索尼蓝牙主板芯片BES2000-IZ_Datasheet_v0.18.pdf

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1 General Description 2 Platform Feature 3BLUETOOTH MODEM DESCRIPTION 4 Electrical Characteristics 5 Pin Map & Application Schematic 6 Package Dimensions 7 SMT Caution 8 Ordering Information 9 Tape and Reel Information 【索尼蓝牙主板芯片BES2000-IZ】是一款由Bestechnic（上海）有限公司设计的高性能蓝牙音频系统级芯片（SoC），专为实现高质量无线音频体验而设计。该芯片集成了蓝牙调制解调器和FWS（Fully Wireless Stereo）技术，FWS是Bestechnic开发的一种立体声连接方案，用于主次Voice Box之间的无损音频传输，以创建无线立体声系统。文档中提及的几个关键部分如下： 1. **General Description**：这部分通常会概述BES2000-IZ的主要功能和设计理念，可能包括其对蓝牙标准的支持（如蓝牙5.0或更高版本），以及其在音频处理、功耗控制、连接稳定性和兼容性方面的特性。 2. **Platform Feature**：这一部分会详细介绍芯片的平台特性，比如集成的音频编解码器、数字信号处理器（DSP）、电源管理单元等，以及它们如何协同工作以提供出色的音频性能。 3. **BLUETOOTH MODEM DESCRIPTION**：蓝牙调制解调器的描述会涵盖其工作频率、传输速率、抗干扰能力以及与其他蓝牙设备的互操作性。可能还会讨论低功耗模式以延长电池寿命。 4. **Electrical Characteristics**：这部分列出了芯片在各种工作条件下的电气参数，包括电压、电流、输入/输出电平、功耗等，这些数据对于系统设计者来说至关重要，以确保芯片能在目标应用中正确运行。 5. **Pin Map & Application Schematic**：引脚映射和应用电路图提供了连接芯片到外部元件的指南，包括天线、电源、音频接口、控制信号等。这对于硬件设计人员布局PCB板时非常重要。 6. **Package Dimensions**：封装尺寸信息包含芯片的实际物理尺寸，有助于制造商在生产过程中进行正确的封装和组装。 7. **SMT Caution**：表面安装技术（SMT）注意事项提供了焊接和组装过程中的指导，以避免损坏芯片和影响性能。 8. **Ordering Information**：订购信息会列出不同版本的芯片及其对应的代码，以及如何联系Bestechnic购买产品。 9. **Tape and Reel Information**：这是关于芯片批量运输的包装信息，通常采用卷盘（tape）和卷轴（reel）方式，便于自动化生产线上的拾取和放置操作。此芯片的 datasheet 版本号0.18表明它可能处于"Preliminary Qualification"阶段，即在批量生产前的后期验证阶段，意味着Bestechnic可能根据测试结果和用户反馈对规格进行调整，而不预先通知。 BES2000-IZ是一款专为无线音频设备设计的高级蓝牙主板芯片，结合了先进的音频处理能力和FWS技术，适用于真无线耳机、智能扬声器以及其他蓝牙音频设备的开发。其详细的技术规格和电气特性使得它能够满足高音质、低延迟和可靠连接的需求。

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BES2000-IZ

BLUETOOTH AUDIO SOC WITH BES FWS*

PRODUCT SPECIFICATION REV 0.18

* FWS: Fully Wireless Stereo, BES’s stereo connection between primary and secondary Voice Box.

Bestechnic (Shanghai) Co.,Ltd.

Room 1104, Tower E, ChamtimePlaza, Lane 2889 Jinke Road,

Pudong New District, Shanghai 201203, China

PHONE: (86)21 6886 7870

FAX: (86)21 6886 7870 - 617

Confidential and Proprietary – Bestechnic (Shanghai) Co, Ltd.

DISCLAIMER:

No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical,

including photocopying and recording, for any purpose, without the express written permission of Bestechnic. Bestechnic

retains the right to make changes to this document at any time, without notice. Bestechnic makes no warranty of any

kind, expressed or implied, with regard to any information contained in this document, including, but not limited to, the

implied warranties of merchantability or fitness for any particular purpose. Further, Bestechnic does not warrant the

accuracy or completeness of the information, text, graphics, or other items contained within this document.

