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JESD51-7 High Effective Thermal Conductivity
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2020-12-03
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JEDEC标准文件,描述芯片热导率(Rja)的测量和计算方法。 常规的测试方法就是将IC直接焊接在PCB上,同时参考JESD51-1和JESD51-2相关标准
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EIA/JEDEC
STANDARD
High Effective Thermal Conductivity
Test Board for Leaded Surface Mount
Packages
JESD51-7
FEBRUARY 1999
ELECTRONIC INDUSTRIES ALLIANCE
JEDEC Solid State Technology Association
NOTICE
EIA/JEDEC standards and publications contain material that has been prepared, reviewed, and
approved through the JEDEC Board of Directors level and subsequently reviewed and approved
by the EIA General Counsel.
EIA/JEDEC standards and publications are designed to serve the public interest through
eliminating misunderstandings between manufacturers and purchasers, facilitating
interchangeability and improvement of products, and assisting the purchaser in selecting and
obtaining with minimum delay the proper product for use by those other than JEDEC members,
whether the standard is to be used either domestically or internationally.
EIA/JEDEC standards and publications are adopted without regard to whether or not their
adoption may involve patents or articles, materials, or processes. By such action JEDEC does not
assume any liability to any patent owner, nor does it assume any obligation whatever to parties
adopting the EIA/JEDEC standards or publications.
The information included in EIA/JEDEC standards and publications represents a sound approach
to product specification and application, principally from the solid state device manufacturer
viewpoint. Within the JEDEC organization there are procedures whereby an EIA/JEDEC
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No claims to be in conformance with this standard may be made unless all requirements stated in
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Inquiries, comments, and suggestions relative to the content of this EIA/JEDEC standard or
publication should be addressed to JEDEC Solid State Technology Association, 2500 Wilson
Boulevard, Arlington, VA 22201-3834, (703)907-7560/7559 or www.jedec.org
Published by
©ELECTRONIC INDUSTRIES ALLIANCE 1999
Engineering Department
2500 Wilson Boulevard
Arlington, VA 22201-3834
"Copyright" does not apply to JEDEC member companies as they are
free to duplicate this document in accordance with the latest revision of
JEDEC Publication 21 "Manual of Organization and Procedure".
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Catalog of JEDEC Engineering Standards and Publications or call Global Engineering
Documents, USA and Canada (1-800-854-7179), International (303-397-7956)
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