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Application Note
Migration Guide From STM32
®
to Arm
®
-Based MSPM0
ABSTRACT
This application note assists with migrating from the STMicroelectronics STM32
®
platform to the Texas
Instruments MSPM0 MCU ecosystem. This guide introduces the MSPM0 development and tool ecosystem,
core architecture, peripheral considerations, and software development kit. The intent is highlight the differences
between the two families and to leverage existing knowledge of the STM32 ecosystem to quickly ramp with the
MSPM0 series of MCUs.
Table of Contents
1 MSPM0 Portfolio Overview.................................................................................................................................................... 2
1.1 Introduction........................................................................................................................................................................ 2
1.2 Portfolio Comparison of STM32 MCUs to MSPM0 MCUs................................................................................................. 2
2 Ecosystem and Migration...................................................................................................................................................... 3
2.1 Software Ecosystem Comparison...................................................................................................................................... 3
2.2 Hardware Ecosystem......................................................................................................................................................... 4
2.3 Debug Tools....................................................................................................................................................................... 5
2.4 Migration Process.............................................................................................................................................................. 6
2.5 Migration and Porting Example.......................................................................................................................................... 6
3 Core Architecture Comparison............................................................................................................................................15
3.1 CPU..................................................................................................................................................................................15
3.2 Embedded Memory Comparison..................................................................................................................................... 15
3.3 Power Up and Reset Summary and Comparison............................................................................................................ 17
3.4 Clocks Summary and Comparison...................................................................................................................................19
3.5 MSPM0 Operating Modes Summary and Comparison.................................................................................................... 20
3.6 Interrupt and Events Comparison.................................................................................................................................... 22
3.7 Debug and Programming Comparison.............................................................................................................................24
4 Digital Peripheral Comparison............................................................................................................................................ 26
4.1 General-Purpose I/O (GPIO, IOMUX)..............................................................................................................................26
4.2 Universal Asynchronous Receiver-Transmitter (UART)...................................................................................................27
4.3 Serial Peripheral Interface (SPI)...................................................................................................................................... 27
4.4 I
2
C.................................................................................................................................................................................... 28
4.5 Timers (TIMGx, TIMAx)....................................................................................................................................................29
4.6 Windowed Watchdog Timer (WWDT).............................................................................................................................. 30
4.7 Real-Time Clock (RTC).................................................................................................................................................... 30
5 Analog Peripheral Comparison........................................................................................................................................... 31
5.1 Analog-to-Digital Converter (ADC)...................................................................................................................................31
5.2 Comparator (COMP)........................................................................................................................................................ 32
5.3 Digital-to-Analog Converter (DAC)...................................................................................................................................33
5.4 Operational Amplifier (OPA).............................................................................................................................................33
5.5 Voltage References (VREF).............................................................................................................................................34
6 Revision History................................................................................................................................................................... 35
Trademarks
MSP430
™
, TI E2E
™
, Code Composer Studio
™
, LaunchPad
™
, EnergyTrace
™
, and BoosterPack
™
are
trademarks of Texas Instruments.
STM32
®
is a registered trademark of STMicroelectronics International N.V.
Arm
®
and Cortex
®
are registered trademarks of Arm Limited.
All trademarks are the property of their respective owners.
www.ti.com Table of Contents
SLAAE56A – NOVEMBER 2022 – REVISED MARCH 2023
Submit Document Feedback
Migration Guide From STM32
®
to Arm
®
-Based MSPM0 1
Copyright © 2023 Texas Instruments Incorporated
1 MSPM0 Portfolio Overview
1.1 Introduction
The MSP430
™
MCUs have nearly 30 years of history as TI's classic microcontroller. The latest generation
introduces the MSPM0 family. MSPM0 microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-
power 32-bit MCU family based on the enhanced Arm
®
Cortex
®
-M0+ 32-bit core platform. These cost-optimized
MCUs offer high-performance analog peripheral integration, support extended temperature ranges, and offer
small footprint packages. The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of
analog and digital integration allowing engineers to find the MCU that meets their project's needs. The MSPM0
MCU family combines the Arm Cortex-M0+ platform with a ultra-low-power system architecture, allowing system
designers to increase performance while reducing energy consumption.
The MSPM0 MCUs offer a competitive alternative to the STM32 MCUs. This application note assists with
migration from STM32 MCUs to MSPM0 MCUs by comparing device features and ecosystems.
