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MIL-STD-883L-2:2022 – 最新完整英文电子版(393页).Change 1
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MIL-STD-883-2:2022 DoD Microcircuits Test Method Standard - Mechanical Test Methods Part 2:Test Methods 2000-2999 – 完整英文电子版(393页)
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MIL-STD-883-2
w/ CHANGE1
12 January 2022
SUPERSEDING
MIL-STD-883-2
16 September 2019
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
MECHANICAL TEST METHODS FOR MICROCIRCUITS
PART 2: TEST METHODS 2000-2999
AMSC N/A
FSC 5962
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
This document and process
conversion measures necessary to
comply with this change shall be
completed by 11 July 2022.
INCH - POUND
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MIL-STD-883-2
w/CHANGE 1
ii
FOREWORD
1. T
his standard is approved for use by all Departments and Agencies of the Department of Defense.
2. This entire standard has been revised. This revision has resulted in many changes to the format, but the most
significant one is the splitting the document into parts. See MIL–STD–883 for the change summary.
3. Comment, suggestions, or questions on this document should be addressed to: Commander, Defense Logistics
Agency, ATTN: DLA Land and Maritime - VA, P.O. Box 3990, Columbus, OH 43218-3990, or by email to
STD883@dla.mil. Since contact information can change, you may want to verify the currency of this address
information using the ASSIST Online database at: https://assist.dla.mil.
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MIL-STD-883-2
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iii
CONTENTS
PARAGRAPH Page
1. SCOPE ...............................................................................................................................
1
1.1 Purpose ............................................................................................................................ 1
1.2 Numbering system ........................................................................................................... 1
2. APPLICABLE DOCUMENTS ............................................................................................. 1
2.1 General ............................................................................................................................. 1
2.2 Government documents ................................................................................................... 1
2.3 Non-Government publications .......................................................................................... 3
2.4 Order of precedence ........................................................................................................ 5
3. DEFINITIONS ..................................................................................................................... 5
3.1 Abbreviations, symbols, and definitions............................................................................ 5
4. GENERAL REQUIREMENTS ............................................................................................ 8
4.1 General ............................................................................................................................. 8
4.2 Test circuits ...................................................................................................................... 8
4.3 Destructive tests ............................................................................................................... 8
4.4 Non-destructive tests ........................................................................................................ 9
4.5 Laboratory suitability ........................................................................................................ 9
4.6 Method of reference ......................................................................................................... 9
5. DETAIL REQUIREMENTS ................................................................................................. 9
6. NOTES ............................................................................................................................... 9
6.1 Intended use ..................................................................................................................... 9
6.2 International standardization agreement .......................................................................... 9
6.3 Subject term (key word) listing ......................................................................................... 10
6.4 Supersession data ............................................................................................................ 10
6.5 Change notations ............................................................................................................. 10
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MIL-STD-883-2
w/CHANGE 1
iv
MECHANICAL TESTS
2001.4 Constant acceleration
2002.5 Mechanical shock
2003.14 Solderability
2004.7 Lead integrity
2005.2 Vibration fatigue
2006.1 Vibration noise
2007.3 Vibration, variable frequency
2008.1 Visual and mechanical
2009.15 External visual
2010.14 Internal visual (monolithic)
2011.10 Bond strength (destructive bond pull test)
2012.11 Radiography
2013.1 Internal visual inspection for DPA
2014 Internal visual and mechanical
2015.14 Resistance to solvents
2016 Physical dimensions
2017.14 Internal visual (hybrid)
2018.6 Scanning electron microscope (SEM) inspection of metallization
2019.11 Die shear strength
2020.9 Particle impact noise detection test
2021.3 Glassivation layer integrity
2022.3 Wetting balance solderability
2023.8 Nondestructive bond pull
2024.2 Lid torque for glass-frit-sealed packages
2025.4 Adhesion of lead finish
2026 Random vibration
2027.2 Substrate attach strength
2028.4 Pin grid package destructive lead pull test
2029.1 Ceramic chip carrier bond strength
2030.2 Ultrasonic inspection of die attach
2031.1 Flip chip pull-off test
2032.3 Visual inspection of passive elements
2035 Ultrasonic inspection of TAB bonds
2036.1 Resistance to soldering heat
2037.2 X-Ray Fluorescence (XRF) Scan for Tin (Sn)-Lead (Pb) Content Analysis
2038 Solder Column Package Destructive Lead Pull Test
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MIL-STD-883-2
w/CHANGE 1
1
1. SCOPE
1.1 Purpose. Part 2 of this test method standard establishes uniform test methods for the mechanical testing to
determine resistance to deleterious effects of natural elements and conditions surrounding military operations. For
the purpose of this standard, the term "devices" includes such items as monolithic, multichip, film and hybrid
microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is
intended to apply only to microelectronic devices.
1.2 Numbering system. The test methods are designated by numbers assigned in accordance with the following
system:
1.2.1 Classification of tests. The mechanical test methods included in this part of a multipart test method standard
are numbered 2001 to 2038 inclusive.
1.2.2 Test method revisions. Revisions are numbered consecutively using a period to separate the test method
number and the revision number. For example, 2001.2 designates the second revision of test method 2001.
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, and 5 of this standard. This
section does not include documents cited in other sections of this standard or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements documents cited in sections 3, 4, and 5 of this
standard, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-680 - Degreasing Solvent, Performance Specification For.
MIL-PRF-19500 - Semiconductor Devices, General Specification For.
MIL-PRF-38534 - Hybrid Microcircuits, General Specification For.
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification For.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-202 - Electronic and Electrical Component Parts.
MIL-STD-750 - Test Methods for Semiconductor Devices.
MIL-STD-1835 - Electronic Component Case Outlines.
MIL-STD-1916 - DOD Preferred Methods for Acceptance of Product.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-217 - Reliability Prediction of Electronic Equipment.
MIL-HDBK-505 - Definitions of Item Levels, Item Exchangeability, Models, and Related Terms.
MIL-HDBK-781 - Reliability Test Methods, Plans, and Environments for Engineering, Development
Qualification, and Production .
MIL-HDBK-1331 - Parameters to be Controlled for the Specification of Microcircuits.
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