BES2300-YP-Datasheet-v1.0_bes死机资源-CSDN文库

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BES2300-YP Product Specification Rev 1.0

ANC Bluetooth Audio Platform with IBRT for TWS

Confidential and Proprietary –Bestechnic (Shanghai) Co., Ltd.

Address: Room 201, Tower B, Chamtime Plaza, Lane 2889 Jinke Road, Pudong New District, Shanghai 201203, China

Phone: (86)21 6877 1788

For products inquires and more information, please visit www.bestechnic.com.

DISCLAIMER:

No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical,

including photocopying and recording, for any purpose, without the express written permission of Bestechnic. Bestechnic

retains the right to make changes to this document at any time, without notice. Bestechnic makes no warranty of any

kind, expressed or implied, with regard to any information contained in this document, including, but not limited to, the

implied warranties of merchantability or fitness for any particular purpose. Further, Bestechnic does not warrant the

accuracy or completeness of the information, text, graphics, or other items contained within this document.

BES2300-YP Product Specification

Rev 1.0

Page3 / 25

Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.

Table of contents

List of Tables ......................................................................................................................................................................... 4

List of Figures ........................................................................................................................................................................ 4

General Description ...................................................................................................................................................... 5

1.1

Applications ............................................................................................................................................................. 5

1.2

Features .................................................................................................................................................................. 6

Platform Feature ........................................................................................................................................................... 7

2.1

MCU Subsystem ...................................................................................................................................................... 7

2.2

Memory ................................................................................................................................................................... 7

2.3

System Peripherals .................................................................................................................................................. 8

2.4

Power Management ............................................................................................................................................... 8

2.5

Audio Interface ....................................................................................................................................................... 8

Bluetooth Modem Description ................................................................................................................................... 10

3.1

Radio ..................................................................................................................................................................... 10

3.2

Auxiliary feature .................................................................................................................................................... 10

3.3

Bluetooth Stack ..................................................................................................................................................... 10

Electrical Characteristics ............................................................................................................................................. 11

4.1

Electrical Characteristics ....................................................................................................................................... 11

4.2

Bluetooth Radio Electrical Characteristics ............................................................................................................ 11

4.3

Audio Codec Electrical Characteristics .................................................................................................................. 15

4.4

BUCK Electrical Characteristics ............................................................................................................................. 16

Pin Map & Application Schematic ............................................................................................................................... 17

5.1

Pin Description ...................................................................................................................................................... 17

Package Dimensions ................................................................................................................................................... 20

6.1

BGA Dimensions .................................................................................................................................................... 20

SMT Caution ................................................................................................................................................................ 21

7.1

Land Pad and Stencil Design ................................................................................................................................. 21

7.2

Solder Reflow Profile ............................................................................................................................................. 21

7.3

RoHS Compliant .................................................................................................................................................... 22

7.4

ESD Sensitivity ....................................................................................................................................................... 22

7.5

Storage Alert ......................................................................................................................................................... 22

Ordering Information .................................................................................................................................................. 23

Tape and Reel Information ......................................................................................................................................... 24

9.1

Tape Orientation ................................................................................................................................................... 24

9.2

Reel Dimensions .................................................................................................................................................... 24

9.3

Tape Dimensions ................................................................................................................................................... 25

9.4

Moisture Sensitivity Level ..................................................................................................................................... 25

BES2300-YP Product Specification

Rev 1.0

Page4 / 25

Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd.

List of Tables

Table 4-1 Operating Conditions

(a) ...............................................................................................................................

Table 4-2 Absolute Maximum Ratings

(c) .....................................................................................................................

Table 4-3 Power Consumption

(a) ................................................................................................................................

Table 4-4 Receiver Characteristics - Basic Data Rate

(a) ..............................................................................................

Table 4-5 Transmitter Characteristics - Basic Data Rate

(a) .........................................................................................

Table 4-6 Receiver Characteristics - Enhanced Data Rate

(a) .......................................................................................

Table 4-7 Transmitter Characteristics - Enhanced Data Rate

(a) ..................................................................................

Table 4-8 Bluetooth LE Receiver Specifications .......................................................................................................... 14

Table 4-9 Bluetooth LE Transmitter Specifications ..................................................................................................... 14

Table 4-10 Digital to Analogue Converter under 1.95V

(b) ..........................................................................................

Table 4-11 Codec - Analogue to Digital Converter under 1.95V ................................................................................. 16

Table 5-1 BES2300-YP Pins Description ....................................................................................................................... 17

Table 7-1 Package Peak Reflow Temperature - Sn/Pb ................................................................................................ 21

Table 7-2 Package peak reflow temperature - Pb-Free

(a) ...........................................................................................

Table 7-3 Solder Reflow Profile Feature ..................................................................................................................... 22

List of Figures

Figure 1-1 BES2300-YP Top View .................................................................................................................................. 5

Figure 2-1 Platform Architecture .................................................................................................................................. 7

Figure 5-1 BES2300-YP Pinout Diagram ...................................................................................................................... 17

Figure 6-1 BES2300-YP Dimension .............................................................................................................................. 20

Figure 7-1 Solder Reflow Profile .................................................................................................................................. 21

Figure 9-1 Tape Orientation ........................................................................................................................................ 24

Figure 9-2 Reel Dimensions

(a)(b) ..................................................................................................................................

Figure 9-3 Tape Dimensions

(a) ....................................................................................................................................