions. For specifications and
conditions, see Electrical Characteristics.
(3) The GATE pin voltage is typically 12V above the IN pin voltage when the LM5050-2 is enabled (i.e. OFF Pin is Open or Low, and V
IN
>
V
OUT
). Therefore, the Absolute Maximum Rating for the IN pin voltage applies only when the LM5050-2 is disabled (i.e. OFF Pin is logic
high), or for a momentary surge to that voltage since the Absolute Maximum Rating for the GATE pin is also 100V
(4) The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. Applicable test standard is
JESD-22-A114-C.
(5) The Machine Model (MM) is a 200 pF capacitor discharged through a 0Ω resistor (i.e. directly) into each pin. Applicable test standard is
JESD-A115-A.
(6) For soldering specifications visit www.ti.com.
Operating Ratings
(1)
IN, OUT Pins +6.0V to +75V
OFF Pin Voltage 0.0V to 5.5V
nFGD Voltage (Off) 0.0V to 5.5V
nFGD Sink Current (On) 0 mA to 1 mA
Junction Temperature Range (T
J
) −40°C to +125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur, including in-operability and degradation of
device reliability and/or performance. Functional operation of the device and/or non-degradation at the Absolute Maximum Ratings or
other conditions beyond those indicated in the Recommended Operating Conditions is not implied. Operating Range conditions indicate
the conditions at which the device is functional and the device should not be operated beyond such conditions. For specifications and
conditions, see Electrical Characteristics.
Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM5050-2
LM5050-2
SNVS679B –NOVEMBER 2010–REVISED MARCH 2013
www.ti.com
Electrical Characteristics
Limits in standard type are for T
J
= 25°C only; limits in boldface type apply over the operating junction temperature (T
J
)
range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical
values represent the most likely parametric norm at T
J
= 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: V
IN
= 12.0V, V
OUT
= 12.0V, V
OFF
= 0.0V, C
GATE
= 47 nF, and T
J
= 25°C.
Symbol Parameter Conditions Min Typ Max Unit
IN Pin
V
IN
Operating Supply Range 6.0 - 75.0 V
V
IN
= 6.0V
GATE = Open 180 240 300
V
OUT
= V
IN
- 100 mV
V
IN
= 12.0V
I
IN
IN Pin current GATE = Open 262 350 440 μA
V
OUT
= V
IN
- 100 mV
V
IN
= 75.0V
GATE = Open 275 355 460
V
OUT
= V
IN
- 100 mV
OUT Pin
V
IN
= 6.0V
74 95 115
V
OUT
= V
IN
- 100 mV
V
IN
= 12.0V
I
OUT
OUT Pin Current 70 110 160 uA
V
OUT
= V
IN
- 100 mV
V
IN
= 75.0V
35 125 265
V
OUT
= V
IN
- 100 mV
GATE Pin
V
IN
= 6.0V to 75V
I
GATE(ON)
GATE Pin Source Current V
GATE
= V
IN
18.0 32. 45.0 uA
V
OUT
= V
IN
- 175 mV
V
IN
= 6.0V
6.0 6.8 7.4
V
OUT
= V
IN
- 175 mV
V
IN
= 12.0V
V
GS
V
GATE
- V
IN
in Forward Operation
(1)
8.0 11.5 14.7 V
V
OUT
= V
IN
- 175 mV
V
IN
= 75.0V
8.0 11 14.5
V
OUT
= V
IN
- 175 mV
C
GATE
= 0
(2)
- 27 100
Gate Capacitance Discharge Time at
t
GATE(REV)
Forward to Reverse Transition C
GATE
= 10 nF
(2)
- 61 - ns
See Figure 4
C
GATE
= 47 nF
(2)
- 205 425
Gate Capacitance DischargeTime at
t
GATE(OFF)
OFF pin Low to High Transition C
GATE
= 47 nF
(3)
- 450 - ns
See Figure 5
V
GATE
= V
IN
+ 3V
I
GATE(OFF)
GATE Pin Sink Current V
OUT
> V
IN
+ 100 mV 1.9 2.8 - A
t ≤ 10ms
Reverse V
SD
Threshold
V
SD(REV)
V
IN
- V
OUT
-37 -27 -17 mV
V
IN
< V
OUT
ΔV
SD(REV)
Reverse V
SD
Hysteresis - 10 - mV
V
IN
= 6.0V
6 20 33
V
IN
- V
OUT
Regulated Forward V
SD
Threshold
V
SD(REG)
mV
V
IN
> V
OUT
V
IN
= 12.0V
2 16 31
V
IN
- V
OUT
(1) Measurement of V
GS
voltage (i.e. V
GATE
- V
IN
) includes 1 MΩ in parallel with C
GATE
(2) Time from V
IN
-V
OUT
voltage transition from 200mV to -500mV until GATE pin voltage falls to V
IN
+ 1V. See Figure 4
(3) Time from V
OFF
voltage transition from 0.0V to 5.0V until GATE pin voltage falls to V
IN
+ 1V. See Figure 5
4 Submit Documentation Feedback Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM5050-2
V
IN
- V
OUT
V
GATE
- V
IN
0.0V
1.0V
0 mV
V
SD(REV)
-500 mV
V
SD(REG)
200 mV
V
GATE
V
IN
> V
OUT
V
IN
< V
OUT
t
GATE(OFF)
LM5050-2
www.ti.com
SNVS679B –NOVEMBER 2010–REVISED MARCH 2013
Electrical Characteristics (continued)
Limits in standard type are for T
J
= 25°C only; limits in boldface type apply over the operating junction temperature (T
J
)
range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical
values represent the most likely parametric norm at T
J
= 25°C, and are provided for reference purposes only. Unless
otherwise stated the following conditions apply: V
IN
= 12.0V, V
OUT
= 12.0V, V
OFF
= 0.0V, C
GATE
= 47 nF, and T
J
= 25°C.
Symbol Parameter Conditions Min Typ Max Unit
OFF Pin
V
OUT
= V
IN
-500 mV
V
OFF(IH)
OFF Input High Threshold Voltage - 1.55 1.73
V
OFF
Rising
V
V
OUT
= V
IN
- 500 mV
V
OFF(IL)
OFF Input Low Threshold Voltage 1.09 1.41 -
V
OFF
Falling
ΔV
OFF
OFF Threshold Voltage Hysteresis V
OFF(IH)
- V
OFF(IL)
- 160 - mV
I
OFF
OFF Pin Internal Pull-down V
OFF
= 5.0V 2.0 5 8.0 µA
nFGD Pin
V
OFF
= 5V
FET Test Threshold Voltage
V
SD(TST)
V
OUT
= 12V 250 350 450 mV
V
IN
< V
OUT
V
IN
falling from 12V
ΔV
SD(TST)
FET Test Threshold Voltage Hysteresis - 95 - mV
nFGD Output Low Voltage V
OFF
= 5V
nFGD
VOL
- 630 850 mV
nFGD Output = On I
nFGD
= 1 mA Sinking
nFGD Output Leakage Current V
OFF
= 0V
nFGD
IOL
- 0.001 0.7 µA
nFGD Output = Off V
nFGD
= 5.5V
Figure 4. Gate Off Timing for Forward to Reverse Transition
Copyright © 2010–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM5050-2
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