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BES2300-H-Datasheet-v0.22
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BES2300-H_Datasheet_v0.22
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BES2300-H
Bluetooth Audio Platform with Support for
FWS* and Google Bisto
Product Specification Rev 0.22
* FWS: Fully Wireless Stereo, BES’s stereo connection technology between primary and secondary Voice Box.
Bestechnic (Shanghai) Co.,Ltd.
Room 201, Tower B, ChamtimePlaza, Lane 2889 Jinke Road,
Pudong New District, Shanghai 201203, China
PHONE: (86)21 6886 7870
FAX: (86)21 6886 7870 – 617
Confidential and Proprietary – Bestechnic (Shanghai) Co, Ltd.
DISCLAIMER:
No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical,
including photocopying and recording, for any purpose, without the express written permission of Bestechnic. Bestechnic
retains the right to make changes to this document at any time, without notice. Bestechnic makes no warranty of any
kind, expressed or implied, with regard to any information contained in this document, including, but not limited to, the
implied warranties of merchantability or fitness for any particular purpose. Further, Bestechnic does not warrant the
accuracy or completeness of the information, text, graphics, or other items contained within this document.
BES2300-H Product Specification
Rev 0.22 Page2 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
Datasheet Status
Status description.
Datasheet Status
Product Status
Revision Control
Description
Draft
Development
Rev 0.01 - 0.49
Datasheets contain pre-tapeout information from the objective design
specification and is only for internal use.
Preliminary
Qualification
Rev 0.50 - 0.99
Datasheets contain information on post-tapeout and pre-volume
production products, and a revision of this document or supplementary
information may be published at a later date. BESTECHNIC may make
changes to these specifications at any time without notice.
Released
Production
Rev1.xx
Datasheets contain information on volume production products.
BESTECHNIC may make changes to these specifications at any time
without notice.
Revision History
Bars appearing in the margin (as shown here) indicate where technical changes have occurred for this revision. The
following table lists the technical content changes for all revisions.
Revision
Date
Description
0.10
20/01/2018
Initial definition
0.11
09/07/2018
Update Format
0.12
11/07/2018
Modify pin list
0.13
25/08/2018
Update ball map
0.14
29/08/2018
Update pin description
0.15
14/09/2018
Modify Pin List
0.16
27/09/2018
Update Spec. Support FWS and Bisto.
0.17
11/10/2018
Update ball map
0.18
29/10/2018
Modify parameter
0.19
05/11/2018
Modify Support Audio Bit
0.20
08/11/2018
Update POD
0.21
08/11/2018
Update package size
0.22
27/11/2018
Update spec
BES2300-H Product Specification
Rev 0.22 Page3 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
Table of contents
Datasheet Status ..................................................................................................................................................................... 2
Revision History ...................................................................................................................................................................... 2
List of Tables and figures ........................................................................................................................................................ 5
1 General Description ............................................................................................................................................................. 6
1.1 Applications ............................................................................................................................................................ 6
1.2 Features .................................................................................................................................................................. 7
2 Platform Feature ............................................................................................................................................................. 8
2.1 MCU Subsystem ...................................................................................................................................................... 8
2.2 Memory .................................................................................................................................................................. 8
2.3 System Peripherals.................................................................................................................................................. 9
2.4 Power Management ............................................................................................................................................... 9
2.5 Audio Interface ....................................................................................................................................................... 9
3 Bluetooth Modem Description ..................................................................................................................................... 11
3.1 Radio ..................................................................................................................................................................... 11
3.2 Auxiliary feature .................................................................................................................................................... 11
3.3 Bluetooth Stack ..................................................................................................................................................... 11
4 Electrical Characteristics ............................................................................................................................................... 12
4.1 Electrical Characteristics ....................................................................................................................................... 12
4.2 Bluetooth Radio Electrical Characteristics ............................................................................................................ 13
4.3 Audio Codec Electrical Characteristics .................................................................................................................. 15
4.4 BUCK Electrical Characteristics ............................................................................................................................. 16
5 Pin Map & Application Schematic ................................................................................................................................. 18
5.1 Pin Description ...................................................................................................................................................... 18
5.2 Application Schematic........................................................................................................................................... 21
6 Package Dimensions ..................................................................................................................................................... 22
6.1 BGA Dimensions .................................................................................................................................................... 22
7 SMT Caution .................................................................................................................................................................. 23
7.1 Land Pad and Stencil Design ................................................................................................................................. 23
7.2 Solder Reflow Profile ............................................................................................................................................ 23
BES2300-H Product Specification
Rev 0.22 Page4 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
7.3 RoHS Compliant. ................................................................................................................................................... 24
7.4 ESD Sensitivity ....................................................................................................................................................... 24
7.5 Storage Alert ......................................................................................................................................................... 24
8 Ordering Information .................................................................................................................................................... 26
9 Tape and Reel Information ........................................................................................................................................... 27
9.1 Tape Orientation ................................................................................................................................................... 27
9.2 Reel Dimensions .................................................................................................................................................... 27
9.3 Tape Dimensions ................................................................................................................................................... 28
9.4 Moisture Sensitivity Level ..................................................................................................................................... 28
BES2300-H Product Specification
Rev 0.22 Page5 / 28 Confidential and Proprietary – Bestechnic (Shanghai) Co., Ltd
List of Tables and figures
Table 4-1 DC Electrical Specification (Recommended Operation Conditions) .............................................................. 12
Table 4-2 DC Electrical Specification (Absolute Maximum Ratings) ............................................................................. 12
Table 4-3 Power Consumption...................................................................................................................................... 12
Table 4-4 Receiver Characteristics - Basic Data Rate .................................................................................................... 13
Table 4-5 Transmitter Characteristics - Basic Data Rate ............................................................................................... 13
Table 4-6 Receiver Characteristics - Enhanced Data Rate ............................................................................................ 14
Table 4-7 Transmitter Characteristics - Enhanced Data Rate ....................................................................................... 15
Table 4-8 Digital to Analogue Converter under 1.95V .................................................................................................. 15
Table 4-9 Codec - Analogue to Digital Converter under 1.95V ..................................................................................... 16
Table 4-10 DCDC Characteristics ................................................................................................................................... 17
Table 7-1 Package Peak Reflow Temperature - Sn/Pb .................................................................................................. 23
Table 7-2 Package Peak Reflow Temperature - Pb-Free ............................................................................................... 23
Table 7-3 Solder Reflow Profile Feature ....................................................................................................................... 24
Figure 1-1 BES2300-H Top View ...................................................................................................................................... 6
Figure 2-1 Platform Architecture .................................................................................................................................... 8
Figure 5-1 BES2300-H Pins ............................................................................................................................................ 18
Figure 6-1 BES2300-H Dimension ................................................................................................................................. 22
Figure 7-1 Solder Reflow Profile ................................................................................................................................... 23
Figure 9-1 Tape Orientation .......................................................................................................................................... 27
Figure 9-2 Reel Dimensions .......................................................................................................................................... 27
Figure 9-3 Tape Dimensions.......................................................................................................................................... 28
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