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MIL-STD-883K:2018 完整英文电子版(785页).pdf
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MIL-STD-883K:2018 完整英文电子版(785页).pdf
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MIL-STD-883K
w/CHANGE 3
3 May 2018
SUPERSEDING
MIL-STD-883K
w/CHANGE 2
22 February 2017
DEPARTMENT OF DEFENSE
TEST METHOD STANDARD
MICROCIRCUITS
AMSC N/A FSC 5962
DISTRIBUTION STATEMENT A. Approved for public release. Distribution is unlimited.
This document and process
conversion measures necessary to
comply with this change shall be
completed by 1 November 2018.
INCH - POUND
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FOREWORD
1. This standard is approved for use by all Departments and Agencies of the Department of Defense.
2. Comment, suggestions, or questions on this document should be addressed to: Commander, Defense Logistics Agency,
ATTN: DLA Land and Maritime - VA, P.O. Box 3990, Columbus, OH 43218-3990, or by email to ST[email protected].
Since contact information can change, you may want to verify the currency of this address information using the ASSIST
Online database at: http://quicksearch.dla.mil/.
SUMMARY OF CHANGE 1 MODIFICATIONS
1. Method 1018, Internal gas analysis. This method has been completely rewritten.
SUMMARY OF CHANGE 2 MODIFICATIONS
1 The following modifications have been made to the test methods.
1005.11: TABLE 1 Notes: Corrected typo, changing “pressures” to “temperatures”
1014.16: 1.1.c Note added to provide clarification of the conversion.
1014.16: 2.1.2.3 Clarifiation of the mass spectometer’s sensitivity.
1014.16: 2.4.4 Clarifiation of the mass spectometer’s sensitivity.
1014.16: 2.4.5.1 Clarifiation of test times for TCF.
1014.16: 2.4.6.1 Better define failure criteria.
1014.16: 2.4.7.1 Clarification of retest without error code.
1014.16: 2.4.7.2 Clarification of retest with error code.
1014.16: 2.8.2.1 Standards are to be calibrated once per year.
1014.16: 2.8.3.3.3 Clarification of thermal bake out.
1014.16: TABLE V Corrected typo Equivalent "L" Value for >0.40<0.50 package volume.
1015.12: TABLE 1 Notes: Corrected typos, changing “pressures” to “temperatures”.
1018.9: 2.1.2 Clarification of Quarterly calibration for other gases.
2003.13: 3.1 Typo correction diethylamine.
2003.13: 4.4 Solderability test. The test is divided into two methods: Dip and Look and BGA/CGA Surface Mount.
2009.13: 3.3.6.b i. Solder column base is misaligned such that the column is not within the perimeter of the pad.
2009.13: 3.3.6.i i. Solder column base is misaligned such that the column is not within the perimeter of the pad.
2009.13: 3.3.6.o Pad dewetting/non-wetting greater than 5% of the pad surface area.
2012.10: Complete re-write of this test method.
2017.12: 3.1.2.1.c End terminated elements with less than 50% attach adhesive visible on each side termination and or less
than 75% attach visible on the end of the termination. (see figs. 2017-5, 2017-6, and 2017-7).
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iii
3013.2: 3.3.2 Pulse amplitude shall be equal to VOH (max); shall be superimposed on a dc level equal to VOH (min);
3019.2: 1.2 Corrected symbols for pi (π).
4003.2: 3.3.1 Corrected symbols for delta(∆).
4006.2: 3.1 Corrected equation for Rg prime (RGʹ).
SUMMARY OF CHANGE 3 MODIFICATIONS
1. The following modifications have been made to the test methods.
Applicable Documents: 2.2.1 Federal Standards Updated SAE AMS-STD-595/15102, and SAE AMS-STD-595/25102
1014.17: 2.1.2.3 Test condition A2, flexible method. Added Examples for clarification of half order of magnitude.
1018.10 2.1.1.e Changed system suitability from 0.01c and small to all volumes.
2009.14: 3.3.2.b Increased acceptable foreign material to 5%.
2011.10: 3.2.1.a Added failure categories a-0 and a-9.
2012.11: 3.1.1 Additional views are required at a different viewing axis when internal features require.
2012.11: 3.4.1.1.b Typo correction from Table to Figure.
2017.13: 3.1.2.1 Added Note regarding attachment adhesive.
