2
LM2733
ZHCSJK1G –NOVEMBER 2002–REVISED MAY 2019
www.ti.com.cn
Copyright © 2002–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 3
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 4
6.6 Typical Characteristics.............................................. 6
7 Detailed Description............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 11
8 Application and Implementation ........................ 12
8.1 Application Information............................................ 12
8.2 Typical Application .................................................. 12
9 Power Supply Recommendations...................... 18
10 Layout................................................................... 18
10.1 Layout Guidelines ................................................. 18
10.2 Layout Example .................................................... 18
11 器器件件和和文文档档支支持持 ..................................................... 19
11.1 商标 ....................................................................... 19
11.2 静电放电警告......................................................... 19
11.3 Glossary................................................................ 19
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 19
4 修修订订历历史史记记录录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision F (December 2014) to Revision G Page
• 已更改 典型应用电路图像，以更正异常的连接器线路。 ........................................................................................................ 1
Changes from Revision E (April 2013) to Revision F Page
• 已添加
引脚配置和功能
部分、ESD
额定值
表、
特性 说明
部分，
器件功能模式
，
应用和实施
部分，
电源相关建议
部
分，
布局
部分，
器件和文档支持
部分以及
机械、封装和可订购信息
部分 ................................................................................ 1
Changes from Revision D (April 2013) to Revision E Page
• Changed layout of National Semiconductor Data Sheet to TI format .................................................................................. 11
