TI-TPS61052.pdf资源-CSDN文库

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《TI TPS61052：高功率白光LED驱动器及同步升压转换器》 TI的TPS61052是一款专为驱动高功率白光LED设计的同步升压转换器，它集成了多种操作模式、高效能和智能控制特性，适用于手机、平板电脑等便携设备中的闪光灯和背光照明应用。该器件基于高频同步升压拓扑结构，具有出色的能效和小巧的解决方案电路面积。 **主要特点：** 1. **四种操作模式**：包括torch（常亮）模式、flash（闪光）模式、电压调节的升压转换器以及关断模式，能够满足不同应用场景的需求。 2. **高效率**：高达96%的转换效率，得益于其2MHz的开关频率和仅250mV的LED反馈电压，可实现小型化和低轮廓的2.2μH电感器设计。 3. **I2C兼容接口**：支持最高400kbps的数据传输速率，方便用户通过I2C接口编程设定LED电流或输出电压。 4. **零延迟TX-Masking输入**（仅限TPS61050）：用于与相机模块的快速同步闪光。 5. **硬件电压模式选择输入**（仅限TPS61052）：提供额外的电压调节操作模式，可以为系统中的其他高功率设备供电，如音频功率放大器。 6. **集成ADC**：用于监测LED正向电压，确保稳定工作。 7. **低光亮度调制模式**：支持在低光照条件下调整LED亮度。 8. **安全保护功能**：包括LED断开保护、短路保护和过温保护，确保系统稳定运行。 9. **快速LED启动**：通过FLASH_SYNC引脚实现快速LED开启，适用于高精度的闪光灯同步需求。 10. **小体积封装**：采用12-pin NanoFree™（CSP）和10-pin QFN封装，减小了整体尺寸。 **应用场景：** TPS61052广泛应用于需要高亮度LED照明的场合，如智能手机的闪光灯、相机闪光、LCD背光以及其他需要提高电池电压的场合。其高效的转换和灵活的操作模式使得在有限的电池电量下也能保证稳定的亮度输出。 **总结：** TI的TPS61052是一款高效、多功能的白光LED驱动器，它通过集成的I2C接口和多种保护机制，为高功率LED驱动提供了安全可靠的解决方案。其2MHz的开关频率和小体积封装设计，使得它在便携式设备中得到了广泛应用，尤其是在需要精确控制和高效能源管理的场合。

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VOUT

AVIN

LED

PGND

AGND

GPIO

SDA

SCL

CI/F

FLASH_SYNC

TPS61050

2.2 Hm

10 F

OUT

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

TPS61050

TPS61052

SLUS525A –MARCH 2007–REVISED SEPTEMBER 2015

TPS6105x 1.2-A High-Power White LED Driver

2-MHz Synchronous Boost Converter With I

C Compatible Interface

1 Features 3 Description

The TPS6105x device is based on a high-frequency

• Four Operational Modes

synchronous-boost topology with constant current

– Torch and Flash up to I

LED

= 1200 mA

sink to drive single white LEDs. The device uses an

– Voltage-Regulated Boost Converter: 4.5 V, 5

inductive fixed-frequency PWM control scheme using

V, and 5.25 V

small external components, minimizing input ripple

current.

– Shutdown: 0.3 μA (Typical)

The 2-MHz switching frequency allows the use of

• Total Solution Circuit Area < 25 mm

small and low profile 2.2-μH inductors. To optimize

• Up to 96% Efficiency

overall efficiency, the device operates with only a

• I

C-Compatible Interface up to 400 kbps

250-mV LED feedback voltage.

• Integrated LED Turnon Safety Timer

The TPS6105x device not only operates as a

• Zero Latency TX-Masking Input (TPS61050)

regulated current source, but also as a standard

• Hardware Voltage Mode Selection Input

voltage-boost regulator. This additional operating

mode can be useful to supply other high-power

(TPS61052)

devices in the system, such as a hands-free audio

• Integrated ADC for LED V

Monitoring

power amplifier, or any other component requiring a

• Integrated Low Light Dimming Mode

supply voltage higher than the battery voltage (refer

• LED Disconnect During Shutdown

to TPS61052).

• Open and Shorted LED Protection

For highest flexibility, the LED current or the desired

• Overtemperature Protection

output voltage can be programmed through an I

compatible interface. To simplify flash

• Available in a 12-Pin NanoFree™ (CSP) and

synchronization with the camera module, the device

10-Pin QFN Packaging

offers a trigger pin (FLASH_SYNC) for fast LED

turnon time.

