GD32F103xx_gd32f103内部flash资源-CSDN文库

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该GD32F103xx设备采用ARM®Cortex™-M332位处理器核心，工作频率为108MHz，Flash访问零等待状态，以获得最大效率。它提供高达3MB的片上闪存和高达96KB的SRAM内存。广泛的增强I/O和外围设备连接到两个APB总线。该设备提供最多三个12位ADC、最多两个12位DAC、最多十个一般16位定时器、两个基本定时器加上两个PWM高级定时器以及标准和高级通信接口：最多三个SPI、两个I2C、三个USART、两个UART、两个I2S、一个USBD、一个CAN和一个SDIO。 GD32F103xx是由GigaDevice Semiconductor Inc.推出的基于ARM Cortex-M3内核的32位微控制器单元（MCU），专为高效能和广泛应用设计。这款芯片具有强大的处理能力，其核心工作频率可达108MHz，使得在执行任务时能够实现零等待状态的快速Flash访问，从而提高系统性能。该器件提供了丰富的存储资源，包括高达3MB的片上Flash内存，用于存储程序代码和固件；以及高达96KB的SRAM，用于运行期间的数据存储和处理。这种大容量的内存配置使得GD32F103xx能够处理复杂的任务和多任务环境。 GD32F103xx的I/O和外围设备接口丰富多样，可以满足各种应用需求。它支持多达三个12位的模数转换器（ADC），两个12位数模转换器（DAC），十个16位通用定时器，两个基础定时器，以及两个高级PWM定时器。这些定时器功能对于控制电机、执行脉冲宽度调制（PWM）和其他实时操作至关重要。在通信接口方面，GD32F103xx包含了多种标准和高级接口，如最多三个SPI（串行外围接口）、两个I2C（Inter-Integrated Circuit）、三个USART（通用同步/异步收发传输器）、两个UART（通用异步接收发送器）、两个I2S（集成串行音频接口）、一个USBD（USB设备）、一个CAN（控制器局域网络）和一个SDIO（安全数字输入输出）。这些接口让GD32F103xx能轻松地与各种外部设备进行数据交换，如传感器、显示屏、存储设备等。在物理特性上，GD32F103xx有不同的封装选项，包括LQFP144、LQFP100、LQFP64和LQFP48，分别对应不同的引脚定义和布局。例如，GD32F103Zx具有144个引脚，GD32F103Vx有100个引脚，GD32F103Rx有64个引脚，而GD32F103Cx则有48个引脚。每个封装的引脚分配和功能在数据手册中都有详细的说明，方便用户根据具体应用选择合适的封装类型。此外，数据手册还涵盖了内存映射、时钟树配置，这些都是理解和配置MCU系统的关键部分。内存映射定义了各个区域的地址空间，而时钟树则展示了MCU内部的时钟信号分配和管理，这对于优化系统时序和功耗至关重要。 GD32F103xx是一款功能强大的32位MCU，具备高性能、大容量存储、丰富外设接口和灵活的封装选择，广泛适用于工业控制、物联网、消费电子等多种领域。其详细的技术规格和引脚配置信息都在数据手册中提供，为设计人员提供了全面的参考资料，以实现高效、可靠的系统设计。

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GigaDevice Semiconductor Inc.

GD32F103xx

ARM

Cortex

™

-M3 32-bit MCU

Datasheet

GD32F103xx Datasheet

Table of Contents

Table of Contents ........................................................................................................... 1

List of Figures ................................................................................................................ 3

List of Tables .................................................................................................................. 4

1. General description ................................................................................................. 5

2. Device overview ....................................................................................................... 6

2.1. Device information .......................................................................................................... 6

2.2. Block diagram ................................................................................................................. 9

2.3. Pinouts and pin assignment ........................................................................................ 11

2.4. Memory map .................................................................................................................. 15

2.5. Clock tree ...................................................................................................................... 19

2.6. Pin definitions ............................................................................................................... 20

2.6.1. GD32F103Zx LQFP144 pin definitions ................................................................................. 20

2.6.2. GD32F103Vx LQFP100 pin definitions ................................................................................ 28

2.6.3. GD32F103Rx LQFP64 pin definitions .................................................................................. 35

2.6.4. GD32F103Cx LQFP48 pin definitions .................................................................................. 39

2.6.5. GD32F103Tx QFN36 pin definitions .................................................................................... 42

3. Functional description .......................................................................................... 44

3.1. ARM® Cortex™-M3 core ............................................................................................... 44

3.2. On-chip memory ........................................................................................................... 44

3.3. Clock, reset and supply management ......................................................................... 45

3.4. Boot modes ................................................................................................................... 45

3.5. Power saving modes .................................................................................................... 47

3.6. Analog to digital converter (ADC) ................................................................................ 47

3.7. Digital to analog converter (DAC) ................................................................................ 48

3.8. DMA ............................................................................................................................... 48

3.9. General-purpose inputs/outputs (GPIOs) .................................................................... 48

3.10. Timers and PWM generation ................................................................................. 49

3.11. Real time clock (RTC) ............................................................................................ 50