BES2000-IZ Product Specification

Rev 0.18 Page3 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

TABLE OF CONTENTS

Datasheet Status ................................................................................................................................................................... 2

Revision History .................................................................................................................................................................... 2

List of Tables and figures ...................................................................................................................................................... 5

1 General Description ...................................................................................................................................................... 6

1.1 Features ........................................................................................................................................................... 6

1.2 Applications ..................................................................................................................................................... 7

2 Platform Feature ........................................................................................................................................................... 8

2.1 MCU Subsystem ............................................................................................................................................... 8

2.2 Memory ........................................................................................................................................................... 8

2.3 System Peripherals........................................................................................................................................... 9

2.4 Power Management ........................................................................................................................................ 9

2.5 Audio Interface .............................................................................................................................................. 10

3 Bluetooth Modem Description ................................................................................................................................... 11

3.1 Radio .............................................................................................................................................................. 11

3.2 Auxiliary feature ............................................................................................................................................. 11

3.3 Bluetooth Stack .............................................................................................................................................. 11

4 Electrical Characteristics ............................................................................................................................................. 12

4.1 Electrical Characteristics ................................................................................................................................ 12

4.2 Bluetooth Radio Electrical Characteristics ..................................................................................................... 12

4.3 Audio Codec Electrical Characteristics ........................................................................................................... 15

4.4 BUCK Electrical Characteristics ...................................................................................................................... 17

5 Pin Map & Application Schematic ............................................................................................................................... 18

5.1 Pin Description ............................................................................................................................................... 18

5.2 Application Schematic .................................................................................................................................... 21

6 Package Dimensions ................................................................................................................................................... 22

6.1 BGA Dimensions ............................................................................................................................................. 22

7 SMT Caution ................................................................................................................................................................ 23

7.1 Land Pad and Stencil Design .......................................................................................................................... 23

BES2000-IZ Product Specification

Rev 0.18 Page5 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd

LIST OF TABLES AND FIGURES

Table 4-1 DC Electrical Specification (Recommended Operation Conditions) ............................................................ 12

Table 4-2 DC Electrical Specification (Absolute Maximum Ratings) ........................................................................... 12

Table 4-3 Power Consumption (VBAT 3.8V DCDC mode) ........................................................................................... 12

Table 4-4 Receiver Characteristics - Basic Data Rate (VBAT = 3.8 V, TA = 27°C, unless otherwise specified) ............ 12

Table 4-5 Transmitter Characteristics - Basic Data Rate (VBAT = 3.8V, TA = 27 °C, unless otherwise specified) ....... 13

Table 4-6 Receiver Characteristics - Enhanced Data Rate (VBAT = 3.8 V, TA = 27°C, unless otherwise specified) ..... 13

Table 4-7 Transmitter Characteristics - Enhanced Data Rate (VBAT = 3.8 V, TA = 27°C, unless otherwise specified) 14

Table 4-8 Codec – Digital to Analogue Converter under 2.5V (high performance) .................................................... 15

Table 5-1 BES2000-IZ Pins Description ....................................................................................................................... 18

Table 7-1 PACKAGE PEAK REFLOW TEMPERATURE - Sn/Pb ....................................................................................... 23

Table 7-2 PACKAGE PEAK REFLOW TEMPERATURE - Pb-FREE .................................................................................... 24

Table 7-3 Solder Reflow Profile Feature ..................................................................................................................... 24

Figure 1-1 BES2000-IZ Top View ................................................................................................................................... 6

Figure 2-1 Platform Architecture .................................................................................................................................. 8

Figure 5-1 BES2000-IZ Pins .......................................................................................................................................... 18

Figure 6-1 BES2000-IZ Dimension ............................................................................................................................... 22

Figure 7-1 Solder Reflow Profile ................................................................................................................................. 23

Figure 9-1 Tape Orientation ........................................................................................................................................ 27

Figure 9-2 Reel Dimensions (All dimensions in millimeters) ....................................................................................... 27

Figure 9-3 Tape Dimensions (All dimensions in millimeters) ...................................................................................... 28