1/ 53 www.miramems.com
MEMS digital output motion sensor
Ultra-low-power high performance 3-axes “DSC-XYZ” accelerometer
Key Features
Supply voltage, 1.62V to 3.6V
For 2x2x0.9 mm LGA-12 package
User selectable range, ±2g, ±4g, ±8g, ±16g
User selectable data output rate
Digital I
2
C/SPI output interface
14 bit resolution
Ultra-low power consumption
Embedded 32-level FIFO
Internal step counter
2 Programmable interrupt generators with
independent function for motion detection
Factory programmable offset and sensitivity
RoHS compliant
Applications
User interface for mobile phone and PMP
Display orientation
Gesture recognition
Active monitoring
Free-fall detection
Double/single Click recognition
Power management
Vibration monitoring
Step counter
Tilt
Significant motion
Product Overview
The da217 sensor is ultra-low power high performance
capacitive three-axis linear accelerometer developed by
micro-machined technology. The device is available in a
2x2x0.9mm land grid array (LGA) and it is guaranteed to
operate over an extended temperature range from -40°C to
+85°C.
The sensor element is fabricated by single crystal silicon with
DRIE process and is protected by hermetically sealed silicon
cap from the environment.
The device features user selectable full scale of ±2g/ ±4g/
±8g/ ±16g measurement range with data output rate from 1Hz
to 1000Hz with signal condition, temperature compensation,
motion detection, step counter and step detection along with
significant motion detection embedded.
The da217 has an integrated 32-level first-in, first-out (FIFO)
buffer allowing the user to store data in order to limit
intervention by the host processor.
Two independent and flexible interrupts provided greatly
simplify the algorithm for various motion status detections.
Standard I
2
C and SPI interfaces are used to communicate with
the chip.
da217
2/ 53 www.miramems.com
Content
1. Block diagram and pin description .............................................................................................................................. 9
1.1. Block diagram ............................................................................................................................................ 9
1.2. Pin description ............................................................................................................................................ 9
2. Mechanical and electrical specifications .................................................................................................................. 11
2.1. Mechanical characteristics ........................................................................................................................ 11
2.2. Electrical characteristics ........................................................................................................................... 12
2.3. Absolute maximum ratings....................................................................................................................... 12
3. Communication interface ......................................................................................................................................... 13
3.1. Communication interface Electrical specification .................................................................................... 13
3.1.1. SPI Electrical specification ............................................................................................................... 13
3.1.2. I2C Electrical specification .............................................................................................................. 14
3.2. Digital interface operation ........................................................................................................................ 15
3.2.1. SPI Operation ................................................................................................................................... 15
3.2.2. I2C Operation ................................................................................................................................... 16
4. Terminology and functionality ................................................................................................................................. 18
4.1. Terminology ............................................................................................................................................. 18
4.1.1. Sensitivity ......................................................................................................................................... 18
4.1.2. Zero-g level ...................................................................................................................................... 18
4.2. Functionality ............................................................................................................................................. 18
4.2.1. Power mode ...................................................................................................................................... 18
4.2.2. Sensor data ....................................................................................................................................... 19
4.2.3. Factory calibration ............................................................................................................................ 19
4.3. Interrupt controller ................................................................................................................................... 20
4.3.1. General features ................................................................................................................................ 20
4.3.2. Mapping............................................................................................................................................ 21
4.3.3. Electrical behavior (INT1/INT2 to open-drive or push-pull) ........................................................... 21
4.3.4. New data interrupt ............................................................................................................................ 21
4.3.5. Active detection ................................................................................................................................ 21
4.3.6. Tap detection .................................................................................................................................... 22
4.3.7. Orientation recognition ..................................................................................................................... 23
4.3.8. Freefall interrupt ............................................................................................................................... 25
5. Digital blocks ........................................................................................................................................................... 26
5.1. FIFO ......................................................................................................................................................... 26
5.1.1. Bypass Mode .................................................................................................................................... 26
5.1.2. FIFO Mode ....................................................................................................................................... 26
5.1.3. Stream Mode .......................................................................................................................................... 26
5.1.3. Trigger Mode .................................................................................................................................... 26
5.1.4 Retrieving Data from FIFO .............................................................................................................. 26
5.2. Embedded functions ................................................................................................................................. 27
5.2.1. Step counter ...................................................................................................................................... 27
5.2.2. Step detector ..................................................................................................................................... 27
Mar. 2018 Rev 0.4 DS_da217
3/ 53 www.miramems.com
5.2.3. Significant motion ............................................................................................................................ 27
5.2.4. Tilt .................................................................................................................................................... 27
6. Application hints ...................................................................................................................................................... 28
7. Register mapping ...................................................................................................................................................... 29
8. Registers description ................................................................................................................................................ 31
8.1. SPI_CONFIG (00H) ................................................................................................................................. 31
8.2. CHIP_ID (01H) ........................................................................................................................................ 31
8.3. ACC_X_LSB (02H), ACC_X_MSB (03H) ............................................................................................. 31
8.4. ACC_Y_LSB (04H), ACC_Y_MSB (05H) ............................................................................................. 31
8.5. ACC_Z_LSB (06H), ACC_Z_MSB (07H) .............................................................................................. 32
8.6. FIFO_STATUS (08H) .............................................................................................................................. 32
