BES2500-Y Product Specification Rev 0.10
Bluetooth Audio Platform for TWS, Open-type
Adaptive ANC and AI Voice Application
Confidential and Proprietary –Bestechnic (Shanghai) Co., Ltd.
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BES2500-Y Product Specification
Rev 0.10 Page2 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.
Datasheet Status
Datasheet Status
Product Status
Revision Control
Description
Draft
Development
Rev 0.01 - 0.49
Datasheets contain pre-tapeout information from the objective design
specification and is only for internal use.
Preliminary
Qualification
Rev 0.50 - 0.99
Datasheets contain information on post-tapeout and pre-volume
production products, and a revision of this document or supplementary
information may be published at a later date. BESTECHNIC may make
changes to these specifications at any time without notice.
Released
Production
Rev1.xx
Datasheets contain information on volume production products.
BESTECHNIC may make changes to these specifications at any time
without notice.
Revision History
Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The
following table lists the technical content changes for all revisions.
Revision
Date
Description
0.10
28/05/2020
Initial definition
BES2500-Y Product Specification
Rev 0.10 Page3 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.
Table of contents
List of Tables ......................................................................................................................................................................... 4
List of Figures ........................................................................................................................................................................ 4
1 General Description ...............................................................................................................................................5
1.1 Applications ............................................................................................................................................................ 5
1.2 Features .................................................................................................................................................................. 6
2 Platform Feature ....................................................................................................................................................7
2.1 MCU Subsystem ...................................................................................................................................................... 7
2.2 Memory .................................................................................................................................................................. 7
2.3 System Peripherals.................................................................................................................................................. 8
2.4 Power Management ............................................................................................................................................... 8
2.5 Audio Interface ....................................................................................................................................................... 8
3 Bluetooth Modem Description ............................................................................................................................. 10
3.1 Radio ..................................................................................................................................................................... 10
3.2 Auxiliary feature .................................................................................................................................................... 10
3.3 Bluetooth Stack ..................................................................................................................................................... 10
4 Electrical Characteristics ...................................................................................................................................... 11
4.1 Electrical Characteristics ....................................................................................................................................... 11
4.2 Bluetooth Radio Electrical Characteristics ............................................................................................................ 11
4.3 Audio Codec Electrical Characteristics .................................................................................................................. 15
4.4 BUCK Electrical Characteristics ............................................................................................................................. 16
5 Pin Map & Application Schematic ........................................................................................................................ 17
5.1 Pin Description ...................................................................................................................................................... 17
6 Package Dimensions ............................................................................................................................................ 20
6.1 BGA Dimensions .................................................................................................................................................... 20
7 SMT Caution ........................................................................................................................................................ 21
7.1 Land Pad and Stencil Design ................................................................................................................................. 21
7.2 Solder Reflow Profile ............................................................................................................................................ 21
7.3 RoHS Compliant .................................................................................................................................................... 22
7.4 ESD Sensitivity ....................................................................................................................................................... 22
7.5 Storage Alert ......................................................................................................................................................... 22
8 Ordering Information ........................................................................................................................................... 23
9 Tape and Reel Information ................................................................................................................................... 24
9.1 Tape Orientation ................................................................................................................................................... 24
9.2 Reel Dimensions .................................................................................................................................................... 24
9.3 Tape Dimensions ................................................................................................................................................... 25
9.4 Moisture Sensitivity Level ..................................................................................................................................... 25
BES2500-Y Product Specification
Rev 0.10 Page4 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.
List of Tables
Table 4-1 Operating Conditions
(a)
.............................................................................................................................. 11
Table 4-2 Absolute Maximum Ratings
(c)
..................................................................................................................... 11
Table 4-3 Power Consumption
(a)
................................................................................................................................ 11
Table 4-4 Receiver Characteristics - Basic Data Rate
(a)
.............................................................................................. 11
Table 4-5 Transmitter Characteristics - Basic Data Rate
(a)
......................................................................................... 12
Table 4-6 Receiver Characteristics - Enhanced Data Rate
(a)
....................................................................................... 13
Table 4-7 Transmitter Characteristics - Enhanced Data Rate
(a)
.................................................................................. 13
Table 4-8 Bluetooth LE Receiver Specifications .......................................................................................................... 14
Table 4-9 Bluetooth LE Transmitter Specifications ..................................................................................................... 14
Table 4-10 Digital to Analogue Converter under 1.95V
(b)
.......................................................................................... 15
Table 4-11 Codec - Analogue to Digital Converter under 1.95V ................................................................................. 15
Table 5-1 BES2500-Y Pins Description ........................................................................................................................ 17
Table 7-1 Package peak reflow temperature - Sn/Pb ................................................................................................. 21
Table 7-2 Package peak reflow temperature - Pb-Free
(a)
........................................................................................... 21
Table 7-3 Solder Reflow Profile Feature ..................................................................................................................... 22
List of Figures
Figure 1-1 BES2500-Y Top View .................................................................................................................................... 5
Figure 2-1 Platform Architecture .................................................................................................................................. 7
Figure 5-1 BES2500-Y Dimension ................................................................................................................................ 17
Figure 6-1 BES2500-Y Dimension ................................................................................................................................ 20
Figure 7-1 Solder Reflow Profile ................................................................................................................................. 21
Figure 9-1 Tape Orientation ........................................................................................................................................ 24
Figure 9-2 Reel Dimensions (All dimensions in millimeters) ....................................................................................... 24
Figure 9-3 Tape Dimensions (All dimensions in millimeters) ...................................................................................... 25
BES2500-Y Product Specification
Rev 0.10 Page5 / 25 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.
1 General Description
BES2500-Y is a highly integrated SoC which features dual-core ARM Cortex-M33 Star
1
Processor and 1056KB SRAM for
wireless audio and voice application. It also uses patented IBRT (Intelligent Bluetooth Retransmission) technology to
achieve low latency and robust TWS application. IBRT is BES Patented snoop plus relay technology to implement
synchronous connection between mobile phone, primary and secondary earbud. Besides, BES2500-Y supports open-type
adaptive ANC (Active noise cancellation) and AI voice.
BES2500-Y minimize the external components and BOM cost by highly integrating RF transceiver, high performance Audio
Codec and cap-less headphone driver. It also integrates serial flash and powerful Cortex-M33 Star MCU to support various
software features and product customization. BES2500-Y is manufactured with advanced low power CMOS process and
assembled with a 4.5*6.2mm 80-ball BGA package.
FLASH
ROM
/RAM
Storage
Peripheral
DC/DC
LDO
CRYSTAL
BT
MAC/PHY
BT_RF
CODEC
DIG
DAC_L
DAC_R
ANC
ADC
MCU
(Dual Core)
Figure 1-1 BES2500-Y Top View
1.1 Applications
Open-type adaptive ANC headphones
High-end Full Wireless headset
High-end Bluetooth headset
Smart BT/WIFI music box
BT boom box
Other portable audio device
IOT platform
1. STAR is a Cortex-M33 compatible CPU.
- 1
- 2
- 3
- 4
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