Acknowledgment
Members of the IPC Association Connecting Electronics Industries® IPC Plastic Chip Carrier Cracking Task Group (B-10a)
and the JEDEC Solid State Technology Association JEDEC JC-14.1 Committee on Reliability Test Methods for Packaged
Devices have worked together to develop this document. We would like to thank them for their dedication to this effort.
Any document involving a complex technology draws material from a vast number of sources across many continents. While
the principal members of the Joint Moisture Classification Working Group are shown below, it is not possible to include all
of those who assisted in the evolution of this standard. To each of them, the members of the IPC and JEDEC extend their
gratitude.
IPC Plastic Chip Carrier
Cracking Task Group
Chair
Steven R. Martell
Sonoscan, Inc.
JEDEC JC 14.1
Committee
Chair
Ife Hsu
Intel Corporation
Vice Chair
Gautam Verma
Altera Corporation
Joint Moisture Classification Working Group Members
Doug Derry, AccuAssembly
David Gaydos, ACI Technologies,
Inc.
Russell Nowland, Alcatel-Lucent
Bradley Smith, Allegro MicroSystems
Inc.
Maurice Brodeur, Analog Devices
Inc.
Bill Strachan, ASTA - Portsmouth
University
Lyle Burhenn, BAE Systems
Platform Solutions
Thomas Cleere, BAE Systems
Platform Solutions
Joseph Kane, BAE Systems Platform
Solutions
Mary Bellon, Boeing Research &
Development
Tim Chaudhry, Broadcom
Corporation
Glenn Koscal, Carsem
Francois Monette, Cogiscan Inc.
Stuart Longgood, Delphi Electronics
and Safety
Michael Pepples, Delphi Electronics
and Safety
Mark Northrup, Dynamic Research
and Testing Laboratories, LLC
Paul Austen, Electronic Controls
Design Inc.
Nicholas Lycoudes, Freescale
Semiconductor
Deepak Pai, General Dynamics Info.
Sys., Inc.
Enrico Galbiati, GEST Labs S.r.l. a
Socio Unico
Gergely Csohany, Harman/Becker
Automotive Systems Kft.
Keith Newman, Hewlett-Packard
Company
Kristen Troxel, Hewlett-Packard
Company
Jennie Hwang, H-Technologies
Group
Curtis Grosskopf, IBM Corporation
Mario Interrante, IBM Corporation
Paul Krystek, IBM Corporation
Charles Reynolds, IBM Corporation
Ife Hsu, Intel Corporation
James Maguire, Intel Corporation
Stephen Tisdale, Intel Corporation
Mark Kwoka, Intersil Corporation
Quyen Chu, Jabil Circuit, Inc.
Marty Rodriguez, Jabil Circuit, Inc.
(HQ)
Girish Wable, Jabil Circuit, Inc. (HQ)
Julie Carlson, JEDEC
Ken McGhee, JEDEC
Akikazu Shibata, JPCA-Japan
Electronics Packaging and Circuits
Association
Leland Woodall, Keihin Carolina
System Technology
James Mark Bird, MBird and
Associates
Kurk Kan, Murata Power Solutions,
Inc.
Dongkai Shangguan, National Center
for Advanced Packaging, China
Mumtaz Bora, Peregrine
Semiconductor
Arnold Offner, Phoenix Contact
Timothy Pitsch, Plexus Corporation
Elvira Preecha, Qualcomm
Technologies Inc.
Richard Iodice, Raytheon Company
James Robbins, Raytheon Company
Jeff Shubrooks, Raytheon Company
Christian Klein, Robert Bosch GmbH
Srinivas Chada, Schlumberger Well
Services
Michelle Ogihara, Seika Machinery
Inc.
Steven Martell, Sonoscan Inc.
Francis Classe, Spansion
Brent Beamer, Static Control
Components, Inc.
Raymond Cirimele, STI Electronics,
Inc.
Amol Kirtikar, Sud-Chemie Inc.
Performance Packaging
Robert DiMaggio, Sud-Chemie
Performance Package
Michelle Martin, Sud-Chemie
Performance Package
Steven Kummerl, Texas Instruments
Inc.
John Radman, Trace Laboratories -
Denver
Michael Moore, U.S. Army Aviation
& Missile Command
Joseph Thomas, ZN Technologies
Kevin Weston
In Memorium
The Joint Committee would like to especially acknowledge Jack T. McCullen and Richard L. Shook for their outstanding
contributions and leadership in the development of J-STD-020.
January 2015 IPC/JEDEC J-STD-020E
iii
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吾性圣人2022-01-13Very good! J-STD-020E,December 2014.
