BES2300-L-Datasheet-v0.22资源-CSDN文库

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BES2300-L

Bluetooth Audio Platform with Support for

FWS* and Google Bisto

Product Specification Rev 0.22

深圳市启芯微电子有限公司

TEL:+86-755-83252915 83252905

http://www.qxwRF.com

FAX:+86-755-83252917

深圳市启芯微电子有限公司

BES2300-L Product Specification

Rev 0.22 Page3 / 28

Table of contents

Datasheet Status ................................................................................................................................................................... 2

Revision History .................................................................................................................................................................... 2

List of Tables and figures ...................................................................................................................................................... 5

1 General Description ...................................................................................................................................................... 6

1.1 Applications ............................................................................................................................................................ 6

1.2 Features .................................................................................................................................................................. 6

2 Platform Feature ........................................................................................................................................................... 8

2.1 MCU Subsystem ...................................................................................................................................................... 8

2.2 Memory .................................................................................................................................................................. 8

2.3 System Peripherals.................................................................................................................................................. 9

2.4 Power Management ............................................................................................................................................... 9

2.5 Audio Interface ....................................................................................................................................................... 9

3 Bluetooth Modem Description ................................................................................................................................... 11

3.1 Radio ..................................................................................................................................................................... 11

3.2 Auxiliary feature .................................................................................................................................................... 11

3.3 Bluetooth Stack ..................................................................................................................................................... 11

4 Electrical Characteristics ............................................................................................................................................. 12

4.1 Electrical Characteristics ....................................................................................................................................... 12

4.2 Bluetooth Radio Electrical Characteristics ............................................................................................................ 13

4.3 Audio Codec Electrical Characteristics .................................................................................................................. 15

4.4 BUCK Electrical Characteristics ............................................................................................................................. 17

5 Pin Map & Application Schematic ............................................................................................................................... 18

5.1 Pin Description ...................................................................................................................................................... 18

5.2 Application Schematic........................................................................................................................................... 21

6 Package Dimensions ................................................................................................................................................... 22

6.1 BGA Dimensions .................................................................................................................................................... 22

7 SMT Caution ................................................................................................................................................................ 23

7.1 Land Pad and Stencil Design ................................................................................................................................. 23

7.2 Solder Reflow Profile ............................................................................................................................................ 23

深圳市启芯微电子有限公司

TEL:+86-755-83252915 83252905

http://www.qxwRF.com

FAX:+86-755-83252917

深圳市启芯微电子有限公司

BES2300-L Product Specification

Rev 0.22 Page5 / 28

List of Tables and figures

Table 4-1 DC Electrical Specification (Recommended Operation Conditions) ............................................................ 12

Table 4-2 DC Electrical Specification (Absolute Maximum Ratings) ........................................................................... 12

Table 4-3 Power Consumption.................................................................................................................................... 12

Table 4-4 Receiver Characteristics - Basic Data Rate .................................................................................................. 13

Table 4-5 Transmitter Characteristics - Basic Data Rate ............................................................................................. 13

Table 4-6 Receiver Characteristics - Enhanced Data Rate .......................................................................................... 14

Table 4-7 Transmitter Characteristics - Enhanced Data Rate ..................................................................................... 15

Table 4-8 Digital to Analogue Converter under 1.95V ................................................................................................ 15

Table 4-9 Codec - Analogue to Digital Converter under 1.95V ................................................................................... 16

Table 4-10 DCDC Characteristics ................................................................................................................................. 17

Table 5-1 BES2300-L Pins Description ......................................................................................................................... 18

Table 7-1 Package peak reflow temperature - Sn/Pb ................................................................................................. 23

Table 7-2 Package peak reflow temperature - Pb-Free .............................................................................................. 23

Table 7-3 Solder Reflow Profile Feature ..................................................................................................................... 24

Figure 1-1 BES2300-L Top View .................................................................................................................................... 6

Figure 2-1 Platform Architecture .................................................................................................................................. 8

Figure 5-1 BES2300-L Pins ........................................................................................................................................... 18

Figure 6-1 BES2300-L Dimension ................................................................................................................................ 22

Figure 7-1 Solder Reflow Profile ................................................................................................................................. 23

Figure 9-1 Tape Orientation ........................................................................................................................................ 27

Figure 9-2 Reel Dimensions ........................................................................................................................................ 27

Figure 9-3 Tape Dimensions........................................................................................................................................ 28

深圳市启芯微电子有限公司

TEL:+86-755-83252915 83252905

http://www.qxwRF.com

FAX:+86-755-83252917

深圳市启芯微电子有限公司