1. Sensor Overview ............................................................................ 3
1.1 General Description .................................................................................... 3
1.2 Features........................................................................................................ 3
1.3 Application ................................................................................................... 4
1.4 Technical Specifications ............................................................................. 4
2. Block Diagram ................................................................................. 5
2.1 Block Diagram ............................................................................................. 5
2.2 Pin Diagram ................................................................................................. 6
2.3 Signal Descriptions ..................................................................................... 6
3. Optical Specifications ................................................................... 8
3.1 Sensor Array Center ................................................................................... 8
3.2 Pixel Array .................................................................................................... 9
3.3 Lens Chief Ray Angle (CRA) .................................................................... 10
3.4 Color Filter Spectral Characteristics ....................................................... 11
4. Two-wire Serial Bus Communication ................................... 11
4.1 Protocol ...................................................................................................... 11
4.2 Serial Bus Timing ...................................................................................... 12
5. Applications ................................................................................... 13
5.1 DVP Timing ................................................................................................ 13
5.2 MIPI ............................................................................................................ 14
5.2.1 Clock lane low-power…………………………………………….14
5.2.2 Data Burst…………………………………………………………15
5.3 Power On/Off Sequence .......................................................................... 16
5.3.1 Power On Sequence……………………………………………...16
5.3.2 Power Off Sequence……………………………………………...16
5.4 DC Parameters .......................................................................................... 17
6. Package Specification ................................................................ 18
7. Register List ...................................................... 错误!未定义书签。
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