3.12. Inter-integrated circuit (I2C) .................................................................................. 50

3.13. Serial peripheral interface (SPI) ............................................................................ 51

GD32F103xx Datasheet

3.14. Universal synchronous asynchronous receiver transmitter (USART) ............... 51

3.15. Inter-IC sound (I2S) ................................................................................................ 51

3.16. Secure digital input and output card interface (SDIO) ......................................... 52

3.17. Universal serial bus full-speed device (USBD) .................................................... 52

3.18. Controller area network (CAN) .............................................................................. 52

3.19. External memory controller (EXMC) ..................................................................... 52

3.20. Debug mode ........................................................................................................... 53

3.21. Package and operation temperature ..................................................................... 53

4. Electrical characteristics ....................................................................................... 54

4.1. Absolute maximum ratings .......................................................................................... 54

4.2. Recommended DC characteristics .............................................................................. 54

4.3. Power consumption ...................................................................................................... 55

4.4. EMC characteristics ...................................................................................................... 60

4.5. Power supply supervisor characteristics .................................................................... 60

4.6. Electrical sensitivity ..................................................................................................... 62

4.7. External clock characteristics ...................................................................................... 63

4.8. Internal clock characteristics ....................................................................................... 64

4.9. PLL characteristics ....................................................................................................... 65

4.10. Memory characteristics ......................................................................................... 65

4.11. GPIO characteristics .............................................................................................. 65

4.12. ADC characteristics ............................................................................................... 67

4.13. DAC characteristics ............................................................................................... 67

4.14. I2C characteristics ................................................................................................. 67

4.15. SPI characteristics ................................................................................................. 68

5. Package information .............................................................................................. 69

5.1. QFN package outline dimensions ................................................................................ 69

5.2. LQFP package outline dimensions .............................................................................. 70

6. Ordering Information ............................................................................................. 72

7. Revision History..................................................................................................... 74

GD32F103xx Datasheet

List of Tables

Table 2-1. GD32F103xx devices features and peripheral list .................................................................. 6

Table 2-2. GD32F103xx devices features and peripheral list (continued) ............................................. 7

Table 2-3. GD32F103xx devices features and peripheral list (continued) ............................................. 8

Table 2-4. GD32F103xx memory map ...................................................................................................... 15

Table 2-5. GD32F103Zx LQFP144 pin definitions ................................................................................... 20

Table 2-6. GD32F103Vx LQFP100 pin definitions ................................................................................... 28

Table 2-7. GD32F103Rx LQFP64 pin definitions .................................................................................... 35

Table 2-8. GD32F103Cx LQFP48 pin definitions .................................................................................... 39

Table 2-9. GD32F103Tx QFN36 pin definitions ....................................................................................... 42

Table 4-1. Absolute maximum ratings ..................................................................................................... 54

Table 4-2. DC operating conditions ......................................................................................................... 54

Table 4-3. Power consumption characteristics (for GD32F103x4/6/8/B devices) ............................... 55

Table 4-4. Power consumption characteristics (for GD32F103xC/D/E/F/G/I/K devices) .................... 56

Table 4-5. Power consumption of peripherals (for GD32F103x4/6/8/B devices) ................................. 57

Table 4-6. Power consumption of peripherals (for GD32F103xC/D/E/F/G/I/K devices) ...................... 58

Table 4-7. EMS characteristics ................................................................................................................. 60

Table 4-8. EMI characteristics .................................................................................................................. 60

Table 4-9. Power supply supervisor characteristics (for GD32F103x4/6/8/B devices) ....................... 60

Table 4-10. Power supply supervisor characteristics (for GD32F103xC/D/E/F/G/I/K devices) .......... 60

Table 4-11. ESD characteristics ............................................................................................................... 62

Table 4-12. Static latch-up characteristics .............................................................................................. 62

Table 4-13. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics . 63

Table 4-14. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics .. 63

Table 4-15. High speed internal clock (IRC8M) characteristics ............................................................ 64

Table 4-16. Low speed internal clock (IRC40K) characteristics ........................................................... 64

Table 4-17. PLL characteristics ................................................................................................................ 65

Table 4-18. Flash memory characteristics .............................................................................................. 65

Table 4-19. I/O port characteristics (for GD32F103x4/6/8/B devices) ................................................... 65

Table 4-20. I/O port characteristics (for GD32F103xC/D/E/F/G/I/K devices) ........................................ 66

Table 4-21. ADC characteristics ............................................................................................................... 67

Table 4-22. DAC characteristics ............................................................................................................... 67

Table 4-23. I2C characteristics ................................................................................................................. 67

Table 4-24. Standard SPI characteristics ................................................................................................ 68

Table 5-1. QFN package dimensions ....................................................................................................... 69

Table 5-2. LQFP package dimensions ..................................................................................................... 71

Table 6-1. Part ordering code for GD32F103xx devices ........................................................................ 72

Table 7-1. Revision history ....................................................................................................................... 74