PCI EXPRESS CARD ELECTROMECHANICAL SPECIFICATION, REV. 3.0
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4.7. ELECTRICAL BUDGETS ........................................................................................................ 50
4.7.1. AC Coupling Capacitors ............................................................................................ 51
4.7.2. Insertion Loss Values (Voltage Transfer Function) ................................................... 51
4.7.3. Jitter Values ................................................................................................................ 51
4.7.4. Crosstalk ..................................................................................................................... 53
4.7.5. Lane-to-Lane Skew ..................................................................................................... 54
4.7.6. Transmitter Equalization ............................................................................................ 54
4.7.7. Skew within the Differential Pair ............................................................................... 55
4.7.8. Differential Data Trace Impedance............................................................................ 55
4.7.9. Differential Data Trace Propagation Delay .............................................................. 56
4.8. EYE DIAGRAMS AT THE ADD-IN CARD INTERFACE ..................................................... 56
4.8.1. Add-in Card Transmitter Path Compliance Eye Diagram at 2.5 GT/s ...................... 56
4.8.2. Add-in Card Transmitter Path Compliance Eye Diagrams at 5.0 GT/s .................... 57
4.8.3. Add-in Card Transmitter Path Compliance Eye Diagrams at 8.0 GT/s .................... 59
4.8.4. Add-in Card Minimum Receiver Path Sensitivity Requirements at 2.5 GT/s ............. 60
4.8.5. Add-in Card Minimum Receiver Path Sensitivity Requirements at 5.0 GT/s ............. 61
4.8.6. Add-in Card Minimum Receiver Path Sensitivity Requirements at 8.0 GT/s ............. 62
4.8.7. System Board Transmitter Path Compliance Eye Diagram at 2.5 GT/s .................... 65
4.8.8. System Board Transmitter Path Compliance Eye Diagram at 5.0 GT/s .................... 66
4.8.9. System Board Transmitter Path Compliance Eye Diagram at 8.0 GT/s .................... 69
4.8.10. System Board Minimum Receiver Path Sensitivity Requirements at 2.5 GT/s ........... 72
4.8.11. System Board Minimum Receiver Path Sensitivity Requirements at 5.0 GT/s ........... 73
4.8.12. System Board Minimum Receiver Path Sensitivity Requirements at 8.0 GT/s ........... 75
5. 150 W, 225 W, AND 300 W ADD-IN CARD POWER .......................................................77
5.1. 150 W ADD-IN CARD POWER-UP SEQUENCING .............................................................. 79
5.2. 225 W AND 300 W ADD-IN CARD POWER-UP SEQUENCING ......................................... 81
6. CARD CONNECTOR SPECIFICATION ..........................................................................86
6.1. CONNECTOR PINOUT ............................................................................................................ 86
6.2. CONNECTOR INTERFACE DEFINITIONS ........................................................................... 89
6.3. SIGNAL INTEGRITY REQUIREMENTS AND TEST PROCEDURES ................................ 94
6.3.1. Signal Integrity Requirements .................................................................................... 94
6.3.2. Signal Integrity Requirements and Test Procedures for 2.5 GT/s Support ................ 94
6.3.3. Signal Integrity Requirements and Test Procedures for 5.0 GT/s Support ................ 97
6.3.3.1 Test Fixture Requirements ...................................................................... 99
6.3.4. Signal Integrity Requirements and Test Procedures for 8.0 GT/s Support .............. 100
6.3.4.1 Test Fixture Requirements .................................................................... 101
6.4. CONNECTOR ENVIRONMENTAL AND OTHER REQUIREMENTS .............................. 101
6.4.1. Environmental Requirements ................................................................................... 101
6.4.2. Mechanical Requirements ........................................................................................ 103
6.4.3. Current Rating Requirement .................................................................................... 104
6.4.4. Additional Considerations ........................................................................................ 104
7. PCI EXPRESS 2 X 3 AUXILIARY POWER CONNECTOR DEFINITION ...............106
7.1. 6-POSITION POWER CONNECTOR SYSTEM PERFORMANCE REQUIREMENTS ..... 106
7.2. 6-POSITION PCB HEADER ................................................................................................... 106
7.2.1. 6-Position R/A Thru-Hole PCB Header Assembly ................................................... 106
7.2.2. 6-Position R/A Thru-Hole Header Recommended PCB Footprint .......................... 108
7.2.3. 6-Position R/A SMT PCB Header Assembly ............................................................ 109
7.2.4. R/A SMT Header Recommended PCB Footprint ..................................................... 110
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