FPGA+ADT7301芯片Verilog驱动＋SPI控制+ADT7301art温度传感器＋测试激励tb文件

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adT7301_driver+数据手册 + verilog adt7301驱动 + 测试激励tb文件.rar （3个子文件）

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±1°C Accurate, 13-Bit,

Digital Temperature Sensor

ADT7301

Rev. B

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781.329.4700 www.analog.com

FEATURES

13-bit temperature-to-digital converter

−40°C to +150°C operating temperature range

±0.5°C typical accuracy

0.03125°C temperature resolution

Shutdown current of 1 μA

Power dissipation of 0.631 mW at V

= 3.3 V

SPI- and DSP-compatible serial interface

Shutdown mode

Space-saving SOT-23 and MSOP packages

Compatible with AD7814

APPLICATIONS

Medical equipment

Automotive

Environmental controls

Oil temperature

Hydraulic systems

Cellular phones

Hard disk drives

Personal computers

Electronic test equipment

Office equipment

Domestic appliances

Process control

FUNCTIONAL BLOCK DIAGRAM

SERIAL

BUS

INTERFACE

02884-0-001

ADT7301

SCLK

DIN

DOUT

GND

13-BIT

ANALOG/DIGITAL

CONVERTER

TEMPERATURE

VALUE

BAND GAP

TEMPERATURE

SENSOR

Figure 1.

GENERAL DESCRIPTION

The ADT7301 is a complete temperature monitoring system

available in SOT-23 and MSOP packages. It contains a band gap

temperature sensor and a 13-bit ADC to monitor and digitize

the temperature reading to a resolution of 0.03125°C.

The ADT7301 has a flexible serial interface that allows easy

interfacing to most microcontrollers. The interface is compati-

ble with SPI

®, QSPI™, and MICROWIRE™ protocols as well as

DSPs. The part features a standby mode that is controlled via

the serial interface. The ADT7301’s wide supply voltage range,

low supply current, and SPI-compatible interface make it ideal

for a variety of applications including personal computers,

office equipment, automotive, and domestic appliances. The

ADT7301 is rated for operation over the −40°C to +150°C

temperature range. It is not recommended to operate the device

at temperatures above +125°C for greater than a total of 5%

(5,000 hours) of the lifetime of the device. Exposure beyond this

limit affects device reliability.

PRODUCT HIGHLIGHTS

1. On-chip temperature sensor that allows an accurate

measurement of the ambient temperature. The measurable

temperature range is −40°C to +150°C.

2. Supply voltage of 2.7 V to 5.25 V.

3. Space-saving 6-lead SOT-23 and 8-lead MSOP packages.

4. Typical temperature accuracy of ±0.5°C.

5. 13-bit temperature reading to 0.03125°C resolution.

6. Shutdown mode that reduces the power consumption to

4.88 μW with V

= 3.3 V @ 1 SPS.

7. Compatible with AD7814.

ADT7301

Rev. B | Page 2 of 16

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

Functional Block Diagram .............................................................. 1

General Description ......................................................................... 1

Product Highlights ........................................................................... 1

Revision History ............................................................................... 2

Specifications ..................................................................................... 3

Timing Characteristics ................................................................ 4

Absolute Maximum Ratings ............................................................ 5

ESD Caution .................................................................................. 5

Pin Configurations and Function Descriptions ........................... 6

Typical Performance Characteristics ..............................................7

Theory of Operation .........................................................................9

Converter Details ..........................................................................9

Temperature Value Register ...................................................... 10

Serial Interface ............................................................................ 11

Applications Information .............................................................. 12

Microprocessor Interfacing ....................................................... 12

Mounting the ADT7301 ............................................................ 14

Supply Decoupling ..................................................................... 14

Outline Dimensions ....................................................................... 15

Ordering Guide .......................................................................... 15

REVISION HISTORY

6/11—Rev. A to Rev. B

Changed Temperature Conversion Time from 800 µs to 1.2 ms .. 3

Changed Temperature Conversion Time in Converter

Details Section .................................................................................. 9

3/10—Rev. 0 to Rev. A

Change to Autoconversion Update Rate Parameter, Table 1 ...... 3

Changes to Converter Details Section ........................................... 9

Updated Outline Dimensions ....................................................... 15

10/05—Revision 0: Initial Version

ADT7301

Rev. B | Page 3 of 16

SPECIFICATIONS

= T

MIN

to T

MAX

, V

= 2.7 V to 5.25 V, unless otherwise noted. All specifications are for −40°C to +150°C, unless otherwise noted.

Table 1. A Grade Specifications

Parameter Min Typ Max Unit Test Conditions/Comments

TEMPERATURE SENSOR AND ADC V

= 3.3 V (±10%) and 5 V (±5%)

