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扩展I/O功能的PCA9554
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具有中断输出和配置寄存器的 PCA9554 远程 8 位 I2C 和 SMBus I/O 扩展器
1 特性
• I
2
C 至并行端口扩展器
• 开漏电路低电平有效中断输出
• 2.3 V 至 5.5V 的工作电源电压范围
• 耐受 5V 电压的 I/O
• 400kHz 快速 I
2
C 总线
• 3 个硬件地址引脚可在 I
2
C/SMBus 上支持最多 8 个
器件
• 输入/输出配置寄存器
• 极性反转寄存器
• 内部加电复位
• 所用通道在加电时被配置为输入
• 在加电时无毛刺脉冲
• 针对直接驱动 LED 的具有高电流驱动最大能力的锁
存输出
• 锁断性能超过 100mA,符合 JESD 78 II 类规范的
要求)
• ESD 保护性能超过 JESD 22 规范要求
– 2000V 人体放电模型 (A114-A)
– 200V 机器放电模型 (A115-A)
– 1000V 带电器件模型 (C101)
2 说明
这个用于两线双向总线 (I2C) 的 8 位 I/O 扩展器设计用
于在 2.3V 至 5.5V VCC 之间运行。通过 I
2
C 接口 [串
行时钟 (SCL),串行数据 (SDA)],它为大多数微控制
器系列产品提供通用远程 I/O 扩展。
PCA9554 包含一个 8 位配置(输入或输出可选)、输
入、输出和极性反转(高电平有效或低电平有效)寄存
器。加电时,I/O 被配置为到 V
CC
的弱上拉输入。但
是,系统主控制器可以通过写入 I/O 配置位将 I/O 启用
为输入或输出。每个输入或输出的数据均保存在相应的
输入或输出寄存器中。输入端口寄存器的极性可借助极
性反转寄存器进行转换。所有寄存器都可由系统主控器
读取。
发生超时或其他不当操作时,系统主控器可通过使用上
电复位功能,将寄存器置于其默认状况并初始化 I2C/
SMBus 状态机来复位 PCA9554。
PCA9554 开漏中断 (INT) 输出在任意输入状态与其对
应的输入端口寄存器状态不同时被激活,并用于向系统
主控器指明输入状态已改变。
器件信息
(1)
器件型号 封装
封装尺寸(标称值)
PCA9554
SSOP (16) 6.20mm x 5.30mm
VQFN (16) 4.00mm x 4.00mm
四方扁平无引线
(QFN) (16)
3.00mm × 3.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
A1
A2
P0
P1
P2
P3
GND
V
CC
SDA
SCL
INT
P7
P6
P5
P4
RGV PACKAGE
(TOP VIEW)
16
6 8
2
10
P7
P5
V
CC
4
3
1
75
12
11
9
131415
SDA
A0
A1
P6
INT
SCL
P3
GND
P4
A2
P0
P1
P2
RGT PACKAGE
(TOP VIEW)
SDA
16
6 8
2
10 P7
P5
V
CC
4
3
1
75
12
11
9
131415
A0
A1
P6
INT
SCL
P3
GND
P4
A2
P0
P1
P2
PCA9554
ZHCSNJ2D – JULY 2006 – REVISED MARCH 2021
本文档旨在为方便起见,提供有关 TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SCPS128
Table of Contents
1 特性................................................................................... 1
2 说明................................................................................... 1
3 Revision History.............................................................. 2
4 Description (Continued)..................................................3
5 Pin Configuration and Functions...................................4
6 Specifications.................................................................. 5
6.1 Absolute Maximum Ratings........................................ 5
6.2 ESD Ratings............................................................... 5
6.3 Recommended Operating Conditions.........................5
6.4 Thermal Information....................................................6
6.5 Electrical Characteristics.............................................6
6.6 I
2
C Interface Timing Requirements.............................8
6.7 Switching Characteristics............................................8
6.8 Typical Characteristics................................................9
7 Parameter Measurement Information.......................... 11
8 Detailed Description......................................................14
8.1 Functional Block Diagram......................................... 14
8.2 Device Functional Modes..........................................15
8.3 Programming............................................................ 16
9 Application Information Disclaimer............................. 22
9.1 Application Information............................................. 22
10 Power Supply Recommendations..............................24
10.1 Power-On Reset Requirements.............................. 24
11 Device and Documentation Support..........................26
11.1 Receiving Notification of Documentation Updates.. 26
11.2 Support Resources................................................. 26
11.3 Trademarks............................................................. 26
11.4 Electrostatic Discharge Caution.............................. 26
11.5 Glossary.................................................................. 26
12 Mechanical, Packaging, and Orderable
Information.................................................................... 26
3 Revision History
Changes from Revision C (May 2021) to Revision D (March 2021) Page
• Moved the "Storage temperature range" to the Absolute Maximum Ratings .................................................... 5
• Moved the "Package thermal impedance" to the Thermal Resistance Characteristic .......................................5
• Changed the V
IH
High-level input voltage (SDL, SDA) Max value From: 5.5 V To: V
CC
in the Recommended
Operating Conditions ......................................................................................................................................... 5
• Changed the V
IH
High-level input voltage (A0, A1, A2, P7–P0) MIN value From: 5.5 V To: 0.7 x V
CC
in the
Recommended Operating Conditions ................................................................................................................5
• Changed the V
IL
Low-level input voltage (A0, A1, A2, P7–P0) MAX value From: 0.8 V To: 0.3 x V
CC
in the
Recommended Operating Conditions ................................................................................................................5
• Added the Thermal Information table................................................................................................................. 6
• Changed V
PORR
in the Electrical Characteristics ...............................................................................................6
• Added V
PORF
to the Electrical Characteristics ................................................................................................... 6
• Changed the I
CC
Standby mode values in the Electrical Characteristics ...........................................................6
• Changed the C
i
SCL Max value From: 5 pF To: 8 pF in the Electrical Characteristics ......................................6
• Changed the C
io
SDA Max value From: 6.5 pF To: 9.5 pF in the Electrical Characteristics ..............................6
• Changed the t
pv
Output data valid MAX values From: 200 ns To 350 ns in the Swirtching Characteristics ...... 8
• Changed the Typical Characteristics graphs...................................................................................................... 9
• Changed the Power Supply Recommendations .............................................................................................. 24
Changes from Revision B (August 2008) to Revision C (May 2014) Page
• Added Interrupt Errata section..........................................................................................................................16
PCA9554
ZHCSNJ2D – JULY 2006 – REVISED MARCH 2021
www.ti.com.cn
2 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: PCA9554
4 Description (Continued)
INT can be connected to the interrupt input of a microcontroller. By sending an interrupt signal on this line, the
remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via
the I
2
C bus. Thus, the PCA9554 can remain a simple slave device.