2 Applications

When the TPS6105x is not in use, it can be put into

• Camera White LED Torch/Flash for Cell Phones,

shutdown mode through the I

C-compatible interface,

Smart-Phones and PDAs

reducing the input current to 0.3 μA (typical). During

• Audio Amplifier Power Supply

shutdown, the LED pin is high impedance to avoid

leakage current through the LED.

Typical Application Schematic

Device Information

(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

VSON (10) 3.00 mm × 3.00 mm

TPS61050

TPS61052

DSBGA (12) 1.96 mm × 1.46 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPS61050

TPS61052

SLUS525A –MARCH 2007–REVISED SEPTEMBER 2015

www.ti.com

Table of Contents

7.5 Programming........................................................... 20

1 Features.................................................................. 1

7.6 Register Maps......................................................... 24

2 Applications ........................................................... 1

8 Application and Implementation ........................ 29

3 Description ............................................................. 1

8.1 Application Information............................................ 29

4 Revision History..................................................... 2

8.2 Typical Applications ................................................ 29

5 Pin Configuration and Functions......................... 3

9 Power Supply Recommendations...................... 38

6 Specifications......................................................... 4

10 Layout................................................................... 38

6.1 Absolute Maximum Ratings ...................................... 4

10.1 Layout Guidelines ................................................. 38

6.2 ESD Ratings.............................................................. 4

10.2 Layout Example .................................................... 38

6.3 Recommended Operating Conditions....................... 4

10.3 Thermal Considerations........................................ 38

6.4 Thermal Information.................................................. 4

11 Device and Documentation Support ................. 40

6.5 Electrical Characteristics........................................... 5

11.1 Device Support...................................................... 40

6.6 I

C Interface Timing Characteristics ........................ 6

11.2 Related Links ........................................................ 40

6.7 Typical Characteristics.............................................. 8

11.3 Trademarks ........................................................... 40

7 Detailed Description............................................ 11

11.4 Electrostatic Discharge Caution............................ 40

7.1 Overview ................................................................. 11

11.5 Glossary ................................................................ 40

7.2 Functional Block Diagram ....................................... 12

12 Mechanical, Packaging, and Orderable

7.3 Feature Description................................................. 14

Information ........................................................... 40

7.4 Device Functional Modes........................................ 15

12.1 Package Summary................................................ 40

4 Revision History

Changes from Original (March 2007) to Revision A Page

• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional

Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device

and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1

• Updated names of the pinout drawings to reflect the new standards .................................................................................... 3

• Deleted Dissipation Ratings table ........................................................................................................................................... 4

Product Folder Links: TPS61050 TPS61052

TPS61050

TPS61052

SLUS525A –MARCH 2007–REVISED SEPTEMBER 2015

www.ti.com

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Voltage on AVIN, VOUT, SW, LED

(2)

–0.3 7 V

Voltage on SCL, SDA, FLASH_SYNC, GPIO, ENVM

(2)

–0.3 7 V

Input current on GPIO 25 mA

Operating ambient temperature

(3)

–40 85 °C

J (MAX)

Maximum operating junction temperature 150 °C

stg

Storage temperature –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.

(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (T

A(max)

) is dependent on the maximum operating junction temperature (T

J(max)

), the

maximum power dissipation of the device in the application (P

D(max)

), and the junction-to-ambient thermal resistance of the part/package

in the application (θ

), as given by the following equation: T

A(max)

= T

J(max)

–(θ

× P

D(max)

6.2 ESD Ratings

VALUE UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-

(ESD)

Electrostatic discharge ±1000 V

C101

(2)

Machine model (MM) ±200

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

Input voltage range 2.5 3.6 6 V

Output voltage range in Current regulator mode V

5.5

OUT

Output voltage range in Voltage regulator mode 4.5 5.25

L Inductance effective value range 1.3 2.2 2.9 V

Input capacitance range 10 µH

OUT

Output capacitance effective value range 3 10 50 µF

Operating junction temperature –40 125

6.4 Thermal Information

TPS6105x

THERMAL METRIC

(1)

DRC (VSON) YZG (DSBGA) UNIT

10 PINS 12 PINS

θJA

Junction-to-ambient thermal resistance 48.5 82 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 67.4 0.6 °C/W

