SEMI E1-0697 © SEMI 1979, 2003 1
SEMI E1-0697 (Reapproved 1102)
E
SPECIFICATION FOR 3 inch, 100 mm, 125 mm, AND 150 mm PLASTIC
AND METAL WAFER CARRIERS
This specification was technically approved by the Global Physical Interfaces and Carriers Committee and is
the direct responsibility of the North American Physical Interfaces and Carriers Committee. Current edition
approved by the North American Physical Interfaces and Carriers Committee on July 21, 2002. Initially
available at www.semi.org October 2002; to be published November 2002. Orignally published in 1979;
previously published June 1997.
E The designation of SEMI E1 was updated during the 0303 publishing cycle to reflect the editorial
modification of SEMI E1.5 via PIP form.
1 Scope
1.1 This specification covers the dimensional
requirements for plastic and metal wafer carriers used
for the processing and handling of 3 inch, 100 mm, 125
mm, and 150 mm diameter wafers. The specification
has two classifications: General Usage and Auto
Transport Usage. General Usage is a basic guideline
that covers 3 inch, 100 mm, 125 mm, and 150 mm
wafer sizes. Auto Transport Usage is intended to meet
the in-use requirements for the interface of wafer
carriers with automated wafer processing equipment.
Auto Transport Usage covers the 125 mm and 150 mm
sizes.
1.2 To meet these specifications, carriers must be
manufactured within the dimensional limits and be
dimensionally stable within the specification when used
in accordance with manufacturers’ recommendations.
1.3 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety health practices and determine the
applicability or regulatory limitations prior to use.
NOTE 1: Recommended usage should be agreed to between
user and supplier, since wafer carriers are manufactured from
a number of different materials by several manufacturing
methods.
2 Terminology
2.1 For a pictorial explanation of most of the selected
definitions, see Figure 1. Figure 1 symbols are defined
in Table 1.
2.2 Definitions
2.2.1 bar — (See “crossbar.”)
2.2.2 bar end — The end surface of the carrier that has
only one crossbar.
2.2.3 bar radius — The radius nearest the bar end of
the carrier on the crossbar. (See Figure 1, D5b, Type
II.)
2.2.4 bar web — The mass of material for structural
support which may or may not be present on the
crossbar. (See Figure 1, D5a, Type II.)
2.2.5 bar width — The distance or thickness of the bar
when measured perpendicular to the top face. (See
Figure 1, D5b.)
2.2.6 cassette — (See “wafer carrier.”)
2.2.7 crossbar — The mass of material connecting the
two sides of the carrier at the bar end of the carrier.
2.2.8 edge perimeter distance — The distance from the
edge of the wafer to the top face of the carrier. (See
Figure 1, D7.)
2.2.9 end wall — The wall of the carrier opposite the
bar end of the carrier.
2.2.10 flange — Mass of material on the exterior and
perpendicular to the side walls.
2.2.11 hole — The area for the pin on another carrier to
enter for transferring wafers. (See Figure 1, C8.)
2.2.12 lot — (See “hole.”)
2.2.13 parallelism tolerance — The minimum and
maximum dimension allowance for the opposite
pockets to vary in relation to their distance from the
crossbar end of the carrier. (See Figure 1, D1.)
2.2.14 pin — The mass of material which enters the
hole or slot of another carrier for transferring wafer.
(See Figure 1, C7.)
2.2.15 pin and hole center distance from pocket
centerline —The distance from centerline of either the
pin or hole to the closest pocket centerline. (See Figure
1, C9.)
2.2.16 pocket — The area in which the wafer is located
in the carrier.
2.2.17 pocket centerline — The imaginary line which
bisects each pocket.
