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【eMMC芯片datasheet】KLM4G1FETE-B041.pdf
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eMMC 芯片是一种内置闪存控制器的嵌入式多媒体卡,通常用作移动设备和嵌入式系统的存储解决方案。eMMC 芯片的 datasheet 是一份详细的文档,其中包含了该芯片的规格、特性、电气参数、引脚定义、寿命特性、封装信息等重要信息。下面,我们将介绍 eMMC 芯片 datasheet 中的一些重要内容。 首先,eMMC 芯片的 datasheet 中会列出该芯片的规格和特性。这些规格和特性包括存储容量、数据传输速度、读写周期、工作温度范围、电源电压等等。这些规格和特性对于选择适合的 eMMC 芯片非常重要,因为它们会影响到芯片的性能和可靠性。 其次,eMMC 芯片的 datasheet 中还会列出芯片的引脚定义和电气参数。这些信息对于设计和使用该芯片的电路板非常重要。引脚定义包括每个引脚的名称、功能、位置和布局等信息。电气参数包括芯片的电源电压、电流、时钟频率、信号电平等信息。这些信息对于电路板的设计、电路的匹配和芯片的可靠性都有很大的影响。 此外,eMMC 芯片的 datasheet 中还包含了该芯片的寿命特性。这些特性包括芯片的擦写次数、保持时间、数据保护等。
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- 1 -
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
ⓒ 2018 Samsung Electronics Co., Ltd. All rights reserved
Rev1.0. Feb. 2018
SAMSUNG CONFIDENTIAL
KLM4G1FETE-B041
Samsung eMMC Product family
eMMC 5.1 Specification compatibility
datasheet
- 2 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
eMMC
Rev. 1.0
SAMSUNG CONFIDENTIAL
KLM4G1FETE-B041
Revision History
Revision No. History Draft Date Remark Editor
0.0 1. Initial issue Nov. 16, 2017 Target S.M.Lee
0.1
1.
Package Dimension update.
Dec. 20, 2017 Target S.M.Lee
1.0 1. Customer sample Jan. 02, 2018 Final S.M.Lee
- 3 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
Table Of Contents
datasheet
eMMC
Rev. 1.0
SAMSUNG CONFIDENTIAL
KLM4G1FETE-B041
1.0 PRODUCT LIST..........................................................................................................................................................4
2.0 KEY FEATURES......................................................................................................................................................... 4
3.0 PACKAGE CONFIGURATIONS .................................................................................................................................5
3.1 153 Ball Pin Configuration ....................................................................................................................................... 5
3.1.1 11mm x 10mm x 0.8mm Package Dimension .................................................................................................. 6
3.2 Product Architecture ................................................................................................................................................ 7
4.0 HS400 mode...............................................................................................................................................................8
5.0 New eMMC5.1 Features .............................................................................................................................................9
5.1 Overview.................................................................................................................................................................. 9
5.2 Command Queuing ................................................................................................................................................. 9
5.2.1 CMD Set Description......................................................................................................................................... 9
5.2.2 New Response : QSR (Queue Status Register) .............................................................................................. 9
5.2.3 Send Status : CMD13 ...................................................................................................................................... 9
5.2.4 Mechanism of CMD Queue operation............................................................................................................... 10
5.2.5 CMD Queue Register description ..................................................................................................................... 10
5.3 Enhanced Strobe Mode........................................................................................................................................... 10
5.4 RPMB Throughput improve ..................................................................................................................................... 10
5.5 Secure Write Protection........................................................................................................................................... 11
6.0 Technical Notes ..........................................................................................................................................................12
6.1 S/W Algorithm.......................................................................................................................................................... 12
6.1.1 Partition Management ....................................................................................................................................... 12
6.1.1.1 Enhanced Partition (Area) .......................................................................................................................... 12
6.1.2 Boot operation................................................................................................................................................... 12
6.1.3 User Density...................................................................................................................................................... 13
6.1.4 Auto Power Saving Mode.................................................................................................................................. 14
6.1.5 Performance...................................................................................................................................................... 14
7.0 REGISTER VALUE.....................................................................................................................................................15
7.1 OCR Register .......................................................................................................................................................... 15
7.2 CID Register ............................................................................................................................................................ 15
7.2.1 Product name table (In CID Register) ............................................................................................................... 15
7.3 CSD Register........................................................................................................................................................... 16
7.4 Extended CSD Register .......................................................................................................................................... 17
8.0 AC PARAMETER........................................................................................................................................................ 21
8.1 Timing Parameter .................................................................................................................................................... 21
8.2 Previous Bus Timing Parameters for DDR52 and HS200 mode are defined by JEDEC standard.......................... 21
8.3 Bus Timing Specification in HS400 mode ............................................................................................................... 22
8.3.1 HS400 Device Input Timing .............................................................................................................................. 22
8.3.2 HS400 Device Output Timing............................................................................................................................ 23
8.4 Bus signal levels...................................................................................................................................................... 24
8.4.1 Open-drain mode bus signal level..................................................................................................................... 24
8.4.2 Push-pull mode bus signal level eMMC ............................................................................................................ 24
9.0 DC PARAMETER .......................................................................................................................................................25
9.1 Active Power Consumption during operation .......................................................................................................... 25
9.2 Standby Power Consumption in auto power saving mode and standby state......................................................... 25
9.3 Sleep Power Consumption in Sleep State............................................................................................................... 25
9.4 Supply Voltage ........................................................................................................................................................ 25
9.5 Bus Signal Line Load............................................................................................................................................... 26
- 4 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
eMMC
Rev. 1.0
SAMSUNG CONFIDENTIAL
KLM4G1FETE-B041
INTRODUCTION
SAMSUNG eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a sim-
ple read and write to memory using MMC protocol v5.1 which is a industry standard.
eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (V
DDF
or V
CC
) whereas 1.8V or 3V dual supply
voltage (V
DD
or V
CCQ
) is supported for the MMC controller. SAMSUNG eMMC supports HS400 in order to improve sequential bandwidth, especially
sequential read performance.
There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host.
Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to
faster product development as well as faster times to market.
The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The
FTL supports all features of the Samsung NAND flash and achieves optimal performance.
1.0 PRODUCT LIST
[Table 1] Product List
2.0 KEY FEATURES
embedded MultiMediaCard Ver. 5.1 compatible.
SAMSUNG eMMC supports features of eMMC5.1 which are defined in JEDEC Standard
- Major Supported Features : HS400, Field Firmware Update, Cache, Command Queuing, Enhanced Strobe Mode,
Secure Write Protection, Partition types.
- Non-supported Features : Large Sector Size (4KB)
Backward compatibility with previous MultiMediaCard system specification (1bit data bus, multi-eMMC systems)
Data bus width : 1bit (Default), 4bit and 8bit
MMC I/F Clock Frequency : 0 ~ 200MHz
MMC I/F Boot Frequency : 0 ~ 52MHz
Temperature : Operation (-25C ~ 85C), Storage without operation (-40C ~ 85C)
Power : Interface power → V
CCQ
(1.70V ~ 1.95V or 2.7V ~ 3.6V) , Memory power → V
CC
(2.7V ~ 3.6V)
Capacities eMMC Part ID NAND Flash Type User Density (%) Power System Package size Pin Configuration
4 GB KLM4G1FETE-B041 32Gb x 1 91.0%
- Interface power :
VDD (1.70V ~ 1.95V or
2.7V ~ 3.6V)
- Memory power :
VDDF (2.7V ~ 3.6V)
11mm x 10mm x 0.8 153FBGA
- 5 -
IF THERE IS ANY OTHER OPERATION TO IMPLEMENT IN ADDITION TO SPECIFICATION
IN THE DATASHEET OR JEDEC STANDARD, PLEASE CONTACT EACH BRANCH OFFICE OR
HEADQUARTERS OF SAMSUNG ELECTRONICS.
datasheet
eMMC
Rev. 1.0
SAMSUNG CONFIDENTIAL
KLM4G1FETE-B041
3.0 PACKAGE CONFIGURATIONS
3.1 153 Ball Pin Configuration
[Table 2] 153 Ball Information
Figure 1. 153-FBGA
CLK : Clock input
Data Strobe : Data Strobe is generated from eMMC to host.
In HS400 mode, read data and CRC response are synchronized with Data Strobe.
CMD : A bidirectional signal used for device initialization and command transfers.
Command operates in two modes, open-drain for initialization and push-pull for fast command transfer.
DAT0-7 : Bidirectional data channels. It operates in push-pull mode.
RST_n : H/W reset signal pin
V
CC
: Supply voltage for flash memory
V
CCQ
: Supply voltage for memory controller
VDDi : Internal power node to stabilize regulator output to controller core logics
V
SS
: Ground connections
RFU : Reserved for future use , do not use for any usage
Pin NO Name
A3 DAT0
A4 DAT1
A5 DAT2
B2 DAT3
B3 DAT4
B4 DAT5
B5 DAT6
B6 DAT7
K5 RSTN
C6
V
CCQ
M4
V
CCQ
N4
V
CCQ
P3
V
CCQ
P5
V
CCQ
E6
V
CC
F5 V
CC
J10 V
CC
K9 V
CC
C2 VDDI
M5 CMD
H5 Data Strobe
M6 CLK
J5
V
SS
A6
V
SS
C4 V
SS
E7 V
SS
G5 V
SS
H10 V
SS
K8 V
SS
N2 V
SS
N5
V
SS
P4 V
SS
P6 V
SS
Vss
V
CC
V
CC
Vss
Vss
DAT7
V
CCQ
V
CC
CLK
Vss
DAT2
DAT6
V
CC
Vss
RSTN
CMD
Vss
V
CCQ
DAT1
DAT5
V
ss
V
CCQ
V
CCQ
Vss
DAT4
V
CCQ
DAT3
Vss
DAT0
VDD
I
NC
A
B
C
D
E
F
G
H
J
K
L
M
N
P
1234567891011121314
Vss RFU
RFU
RFU RFU RFU
RFU
RFU
RFU
RFU
RFU
Vss
RFU
Data
Strobe
Ball-side down view
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