2
UCC5310
,
UCC5320
,
UCC5350
,
UCC5390
ZHCSGC2F –JUNE 2017–REVISED JANUARY 2019
www.ti.com.cn
版权 © 2017–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 功功能能框框图图((S、、E 和和 M 版版本本)).................................. 1
5 修修订订历历史史记记录录 ........................................................... 3
6 Device Comparison Table..................................... 4
7 Pin Configuration and Function........................... 5
8 Specifications......................................................... 6
8.1 Absolute Maximum Ratings ...................................... 6
8.2 ESD Ratings.............................................................. 6
8.3 Recommended Operating Conditions....................... 6
8.4 Thermal Information.................................................. 7
8.5 Power Ratings........................................................... 7
8.6 Insulation Specifications for D Package.................... 8
8.7 Insulation Specifications for DWV Package.............. 9
8.8 Safety-Related Certifications For D Package ......... 10
8.9 Safety-Related Certifications For DWV Package.... 10
8.10 Safety Limiting Values .......................................... 10
8.11 Electrical Characteristics....................................... 11
8.12 Switching Characteristics...................................... 13
8.13 Insulation Characteristics Curves ......................... 14
8.14 Typical Characteristics.......................................... 15
9 Parameter Measurement Information ................ 22
9.1 Propagation Delay, Inverting, and Noninverting
Configuration............................................................ 22
10 Detailed Description ........................................... 25
10.1 Overview ............................................................... 25
10.2 Functional Block Diagram ..................................... 25
10.3 Feature Description............................................... 27
10.4 Device Functional Modes...................................... 31
11 Application and Implementation........................ 33
11.1 Application Information.......................................... 33
11.2 Typical Application ............................................... 33
12 Power Supply Recommendations ..................... 39
13 Layout................................................................... 40
13.1 Layout Guidelines ................................................. 40
13.2 Layout Example .................................................... 41
13.3 PCB Material......................................................... 43
14 器器件件和和文文档档支支持持 ..................................................... 44
14.1 文档支持................................................................ 44
14.2 认证 ....................................................................... 44
14.3 相关链接................................................................ 44
14.4 接收文档更新通知 ................................................. 44
14.5 社区资源................................................................ 44
14.6 商标 ....................................................................... 44
14.7 静电放电警告......................................................... 44
14.8 术语表 ................................................................... 44
15 机机械械、、封封装装和和可可订订购购信信息息....................................... 45