The device's outputs (latched) have high-current drive capability for directly driving LEDs and low current
consumption.
Three hardware pins (A0, A1, and A2) are used to program and vary the fixed I
2
C address and allow up to eight
devices to share the same I
2
C bus or SMBus.
The PCA9554 is pin-to-pin and I
2
C address compatible with the PCF8574. However, software changes are
required, due to the enhancements in the PCA9554 over the PCF8574.
The PCA9554 and PCA9554A are identical except for their fixed I
2
C address. This allows for up to 16 of these
devices (eight of each) on the same I
2
C/SMBus.
www.ti.com.cn
PCA9554
ZHCSNJ2D – JULY 2006 – REVISED MARCH 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: PCA9554
5 Pin Configuration and Functions
DB, DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
A0
A1
A2
P0
P1
P2
P3
GND
V
CC
SDA
SCL
INT
P7
P6
P5
P4
RGV PACKAGE
(TOP VIEW)
16
6 8
2
10
P7
P5
V
CC
4
3
1
75
12
11
9
131415
SDA
A0
A1
P6
INT
SCL
P3
GND
P4
A2
P0
P1
P2
RGT PACKAGE
(TOP VIEW)
SDA
16
6 8
2
10 P7
P5
V
CC
4
3
1
75
12
11
9
131415
A0
A1
P6
INT
SCL
P3
GND
P4
A2
P0
P1
P2
表 5-1. Pin Functions
PIN
DESCRIPTION
NAME
QSOP (DBQ)
SOIC (DW),
SSOP (DB),
TSSOP (PW), AND
TVSOP (DGV)
QFN (RGT) AND
QFN (RGV)
A0 1 15 Address input. Connect directly to V
CC
or ground.
A1 2 16 Address input. Connect directly to V
CC
or ground.
A2 3 1 Address input. Connect directly to V
CC
or ground.
P0 4 2 P-port input/output. Push-pull design structure.
P1 5 3 P-port input/output. Push-pull design structure.
P2 6 4 P-port input/output. Push-pull design structure.
P3 7 5 P-port input/output. Push-pull design structure.
GND 8 6 Ground
P4 9 7 P-port input/output. Push-pull design structure.
P5 10 8 P-port input/output. Push-pull design structure.
P6 11 9 P-port input/output. Push-pull design structure.
P7 12 10 P-port input/output. Push-pull design structure.
INT 13 11 Interrupt output. Connect to V
CC
through a pullup resistor.
SCL 14 12 Serial clock bus. Connect to V
CC
through a pullup resistor.
SDA 15 13 Serial data bus. Connect to V
CC
through a pullup resistor.
V
CC
16 14 Supply voltage
PCA9554
ZHCSNJ2D – JULY 2006 – REVISED MARCH 2021
www.ti.com.cn
4 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: PCA9554
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN MAX UNIT
V
CC
Supply voltage range
–0.5
6 V
V
I
Input voltage range
(2)
–0.5
6 V
V
O
Output voltage range
(2)
–0.5
6 V
I
IK
Input clamp current V
I
< 0
–20
mA
I
OK
Output clamp current V
O
< 0
–20
mA
I
IOK
Input/output clamp current V
O
< 0 or V
O
> V
CC
±20 mA
I
OL
Continuous output low current V
O
= 0 to V
CC
50 mA
I
OH
Continuous output high current V
O
= 0 to V
CC
–50
mA
I
CC
Continuous current through GND
–250
mA
Continuous current through V
CC
160 mA
T
stg
Storage temperature range
–65
150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
6.2 ESD Ratings
MIN MAX UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins
(1)
0 2000
V
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins
(2)
0 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN MAX UNIT
V
CC
Supply voltage 2.3 5.5 V
V
IH
High-level input voltage
SCL, SDA 0.7 × V
CC
V
CC
(1)
V
A2–A0, P7–P0
2 V
CC
V
IL
Low-level input voltage
SCL, SDA
–0.5
0.3 × V
CC
V
A2–A0, P7–P0 –0.5
0.3 × V
CC
I
OH
High-level output current
P7–P0 –10
mA
I
OL
Low-level output current
P7–P0
25 mA
T
A
Operating free-air temperature
–40
85 °C
(1) For voltages applied above V
CC
, an increase in ICC will result.
www.ti.com.cn
PCA9554
ZHCSNJ2D – JULY 2006 – REVISED MARCH 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: PCA9554
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