2017.13: 3.1.2.1.c Complete rewrite of end termination element requirements and updated figures.
2017.13: 3.1.2.1.d Changes “end termination” to “attached metallization” to better describe.
2017.13: 3.1.6.a Added wording “After 5 mils, or 10 mils for wedge bonds, the clearance shall be 2 wire diameters.
2019.10: Updated Figure 2019-4.
2019.10: Figure 2019-4 Note 1. All die area larger than 64 x 10-4 (IN)2 shall withstand a minimum force of (1.0X) of 2.5 kg or
a minimum force (2.0X) of 5.0 kg (see 3.2).
2019.10: Figure 2019-4 Note 4. (1X) and (2X) values apply to all attach methods, (1.25X) values apply to all attach methods
except epoxy attach.
5011.7: 3.6.1 Changed requirement from ANSI/NCSL Z540.3 to ANSI/NCSL Z540.3 or similar specification approved by the
qualifying activity.
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CONTENTS
PARAGRAPH Page
1. SCOPE ......................................................................................................................................... 1
1.1 Purpose ....................................................................................................................................... 1
1.2 Intended use of or reference to MIL-STD-883 ............................................................................ 1
2. APPLICABLE DOCUMENTS ....................................................................................................... 3
2.1 General ....................................................................................................................................... 3
2.2 Government documents ............................................................................................................. 3
2.3 Non-Government publications .................................................................................................... 4
2.4 Order of precedence ................................................................................................................... 6
3. ABBREVIATIONS, SYMBOLS, AND DEFINITIONS ................................................................... 7
3.1 Abbreviations, symbols, and definitions ..................................................................................... 7
4. GENERAL REQUIREMENTS ...................................................................................................... 9
4.1 Numbering system ...................................................................................................................... 9
4.2 Test results ................................................................................................................................. 10
4.3 Test sample disposition .............................................................................................................. 10
4.4 Orientation .................................................................................................................................. 10
4.5 Test conditions ............................................................................................................................ 13
4.6 General precautions ................................................................................................................... 15
4.7 Recycled, recovered, and environmentally preferable materials ……………………………….. 15
5. DETAIL REQUIREMENTS ........................................................................................................... 16
6. NOTES .......................................................................................................................................... 17
FIGURES
FIGURE
1. Orientation of noncylindrical microelectronic devices to
direction of applied force .............................................................................................................. 11
2. Orientation of cylindrical microelectronic device to
direction of applied force .............................................................................................................. 12
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TEST METHODS
METHOD NO. ENVIRONMENTAL TESTS
1001 Barometric pressure, reduced (altitude operation)
1002 Immersion
1003 Insulation resistance
1004.7 Moisture resistance
1005.11 Steady state life
1006 Intermittent life
1007.1 Agree life
1008.2 Stabilization bake
1009.8 Salt atmosphere (corrosion)
1010.9 Temperature cycling
1011.9 Thermal shock
1012.1 Thermal characteristics
1013 Dew point
1014.17 Seal
1015.12 Burn-in test
1016.2 Life/reliability characterization tests
1017.3 Neutron irradiation
1018.10 Internal gas analysis
1019.9 Ionizing radiation (total dose) test procedure
1020.1 Dose rate induced latchup test procedure
1021.3 Dose rate upset testing of digital microcircuits
1022 Mosfet threshold voltage
1023.3 Dose rate response of linear microcircuits
1030.2 Preseal burn-in
1031 Thin film corrosion test
1032.1 Package induced soft error test procedure (due to alpha particles)
1033 Endurance life test
1034.2 Die penetrant test (for plastic devices)
MECHANICAL TESTS
2001.4 Constant acceleration
2002.5 Mechanical shock
2003.13 Solderability
2004.7 Lead integrity
2005.2 Vibration fatigue
2006.1 Vibration noise
2007.3 Vibration, variable frequency
2008.1 Visual and mechanical
2009.14 External visual
2010.14 Internal visual (monolithic)
2011.10 Bond strength (destructive bond pull test)
2012.11 Radiography
2013.1 Internal visual inspection for DPA
2014 Internal visual and mechanical
2015.14 Resistance to solvents
2016 Physical dimensions
2017.13 Internal visual (hybrid)
2018.6 Scanning electron microscope (SEM) inspection of metallization
2019.10 Die shear strength
2020.9 Particle impact noise detection test
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