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TI-TPS7H2211-SP.pdf
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TPS7H2211-SP Radiation-Hardness-Assured (RHA) 14-V, 3.5-A eFuse
1 Features
• Total ionizing dose (TID) characterized to 100
krad(Si)
– Radiation hardness assurance availability of
100 krad(Si)
• Single-event effects (SEE) characterized
– Single-event latchup (SEL), single-event
burnout (SEB), and single-event gate rupture
(SEGR) immune to linear energy transfer (LET)
= 75 MeV-cm
2
/mg*
– Single-event functional interrupt (SEFI) and
single-event transient (SET) characterized to
LET = 75 MeV-cm
2
/mg*
• Integrated single channel eFuse
• Input voltage range: 4.5 V to 14 V
• Low on-resistance (R
ON
) of 60-mΩ maximum at
25°C and VIN = 12 V
• 3.5-A maximum continuous switch current
• Low control input threshold aids in use of
1.2-V, 1.8-V, 2.5-V, and 3.3-V logic
• Configurable rise time (soft start)
• Reverse current protection (RCP)
• Overvoltage protection (OVP)
• Internal current limit (fast-trip)
• Thermal shutdown
• Ceramic package with thermal pad
• Available in military (–55°C to 125°C) temperature
range
*See TPS7H2211-SP SEE radiation report for test conditions
and full information
2 Applications
• Satellite electrical power system (EPS)
• Cold sparing power supplies (redundancy)
• Power supply sequencing
• Command and data handling
• Communications payload
• Radiation hardened and tolerant power tree
3 Description
The TPS7H2211-SP is a single channel eFuse
(integrated FET load switch with additional features)
that provides reverse current protection, overvoltage
protection, and a configurable rise time to minimize
inrush current (soft start). The device contains P-
channel MOSFETs that operate over an input voltage
range of 4.5 V to 14 V and supports a maximum
continuous current of 3.5 A.
The switch is controlled by an on and off input
(EN), which is capable of interfacing directly with
low-voltage control signals. Overvoltage protection
and soft start are programmable with few external
components through the OVP and SS pins. The
TPS7H2211-SP is available in a ceramic package
with an exposed thermal pad allowing for improved
thermal performance.
Device Information
PART NUMBER
(2)
GRADE
(3)
PACKAGE
5962R1822001VXC
Flight grade QMLV-
RHA 100 krad(Si)
16-pin CFP
11.00 × 9.60 mm
Mass = 1.56 g
(5)
5962-1822001VXC Flight grade QMLV
TPS7H2211HKR/EM
Engineering
sample
(4)
5962R1822001V9A
(1)
Flight grade QMLV-
RHA KGD
Known good die
3.66 × 5.75 mm
TPS7H2211EVM-CVAL Evaluation module Evaluation board
(1) In preview and planned for near future release.
(2) For all available packages, see the orderable addendum at
the end of the data sheet.
(3) For additional information about part grade, view SLYB235.
(4) These units are intended for engineering evaluation only.
They are processed to a noncompliant flow. These units are
not suitable for qualification, production, radiation testing or
flight use. Parts are not warranted for performance over the
full MIL specified temperature range of –55°C to 125°C or
operating life.
(5) Mass is accurate to ±10%.
TPS7H2211-SP
EN
GND
VIN VOUT
OVP
SS
C
SS
VIN
R
BOT_OVP
R
TOP_ OVP
R
TOP_ EN
R
BOT_EN
VOUT
Simplified Schematic
TPS7H2211-SP
SLVSEW6A – AUGUST 2021 – REVISED NOVEMBER 2021
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Related Products............................................................. 2
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 7
7.1 Absolute Maximum Ratings........................................ 7
7.2 ESD Ratings............................................................... 7
7.3 Recommended Operating Conditions.........................8
7.4 Thermal Information....................................................8
7.5 Electrical Characteristics.............................................9
7.6 Switching Characteristics.......................................... 11
7.7 Quality Conformance Inspection............................... 11
7.8 Typical Characteristics.............................................. 12
8 Parameter Measurement Information.......................... 15
9 Detailed Description......................................................17
9.1 Overview................................................................... 17
9.2 Functional Block Diagram......................................... 17
9.3 Feature Description...................................................18
9.4 Device Functional Modes..........................................23
10 Application and Implementation................................ 24
10.1 Application Information........................................... 24
10.2 Typical Applications................................................ 24
11 Power Supply Recommendations..............................34
12 Layout...........................................................................34
12.1 Layout Guidelines................................................... 34
12.2 Layout Example...................................................... 34
13 Device and Documentation Support..........................35
13.1 Device Support....................................................... 35
13.2 Documentation Support.......................................... 35
13.3 Receiving Notification of Documentation Updates..35
13.4 Support Resources................................................. 35
13.5 Trademarks.............................................................35
13.6 Electrostatic Discharge Caution..............................35
13.7 Glossary..................................................................35
14 Mechanical, Packaging, and Orderable
Information.................................................................... 36
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision * (August 2021) to Revision A (November 2021) Page
• Released 5962R1822001VXC device................................................................................................................ 1
• Changed the device classification from "load switch" to "eFuse" and updated associated verbiage throughout
the document...................................................................................................................................................... 1
• Added additional information about the NC pins and added a default recommendation....................................3
5 Related Products
DEVICE VIN RANGE MAXIMUM OUTPUT CURRENT
PROGRAMMABLE
CURRENT LIMIT
CURRENT SENSE
TPS7H2211-SP 4.5 V to 14 V 3.5 A No No
TPS7H2201-SP 1.5 V to 7 V 6 A Yes Yes
TPS7H2211-SP
SLVSEW6A – AUGUST 2021 – REVISED NOVEMBER 2021
www.ti.com
2 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TPS7H2211-SP
6 Pin Configuration and Functions
Thermal Pad
VIN
2
3
4
5
6
7
8
15
14
13
12
11
10
9
VIN
VIN
NC
EN
OVP
GND
VOUT
VOUT
VOUT
SS
NC
NC
NC
VIN
1
16
VOUT
Figure 6-1. HKR Package
16-Pin CFP With Thermal Pad
(Top View)
Table 6-1. Pin Functions
PIN
I/O DESCRIPTION
NO. NAME
1
VIN I Switch input. An input bypass capacitor is recommended for minimizing VIN dip.
