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MIL-STD-883-1:2019 完整英文电子版(217页)
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MIL-STD-883-1:2019 DoD Microcircuits Test Method Standard - Environmental Test Methods - Part 1:Test Methods 1000-1999 – 完整英文电子版(217页)
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MIL-STD-883-1
16 September 2019
SUPERSEDING
MIL-STD-883K
w/CHANGE 3
3 May 2018
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
ENVIRONMENTAL TEST METHODS FOR MICROCIRCUITS
PART 1: TEST METHODS 1000-1999
AMSC N/A FSC 5962
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
INCH - POUND
This document and process conversion
measures necessary to comply with
this change shall be completed by 16
March 2020.
MIL-STD-883-1
ii
FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. This entire standard has been revised. This revision has resulted in many changes to the format, but the most
significant one is the splitting the document into parts. See MIL–STD–883 for the change summary.
3. Comment, suggestions, or questions on this document should be addressed to: Commander, Defense Logistics
Agency, ATTN: DLA Land and Maritime - VA, P.O. Box 3990, Columbus, OH 43218-3990, or by email to
STD883@dla.mil. Since contact information can change, you may want to verify the currency of this address
information using the ASSIST Online database at: https://assist.dla.mil.
MIL-STD-883-1
iii
CONTENTS
PARAGRAPH Page
1. SCOPE ............................................................................................................................... 1
1.1 Purpose ............................................................................................................................ 1
1.2 Numbering system ........................................................................................................... 1
2. APPLICABLE DOCUMENTS ............................................................................................. 1
2.1 General ............................................................................................................................. 1
2.2 Government documents ................................................................................................... 1
2.3 Non-Government publications .......................................................................................... 3
2.4 Order of precedence ........................................................................................................ 5
3. DEFINITIONS ..................................................................................................................... 5
3.1 Abbreviations, symbols, and definitions............................................................................ 5
4. GENERAL REQUIREMENTS ............................................................................................ 8
4.1 General ............................................................................................................................. 8
4.2 Test circuits ...................................................................................................................... 8
4.3 Destructive tests ............................................................................................................... 8
4.4 Non-destructive tests ........................................................................................................ 9
4.5 Laboratory suitability ........................................................................................................ 9
4.6 Method of reference ......................................................................................................... 9
5. DETAIL REQUIREMENTS ................................................................................................. 9
6. NOTES ............................................................................................................................... 9
6.1 Intended use ..................................................................................................................... 9
6.2 International standardization agreement .......................................................................... 9
6.3 Subject term (key word) listing ......................................................................................... 10
6.4 Supersession data ............................................................................................................ 10
MIL-STD-883-1
iv
TEST METHODS
METHOD NO. ENVIRONMENTAL TESTS
1001 Barometric pressure, reduced (altitude operation)
1002 Immersion
1003 Insulation resistance
1004.7 Moisture resistance
1005.11 Steady state life
1006 Intermittent life
1007.1 Agree life
1008.2 Stabilization bake
1009.8 Salt atmosphere (corrosion)
1010.9 Temperature cycling
1011.9 Thermal shock
1012.1 Thermal characteristics
1013 Dew point
1014.17 Seal
1015.12 Burn-in test
1016.2 Life/reliability characterization tests
1017.3 Neutron irradiation
1018.10 Internal gas analysis
1019.9 Ionizing radiation (total dose) test procedure
1020.1 Dose rate induced latchup test procedure
1021.3 Dose rate upset testing of digital microcircuits
1022 Mosfet threshold voltage
1023.3 Dose rate response of linear microcircuits
1030.2 Preseal burn-in
1031 Thin film corrosion test
1032.1 Package induced soft error test procedure (due to alpha particles)
1033 Endurance life test
1034.2 Die penetrant test (for plastic devices)
MIL-STD-883-1
1
1. SCOPE
1.1 Purpose. Part 1 of this test method standard establishes uniform test methods for the basic environmental
testing of microelectronic devices to determine resistance to deleterious effects of natural elements and conditions
surrounding military operations. For the purpose of this standard, the term "devices" includes such items as
monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and
arrays are formed. This standard is intended to apply only to microelectronic devices.
1.2 Numbering system. The test methods are designated by numbers assigned in accordance with the following
system:
1.2.1 Classification of tests. The environmental test methods included in this part of a multipart test method
standard are numbered 1001 to 1034 inclusive.
1.2.2 Test method revisions. Revisions are numbered consecutively using a period to separate the test method
number and the revision number. For example, 1001.2 designates the second revision of test method 1001.
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, and 5 of this standard. This
section does not include documents cited in other sections of this standard or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements documents cited in sections 3, 4, and 5 of this
standard, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-680 - Degreasing Solvent, Performance Specification For.
MIL-PRF-19500 - Semiconductor Devices, General Specification For.
MIL-PRF-38534 - Hybrid Microcircuits, General Specification For.
MIL-PRF-38535 - Integrated Circuits (Microcircuits) Manufacturing, General Specification For.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-202 - Electronic and Electrical Component Parts.
MIL-STD-750 - Test Methods for Semiconductor Devices.
MIL-STD-1686 - Electrostatic Discharge Control Program for Protection of Electrical and Electronic
Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive
Devices).
MIL-STD-1835 - Electronic Component Case Outlines.
MIL-STD-1916 - DOD Preferred Methods for Acceptance of Product.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-217 - Reliability Prediction of Electronic Equipment.
MIL-HDBK-505 - Definitions of Item Levels, Item Exchangeability, Models, and Related Terms.
MIL-HDBK-781 - Reliability Test Methods, Plans, and Environments for Engineering, Development
Qualification, and Production .
MIL-HDBK-1331 - Parameters to be Controlled for the Specification of Microcircuits.
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