1.2 Portfolio Comparison of STM32 MCUs to MSPM0 MCUs
Table 1-1. Comparison of the TI MSPM0Gx/Lx and STM32G0/F0 Series
ST Micro
STM32G0 Series
ST Micro
STM32F0 Series
TI MSPM0
MSPM0Gx Series
TI MSPM0
MSPM0Lx Series
Core / Frequency CM0+ / 64 MHz CM0 / 48 MHz CM0+ / 80 MHz CM0+ / 32 MHz
Supply Voltage 1.7 V to 3.6 V 2 V to 3.6 V 1.62 V to 3.6 V 1.62 V to 3.6 V
Temperature -40°C to 125°C -40°C to 105°C -40°C to 125°C -40°C to 125°C
Memory 512KB to 16KB 256KB to 16KB 128KB to 32KB 64KB to 8KB
RAM Up to 144KB Up to 32KB Up to 32KB Up to 4KB
GPIO (max) 90 88 60 28
Analog
1x 2.5-Msps 12-bit ADC
1x 12-bit DAC
3x comparators
1x 1-Msps 12-bit ADC
1x 12-bit DAC
2x comparators
2x 4-Msps 12-bit ADC
1x 12-bit DAC
3x high-speed
comparators
2x op amps
1x 1-Msps 12-bit ADC
1x high-speed comparator
2x op amps
Communication (max)
3x SPI
3x I
2
C Fast+
6x UART (LIN)
2x CAN-FD
1x USB
2x SPI
2x I
2
C Fast+
8x UART (LIN)
1x CAN
2x SPI
2x I
2
C Fast+
4x UART (LIN)
1x CAN-FD
1x SPI
2x I
2
C Fast+
2x UART (LIN)
Timers 8 4 7 4
Advance Timers Yes (1) Yes (1) Yes (3x) No
Hardware Accelerator N/A N/A Optional N/A
Security CRC, TRNG, AES256 CRC CRC, TRNG, AES256 CRC
Low power
Active: 100 µA/MHz
Standby (RTC): 1.5 µA
Active: 281 µA/MHz
Standby (RTC): 2.5 µA
Active: 85 µA/MHz
Standby (RTC): 1.5 µA
Active: 85 µA/MHz
Standby: 1.5 µA
MSPM0 Portfolio Overview www.ti.com
2 Migration Guide From STM32
®
to Arm
®
-Based MSPM0 SLAAE56A – NOVEMBER 2022 – REVISED MARCH 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated
2 Ecosystem and Migration
MSPM0 MCUs are supported by an extensive hardware and software ecosystem with reference designs and
code examples to get designs started quickly. MSPM0 MCUs are also supported by online resources, trainings
with MSP Academy, and online support through the TI E2E
™
support forums.
2.1 Software Ecosystem Comparison
Table 2-1. STM32 Software Tool Equivalents for MSPM0
STM32 MSPM0
IDE CubeIDE Code Composer Studio
™
IDE (CCS)
Software Configuration CubeMX SysConfig
Stand-alone programming CubeProgrammer UniFlash
Display/Demo GUI Editor CubeMonitor GuiComposer
2.1.1 MSPM0 Software Development Kit (MSPM0 SDK)
The MSPM0 SDK delivers software APIs, examples, documentation, and libraries that help engineers quickly
develop applications on Texas Instruments MSPM0+ microcontroller devices. Examples are provided to
demonstrate the use of each functional area on every supported device and are a starting point for your own
projects. Additionally, interactive MSP Academy trainings are included in the MSPM0 SDK to provide a guided
learning path.
The examples folder is divided into RTOS and non-RTOS subfolders (currently only non-RTOS is supported).
These folders contain examples for each LaunchPad
™
development kit and are organized categories such as
lower-level DriverLib examples, higher-level TI Drivers examples, and examples for middleware such as GUI
Composer, LIN, IQMath, and others. For details, refer to the MSPM0 SDK User's Guide.
2.1.2 CubeIDE vs Code Composer Studio IDE (CCS)
Code Composer Studio IDE (CCS) is TI's equivalent of STM32's CubeIDE. CCS is a free Eclipse-based IDE
that supports TI's microcontroller (MCU) and embedded processor portfolios. CCS comprises a suite of tools
used to develop and debug embedded applications including an optimizing C/C++ compiler, source code editor,
project build environment, debugger, profiler and many other features. CCS is available as both a desktop or
cloud-based IDE.