2
3
4
6 EN I Active high switch control input. Do not float this pin.
7 OVP I
Overvoltage protection. Set using an external resistor divider. If no OVP is desired, connect
this pin to GND. Do not float this pin.
8 GND — Device ground.
12 SS I/O
Soft start (switch slew rate control). If this functionality is not desired, the SS pin must be left
disconnected (floating). In all cases be sure to follow the requirements of Section 9.3.3.
13
VOUT O Switch output. A minimum 10-µF output capacitor is recommended.
14
15
16
5
NC —
NC — No connect. These pins are not internally connected. It is recommended to connect
these pins to GND to prevent charge buildup; however, these pins can also be left open or
tied to any voltage between GND and VIN.
9
10
11
— Thermal Pad —
Thermal pad (exposed center pad) for heat dissipation purposes. The thermal pad is
internally connected to the seal ring and GND.
— Metal Lid — The lid is internally connected to the thermal pad and GND through the seal ring.
www.ti.com
TPS7H2211-SP
SLVSEW6A – AUGUST 2021 – REVISED NOVEMBER 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TPS7H2211-SP
Table 6-2. Bare Die Information
DIE THICKNESS BACKSIDE FINISH
BACKSIDE
POTENTIAL
BOND PAD METALLIZATION
COMPOSITION
BOND PAD THICKNESS
15 mils Silicon with backgrind Ground AlCu 1050 nm
2 3 4 1
5 6 7 8
9 10 11 12
13 14 15 16
17 18 19 20
21 22 23 24
61 60 59 58
57 56 55 54
53 52 51 50
49 48 47 46
45 44 43 42
41 40 39 38
25
26
27
28
29
30
31
32 33 34
35
36
37
3510
5670
76
5746
3662
0
0
1. All dimensions in microns (μm).
2. The inner rectangle is the die and the outer rectangle is the die plus scribe lines.
TPS7H2211-SP
SLVSEW6A – AUGUST 2021 – REVISED NOVEMBER 2021
www.ti.com
4 Submit Document Feedback
Copyright © 2021 Texas Instruments Incorporated
Product Folder Links: TPS7H2211-SP
Table 6-3. Bond Pad Coordinates in Microns (μm)
DESCRIPTION PAD NUMBER X MIN Y MIN X MAX Y MAX
VIN 1 725.8 5485.5 881.3 5641
VIN 2 169.3 5485.5 324.8 5641
VIN 3 354.8 5485.5 510.3 5641
VIN 4 540.3 5485.5 695.8 5641
VIN 5 169.3 5300 324.8 5455.5
VIN 6 354.8 5300 510.3 5455.5
VIN 7 540.3 5300 695.8 5455.5
VIN 8 725.8 5300 881.3 5455.5
VIN 9 169.3 5087.95 324.8 5243.45
VIN 10 354.8 5087.95 510.3 5243.45
VIN 11 540.3 5087.95 695.8 5243.45
VIN 12 725.8 5087.95 881.3 5243.45
VIN 13 169.3 4902.45 324.8 5057.95
VIN 14 354.8 4902.45 510.3 5057.95
VIN 15 540.3 4902.45 695.8 5057.95
VIN 16 725.8 4902.45 881.3 5057.95
VIN 17 169.3 3947.9 324.8 4103.4
VIN 18 354.8 3947.9 510.3 4103.4
VIN 19 540.3 3947.9 695.8 4103.4
VIN 20 725.8 3947.9 881.3 4103.4
VIN 21 169.3 3762.4 324.8 3917.9
VIN 22 354.8 3762.4 510.3 3917.9
VIN 23 540.3 3762.4 695.8 3917.9
VIN 24 725.8 3762.4 881.3 3917.9
VINA
(1)
25 61.1 2025.65 216.6 2181.15
VINA
(1)
26 61.1 1836.15 216.6 1991.65
NC 27 61.1 1645.3 216.6 1800.8
NC 28 61.1 1376.35 216.6 1531.85
EN 29 61.1 1080.75 216.6 1236.25
NC 30 61.1 645.9 216.6 801.4
OVP 31 61.1 451.4 216.6 606.9
GND 32 452.45 61.1 607.95 216.6
GND 33 641.95 61.1 797.45 216.6
NC 34 3103.2 61.1 3258.7 216.6
NC 35 3683.4 652.7 3838.9 808.2
NC 36 3683.4 1221.4 3838.9 1376.9
SS 37 3683.4 1715.65 3838.9 1871.15
VOUT 38 3575.15 3762.4 3730.65 3917.9
VOUT 39 3389.65 3762.4 3545.15 3917.9
VOUT 40 3204.15 3762.4 3359.65 3917.9
VOUT 41 3018.65 3762.4 3174.15 3917.9
VOUT 42 3575.15 3947.9 3730.65 4103.4
VOUT 43 3389.65 3947.9 3545.15 4103.4
VOUT 44 3204.15 3947.9 3359.65 4103.4
VOUT 45 3018.65 3947.9 3174.15 4103.4
www.ti.com
TPS7H2211-SP
SLVSEW6A – AUGUST 2021 – REVISED NOVEMBER 2021
Copyright © 2021 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: TPS7H2211-SP
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