BES2000-IX
BLUETOOTH AUDIO PLATFORM WITH ANC
PRODUCT SPECIFICATION REV 0.10
Bestechnic (Shanghai) Co., Ltd
Room 1104, Tower E, ChamtimePlaza, Lane 2889 Jinke Road,
Pudong New District, Shanghai 201203, China
PHONE: (86)21 6886 7870
FAX: (86)21 6886 7870 -617
Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
DISCLAIMER:
No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical,
including photocopying and recording, for any purpose, without the express written permission of Bestechnic. Bestechnic
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implied warranties of merchantability or fitness for any particular purpose. Further, Bestechnic does not warrant the
accuracy or completeness of the information, text, graphics, or other items contained within this document.
BES2000-IX Product Specification
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DATASHEET STATUS
Status description.
Datasheet Status
Product Status
Revision Control
Description
Draft
Development
Rev 0.01 - 0.49
Datasheets contain pre-tapeout information from the objective design
specification and is only for internal use.
Preliminary
Qualification
Rev 0.50 - 0.99
Datasheets contain information on post-tapeout and pre-volume
production products, and a revision of this document or supplementary
information may be published at a later date. BESTECHNIC may make
changes to these specifications at any time without notice.
Released
Production
Rev1.xx
Datasheets contain information on volume production products.
BESTECHNIC may make changes to these specifications at any time
without notice.
REVISION HISTORY
Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The
following table lists the technical content changes for all revisions.
Revision
Date
DESCRIPTION
0.10
20/11/2017
Initial definition
BES2000-IX Product Specification
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TABLE OF CONTENTS
Datasheet Status ................................................................................................................................................................... 2
Revision History .................................................................................................................................................................... 2
1 General Description ...................................................................................................................................................... 6
1.1 Features ........................................................................................................................................................... 6
1.2 Applications ..................................................................................................................................................... 7
2 Platform Feature .......................................................................................................................................................... 8
2.1 MCU Subsystem ............................................................................................................................................... 8
2.2 Memory ........................................................................................................................................................... 8
2.3 System Peripherals........................................................................................................................................... 9
2.4 Debug Function ................................................................................................................................................ 9
2.5 Power Management ........................................................................................................................................ 9
3 Bluetooth Modem Description ................................................................................................................................... 11
3.1 Radio .............................................................................................................................................................. 11
3.2 Auxiliary feature ............................................................................................................................................. 11
3.3 Bluetooth Stack .............................................................................................................................................. 11
4 Electrical Characteristics ............................................................................................................................................. 12
4.1 Bluetooth Electrical Characteristics ............................................................................................................... 12
4.2 Bluetooth Radio Electrical Characteristics ..................................................................................................... 12
4.3 Audio Codec Electrical Characteristics ........................................................................................................... 15
4.4 BUCK Electrical Characteristics ...................................................................................................................... 17
5 Pin Map & Application Schematic .............................................................................................................................. 18
5.1 Pin Description ............................................................................................................................................... 18
5.2 Application Schematic .................................................................................................................................... 20
6 Package Dimensions ................................................................................................................................................... 21
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6.1 BGA Dimensions ............................................................................................................................................. 21
7 SMT Caution ............................................................................................................................................................... 22
7.1 Land Pad and Stencil Design .......................................................................................................................... 22
7.2 Solder Reflow Profile...................................................................................................................................... 22
7.3 RoHS Compliant ............................................................................................................................................. 23
7.4 ESD Sensitivity ................................................................................................................................................ 23
7.5 Storage Alert .................................................................................................................................................. 23
8 Ordering Information ................................................................................................................................................. 24
9 Tape and Reel Information ......................................................................................................................................... 25
9.1 Tape Orientation ............................................................................................................................................ 25
9.2 Reel Dimensions ............................................................................................................................................. 25
9.3 Tape Dimensions ............................................................................................................................................ 26
9.4 Moisture Sensitivity Level .............................................................................................................................. 26
LIST OF TABLES AND FIGURES
Table 4-1 DC Electrical Specification (Recommended Operation Conditions) ............................................................ 12
Table 4-2 DC Electrical Specification (Absolute Maximum Ratings) ........................................................................... 12
Table 4-3Power Consumption (VBAT 3.8V DCDC mode) ............................................................................................ 12
Table 4-4 Receiver Characteristics - Basic Data Rate (VBAT = 3.8 V, TA = 27°C, unless otherwise specified) ............ 13
Table 4-5 Transmitter Characteristics - Basic Data Rate (VBAT = 3.8V, TA = 27 °C, unless otherwise specified) ....... 13
Table 4-6 Receiver Characteristics - Enhanced Data Rate (VBAT = 3.8 V, TA = 27°C, unless otherwise specified) ..... 13
Table 4-7 Transmitter Characteristics - Enhanced Data Rate (VBAT = 3.8 V, TA = 27°C, unless otherwise specified) 14
Table 4-8 Codec – Digital to Analogue Converter under 2.5V (high performance) .................................................... 15
Table 5-1 BES2000-IX 74-Balls Description ................................................................................................................. 18
Table 7-1PACKAGE PEAK REFLOW TEMPERATURE - Sn/Pb ........................................................................................ 22
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Table 7-2 PACKAGE PEAK REFLOW TEMPERATURE - Pb-FREE .................................................................................... 23
Table 7-3 Solder Reflow Profile Feature ..................................................................................................................... 23
Figure 1-1 BES2000-IX Top View ................................................................................................................................... 6
Figure 2-1 Platform Architecture .................................................................................................................................. 8
Figure 5-1 BES2000-IX 74-Balls ................................................................................................................................... 18
Figure 6-1 BES2000-IX 74-ball Dimension ................................................................................................................... 21
Figure 7-1 Solder Reflow Profile ................................................................................................................................. 22
Figure 9-1 Tape Orientation ........................................................................................................................................ 25
Figure 9-2 Reel Dimensions (All dimensions in millimeters) ....................................................................................... 25
Figure 9-3 Tape Dimensions (All dimensions in millimeters) ...................................................................................... 26