θJB

Junction-to-board thermal resistance 23 35 °C/W

Junction-to-top characterization parameter 1.8 2.6 °C/W

Junction-to-board characterization parameter 23.1 19.1 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance 5.3 N/A °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

Product Folder Links: TPS61050 TPS61052

TPS61050

TPS61052

www.ti.com

SLUS525A –MARCH 2007–REVISED SEPTEMBER 2015

6.5 Electrical Characteristics

Unless otherwise noted the specification applies for V

= 3.6 V over an operating junction temp. of –40°C ≤ T

≤ 125°C.

Typical values are for T

= 25°C.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

SUPPLY CURRENT

Input voltage 2.5 6 V

Minimum input voltage for start-up MODE_CTRL[1:0] = 11, OV[1:0] = 01, R

= 10 Ω 2.5 V

Operating quiescent current into AVIN MODE_CTRL[1:0] = 01, I

LED

= 0 mA 8.5 mA

MODE_CTRL[1:0] = 00, OV[1:0] ≠ 11

0.3 3 μA

–40°C ≤ T

≤ 85°C

Shutdown current into AVIN

MODE_CTRL[1:0] = 00, OV[1:0] = 11

140 μA

–40°C ≤ T

≤ 85°C

UVLO

Undervoltage lockout threshold V

falling 2.3 2.4 V

OUTPUT

Current regulator mode V

5.5

OUT

Output voltage V

Voltage regulator mode 4.5 5.25

OVP Output overvoltage protection V

OUT

rising 5.7 6 6.25 V

OVP

Output overvoltage protection hysterisis 0.15 V

D Minimum duty cycle 7.5%

0.25 V ≤ V

LED

≤ 2 V,

–15% 15%

50 mA ≤ I

LED

≤ 250 mA, T

= 50°C

LED current accuracy

(1)

0.25 V ≤ V

LED

≤ 2 V,

–12% 12%

200 mA ≤ I

LED

≤ 1200 mA, T

= 50°C

LED current temperature coefficient 0.08 %/°C

DC output voltage accuracy 2.5 V ≤ V

≤ 0.9 V

OUT

, PWM operation –3% 3%

LED

LED sense voltage I

LED

= 1200 mA 250 mV

LED input leakage current V

LED

= V

OUT

= 5 V, –40°C ≤ T

≤ 85°C 0.1 1 μA

POWER SWITCH

Switch MOSFET on-resistance 80

DS(on)

OUT

= V

= 3.6 V mΩ

Rectifier MOSFET on-resistance 80

Switch MOSFET leakage 0.1 1

lkg(SW)

= 6 V, –40°C ≤ T

≤ 85°C μA

Rectifier MOSFET leakage 0.1 1

2.5 V ≤ V

≤ 6 V, ILIM bits = 00 850 1000 1150

1275 1500 1725

lim

Switch current limit 2.5 V ≤ V

≤ 6 V, ILIM bits = 01, 10

(1)

1700 2000 2300

2.5 V ≤ V

≤ 6 V, ILIM bits = 11

(1)

Thermal shutdown

(1)

140 160 °C

Thermal shutdown hysteresis

(1)

20 °C

OSCILLATOR

Oscillator frequency 1.8 2 2.2 MHz

ADC

Resolution 3 Bits

Total error

(1)

LED

= 0.25 V, assured monotonic by design ±0.25 ±1 LSB

SDA, SCL, GPIO, ENVM, FLASH_SYNC

(IH)

High-level input voltage 1.2 V

(IL)

Low-level input voltage 0.4 V

Low-level output voltage (SDA) I

= 8 mA 0.3

(OL)

Low-level output voltage (GPIO) DIR = 1, I

= 8 mA 0.3

(LKG)

Logic input leakage current Input connected to V

or GND, –40°C ≤ T

≤ 85°C 0.01 0.1 μA

GPIO pulldown resistance DIR = 0, GPIO ≤ 0.4 V (TPS61050) 400 kΩ

ENVM pulldown resitance ENVM ≤ 0.4 V (TPS61052) 400 kΩ

FLASH_SYNC pulldown resistance FLASH_SYNC ≤ 0.4 V 400 kΩ

(1) Assured by design. Not tested in production.

Product Folder Links: TPS61050 TPS61052

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