Accuracy

±0.5 ±1 °C T

= 0°C to 70°C

±2 °C T

= −20°C to +85°C

±3 °C T

= −40°C to +125°C

±4

°C T

= −40°C to +150°C

Temperature Resolution 0.03125 °C

Autoconversion Update Rate, t

1.5 sec Temperature measurement every 1.5 second

Temperature Conversion Time 1.2 ms

Thermal Time Constant

2 sec

SUPPLIES

Supply Voltage 2.7 5.25 V For specified performance

Supply Current

Normal Mode 1.6 2.2 mA V

= 3.3 V, powered up and converting

190 300 µA V

= 3.3 V, powered up and not converting

1.6 2.2 mA V

= 5 V, powered up and converting

280 400 µA V

= 5 V, powered up and not converting

Shutdown Mode 0.2 1 µA V

= 3.3 V, T

= 0°C to 70°C

0.4 2 µA V

= 5 V, T

= 0°C to 70°C

20 µA V

= 2.7 V to 5.25 V, T

= −40°C to +150°C

Power Dissipation

Normal Mode (Average) 631 µW V

= 3.3 V, autoconversion update, t

1.41 mW V

= 5 V, autoconversion update, t

Shutdown Mode (Average)

1 SPS 4.88 µW V

= 3.3 V

7.4 µW V

= 5 V

10 SPS 42.9 µW V

= 3.3 V

65 µW V

= 5 V

100 SPS 423 µW V

= 3.3 V

641 µW V

= 5 V

DIGITAL INPUT

Input High Voltage, V

2.5 V

Input Low Voltage, V

0.8 V

Input Current, I

±1 µA V

= 0 V to V

Input Capacitance, C

10 pF All digital inputs

DIGITAL OUTPUT

Output High Voltage, V

− 0.3 V I

SOURCE

= I

SINK

= 200 µA

Output Low Voltage, V

0.4 V I

= 200 µA

Output Capacitance, C

OUT

50 pF

The accuracy specifications for 0°C to 70°C are specified to 3.5-Σ performance.

It is not recommended to operate the device at temperatures above 125°C for greater than a total of 5% (5,000 hours) of the lifetime of the device. Any exposure

beyond this limit affects device reliability.

The thermal time constant is the time it takes for a temperature delta to change to 63.2% of its final value. For example, if the ADT7301 experiences a thermal shock

from 0°C to 100°C, it would take typically 2 seconds for the ADT7301 to reach 63.2°C.

The ADT7301 is taken out of shutdown mode and a temperature conversion is immediately performed after this write operation. When the temperature conversion is

complete, the ADT7301 is put back into shutdown mode.

Guaranteed by design and characterization, not production tested.

ADT7301

Rev. B | Page 4 of 16

TIMING CHARACTERISTICS

Guaranteed by design and characterization, not production tested. All input signals are specified with t

= t

= 5 ns (10% to 90% of V

)

and timed from a voltage level of 1.6 V. T

= T

MIN

to T

MAX

, V

= 2.7 V to 5.25 V, unless otherwise noted.

Table 2.

Parameter

Limit Unit Comments

5 ns min

to SCLK setup time

25 ns min SCLK high pulse width

25 ns min SCLK low pulse width

35 ns max Data access time after SCLK falling edge

20 ns min Data setup time prior to SCLK rising edge

5 ns min Data hold time after SCLK rising edge

5 ns min

to SCLK hold time

40 ns max

to DOUT high Impedance

See Figure 14 for the SPI timing diagram.

Measured with the load circuit of Figure 2.

1.6V

200µA

200µA I

02884-0-002

OUTPUT

50pF

Figure 2. Load Circuit for Data Access Time and Bus Relinquish Time

ADT7301

Rev. B | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter Rating

to GND −0.3 V to +7 V

Digital Input Voltage to GND −0.3 V to V

+ 0.3 V

Digital Output Voltage to GND −0.3 V to V

+ 0.3 V

Operating Temperature Range

−40°C to +150°C

Storage Temperature Range −65°C to +150°C

Junction Temperature 150°C

6-Lead SOT-23 (RJ-6)

Power Dissipation

MAX

= (T

max − T

)/θ

Thermal Impedance

, Junction-to-Ambient

(Still Air)

190.4°C/W

8-Lead MSOP (RM-8)

Power Dissipation

MAX

= (T

max − T

)/θ

Thermal Impedance

, Junction-to-Ambient

(Still Air)

205.9°C/W

, Junction-to-Case 43.74°C/W

IR Reflow Soldering

Peak Temperature 220°C (0°C/5°C)

Time at Peak Temperature 10 sec to 20 sec

Ramp-Up Rate 3°C/s max

Ramp-Down Rate −6°C/s max

Time 25°C to Peak Temperature 6 minutes max

IR Reflow Soldering—Pb-Free Package

Peak Temperature 260°C (0°C)

Time at Peak Temperature 20 sec to 40 sec

Ramp-Up Rate 3°C/s max

Ramp-Down Rate −6°C/s max

Time 25°C to Peak Temperature 8 minutes max

It is not recommended to operate the ADT7301 at temperatures above

125°C for greater than a total of 5% (5,000 hours) of the lifetime of the

device. Any exposure beyond this limit affects device reliability.

Values relate to the package being used on a standard 2-layer PCB. Refer

to Figure 3 for a plot of maximum power dissipation vs. ambient

temperature (T

= ambient temperature.

Junction-to-case resistance is applicable to components featuring a

preferential flow direction, for example, components mounted on a heat

sink. Junction-to-ambient resistance is more useful for air-cooled,

PCB-mounted components.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

02884-003

TEMPERATURE (°C)

–40

150

140

130

120

110

100

–10

–20

–30

MAXIMUM POWER DISSIPATION (W)

1.2

1.0

0.8

0.6

0.4

0.2

SOT-23

MSOP

Figure 3. Plot of Maximum Power Dissipation vs. Temperature

ESD CAUTION

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