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IPB320N20N3 G INFINEON 英飞凌芯片 中文版规格书手册.pdf
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IPB320N20N3 G INFINEON 英飞凌芯片 中文版规格书手册
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IPB320N20N3 G IPP320N20N3 G
IPI320N20N3 G
OptiMOS
TM
3 Power-Transistor
Features
• N-channel, normal level
• Excellent gate charge x R
DS(on)
product (FOM)
• Very low on-resistance R
DS(on)
• 175 °C operating temperature
• Pb-free lead plating; RoHS compliant
• Qualified according to JEDEC
1)
for target application
• Halogen-free according to IEC61249-2-21
• Ideal for high-frequency switching and synchronous rectification
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current
I
D
T
C
=25 °C
34 A
T
C
=100 °C
22
Pulsed drain current
2)
I
D,pulse
T
C
=25 °C
136
Avalanche energy, single pulse
E
AS
I
D
=34 A, R
GS
=25 Ω
190 mJ
Reverse diode dv /dt dv /dt 10 kV/µs
Gate source voltage
V
GS
±20 V
Power dissipation
P
tot
T
C
=25 °C
136 W
Operating and storage temperature
T
j
, T
stg
-55 ... 175 °C
IEC climatic category; DIN IEC 68-1 55/175/56
2)
See figure 3
Value
1)
J-STD20 and JESD22
V
DS
200 V
R
DS(on),max
32
mΩ
I
D
34 A
Product Summary
Type
IPB320N20N3 G IPP320N20N3 G IPI320N20N3 G
Package
PG-TO263-3 PG-TO220-3 PG-TO262-3
Marking
320N20N 320N20N 320N20N
Rev. 2.3 page 1 2011-05-20
IPB320N20N3 G IPP320N20N3 G
IPI320N20N3 G
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case
R
thJC
- - 1.1 K/W
R
thJA
minimal footprint - - 62
6 cm2 cooling area
3)
--40
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0 V, I
D
=1 mA
200 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=90 µA
234
Zero gate voltage drain current
I
DSS
V
DS
=160 V, V
GS
=0 V,
T
j
=25 °C
- 0.1 1 µA
V
DS
=160 V, V
GS
=0 V,
T
j
=125 °C
- 10 100
Gate-source leakage current
I
GSS
V
GS
=20 V, V
DS
=0 V
- 1 100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=10 V, I
D
=34 A
-2832
mΩ
Gate resistance
R
G
- 2.5 -
Ω
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=34 A
27 54 - S
Values
Thermal resistance, junction -
ambient
3)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm
2
(one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
Rev. 2.3 page 2 2011-05-20
IPB320N20N3 G IPP320N20N3 G
IPI320N20N3 G
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
Input capacitance
C
iss
- 1770 2350 pF
Output capacitance
C
oss
- 135 180
Reverse transfer capacitance
C
rss
-4-
Turn-on delay time
t
d(on)
-11-ns
Rise time
t
r
-9-
Turn-off delay time
t
d(off)
-21-
Fall time
t
f
-4-
Gate Char
g
e Characteristics
4)
Gate to source charge
Q
gs
-8-nC
Gate to drain charge
Q
gd
-3-
Switching charge
Q
sw
-5-
Gate charge total
Q
g
-2229
Gate plateau voltage
V
plateau
- 4.4 - V
Output charge
Q
oss
V
DD
=100 V, V
GS
=0 V
-5472nC
Reverse Diode
Diode continous forward current
I
S
- - 34 A
Diode pulse current
I
S,pulse
- - 136
Diode forward voltage
V
SD
V
GS
=0 V, I
F
=34 A,
T
j
=25 °C
- 0.9 1.2 V
Reverse recovery time
t
rr
- 110 - ns
Reverse recovery charge
Q
rr
- 500 - nC
4)
See figure 16 for gate charge parameter definition
V
R
=100 V, I
F
=17 A,
di
F
/dt =100 A/µs
T
C
=25 °C
Values
V
GS
=0 V, V
DS
=100 V,
f =1 MHz
V
DD
=100 V,
V
GS
=10 V, I
D
=17 A,
R
G
=1.6 Ω
V
DD
=100 V, I
D
=17 A,
V
GS
=0 to 10 V
Rev. 2.3 page 3 2011-05-20
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