CCS integrates MSPM0 device configuration and auto-code generation from SysConfig as well as MSPM0 code
examples and academy trainings in the integrated TI Resource explorer. CCS offers an all-in-one development
tool experience.
In addition to CCS, MSPM0 devices are also supported in industry-standard IDEs listed in the following table.
Table 2-2. MSPM0 Supported IDEs
IDE MSPM0
CCS ✓
IAR ✓
Keil ✓
2.1.3 CubeMX vs SysConfig
SysConfig is an intuitive and comprehensive collection of graphical utilities for configuring pins, peripherals,
radios, subsystems, and other components. It is TI's equivalent of STM32 CubeMX. SysConfig helps manage,
expose, and resolve conflicts visually so that you have more time to create differentiated applications. The tool's
output includes C header and code files that can be used with MSPM0 SDK examples or used to configure
custom software. SysConfig is integrated into CCS but can also be used as a standalone program.
For details, refer to the MSPM0 SysConfig Guide.
www.ti.com Ecosystem and Migration
SLAAE56A – NOVEMBER 2022 – REVISED MARCH 2023
Submit Document Feedback
Migration Guide From STM32
®
to Arm
®
-Based MSPM0 3
Copyright © 2023 Texas Instruments Incorporated
Figure 2-1. MSPM0 SysConfig
2.2 Hardware Ecosystem
LaunchPad development kits are the only evaluation modules for the MSPM0. LaunchPad kits are easy-to-use
EVMs that contain everything needed to start developing on the MSPM0. This includes an onboard debug
probe for programming, debugging, and measuring power consumption with EnergyTrace
™
technology. MSPM0
LaunchPad kits also feature onboard buttons, LEDs, and temperature sensors among other circuitry. Rapid
prototyping is simplified by the 40-pin BoosterPack
™
plug-in module headers, which support a wide range
of available BoosterPack plug-in modules. You can quickly add features like wireless connectivity, graphical
displays, environmental sensing, and more.
• LP-MSPM0G3507 LaunchPad development kit
• LP-MSPM0L1306 LaunchPad development kit
Ecosystem and Migration www.ti.com
4 Migration Guide From STM32
®
to Arm
®
-Based MSPM0 SLAAE56A – NOVEMBER 2022 – REVISED MARCH 2023
Submit Document Feedback
Copyright © 2023 Texas Instruments Incorporated
Figure 2-2. LP-MSPM0G3507 LaunchPad Development Kit
2.3 Debug Tools
The debug subsystem (DEBUGSS) interfaces the serial wire debug (SWD) two-wire physical interface to
multiple debug functions within the device. MSPM0 devices support debugging of processor execution, the
device state, and the power state (using EnergyTrace technology). Figure 2-3 shows the connection of the
debugger.
MSPM0 support XDS110 and J-Link debugger for standard serial wire debug.
The Texas Instruments XDS110 is designed for TI embedded processors. XDS110 connects to the target board
through a TI 20-pin connector (with multiple adapters for TI 14-pin and Arm 10-pin and Arm 20-pin) and to
the host PC through USB2.0 High Speed (480 Mbps). It supports a wider variety of standards (IEEE1149.1,
IEEE1149.7, SWD) in a single pod. All XDS debug probes support Core and System Trace in all Arm and DSP
processors that feature an Embedded Trace Buffer (ETB). For details, refer to XDS110 Debug Probe.
J-Link debug probes are the most popular choice for optimizing the debugging and flash programming
experience. Benefit from record-breaking flash loaders, up to 3-MiB/s RAM download speed and the ability
to set an unlimited number of breakpoints in the flash memory of MCUs. J-Link also supports a wide range of
CPUs and architectures included CortexM0+. For details, visit the Segger J-Link Debug Probes page.
Figure 2-3 shows a high-level diagram of the major functional areas and interfaces of the XDS110 probe to
MSPM0 target.
www.ti.com Ecosystem and Migration
SLAAE56A – NOVEMBER 2022 – REVISED MARCH 2023
Submit Document Feedback
Migration Guide From STM32
®
to Arm
®
-Based MSPM0 5
Copyright © 2023 Texas Instruments Incorporated
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