8.7. MOTION_FLAG (09H) ........................................................................................................................... 33
8.8. NEWDATA_FLAG (0AH) ....................................................................................................................... 33
8.9. TAP_ACTIVE_STATUS (0BH) ............................................................................................................... 34
8.10. ORIENT_STATUS (0CH) ........................................................................................................................ 35
8.11. STEPS_MSB (0DH), STEPS_LSB (0EH) ............................................................................................... 35
8.12. RESOLUTION_RANGE (0FH) .............................................................................................................. 36
8.13. ODR_AXIS (10H) .................................................................................................................................... 37
8.14. MODE_BW (11H) ................................................................................................................................... 38
8.15. SWAP_POLARITY (12H) ....................................................................................................................... 38
8.16. FIFO_CTRL (14H) ................................................................................................................................... 39
8.17. INT_SET0 (15H) ...................................................................................................................................... 39
8.18. INT_SET1 (16H) ...................................................................................................................................... 40
8.19. INT_SET2 (17H) ...................................................................................................................................... 40
8.20. INT_MAP1 (19H) .................................................................................................................................... 41
8.21. INT_MAP2 (1AH) ................................................................................................................................... 41
8.22. INT_MAP3 (1BH) ................................................................................................................................... 42
8.23. INT_CONFIG (20H) ................................................................................................................................ 42
8.24. INT_LATCH (21H) .................................................................................................................................. 43
8.25. FREEFALL_DUR (22H) .......................................................................................................................... 44
8.26. FREEFALL_THS (23H) .......................................................................................................................... 44
8.27. FREEFALL_HYST (24H) ........................................................................................................................ 44
8.28. ACTIVE_DUR (27H) .............................................................................................................................. 45
8.29. ACTIVE_THS (28H) ............................................................................................................................... 45
8.30. TAP_DUR (2AH) ..................................................................................................................................... 46
8.31. TAP_THS (2BH) ...................................................................................................................................... 46
8.32. ORIENT_HYST (2CH) ............................................................................................................................ 47
8.33. Z_BLOCK (2DH) ..................................................................................................................................... 47
8.34. RESET_STEP (2EH) ................................................................................................................................ 47
8.35. STEP_FILTER (33H) ............................................................................................................................... 48
8.36. SM_THRESHOLD (34H) ........................................................................................................................ 48
9. Package information ................................................................................................................................................. 49
9.1. Outline dimensions ................................................................................................................................... 49
9.2. Landing pattern recommendation ............................................................................................................. 50
Mar. 2018 Rev 0.4 DS_da217
4/ 53 www.miramems.com
9.3. Tape and reel specification ....................................................................................................................... 51
10. Reliability ................................................................................................................................................................. 52
11. Revision history ........................................................................................................................................................ 53
Mar. 2018 Rev 0.4 DS_da217
5/ 53 www.miramems.com
List of tables
Table 1.Pin description ............................................................................................................................................. 10
Table 2.Mechanical characteristic ............................................................................................................................ 11
Table 3.Electrical characteristics ............................................................................................................................... 12
Table 4.Absolute maximum ratings .......................................................................................................................... 12
Table 5.Electrical specification of the SPI interface pins .......................................................................................... 13
Table 6.Electrical specification of the I2C interface pins .......................................................................................... 14
Table 7.Mapping of the interface pins ...................................................................................................................... 15
Table 8.W1 and W0 settings ..................................................................................................................................... 15
Table 9.I2C Address .................................................................................................................................................. 16
Table 10.SAD+Read/Write patterns .......................................................................................................................... 16
Table 11.Transfer when master is writing one byte to slave ..................................................................................... 17
Table 12.Transfer when master is writing multiple bytes to slave ............................................................................ 17
Table 13.Transfer when master is receiving (reading) one byte of data from slave ................................................. 17
Table 14.Transfer when master is receiving (reading) multiple bytes of data from slave ........................................ 17
Table 15.Interrupt mode selection ........................................................................................................................... 20
Table 16.meaning of ‘orient’ bits in symmetric mode .............................................................................................. 24
Table 17.meaning of ‘orient’ bits in high-asymmetric mode .................................................................................... 24
Table 18.meaning of ‘orient’ bits in low-asymmetric mode ..................................................................................... 24
Table 19.blocking conditions for orientation recognition ........................................................................................ 24
Table 20.Register address map ................................................................................................................................. 29
Table 21.SPI_CONFIG register ................................................................................................................................... 31
Table 22.SPI_CONFIG description ............................................................................................................................. 31
Table 23.CHIP_ID register ......................................................................................................................................... 31
Table 24.ACC_X_LSB register .................................................................................................................................... 31
Table 25.ACC_X_MSB register .................................................................................................................................. 31
Table 26.ACC_Y_LSB register .................................................................................................................................... 32
Table 27.ACC_Y_MSB register .................................................................................................................................. 32
Table 28.ACC_Z_LSB register .................................................................................................................................... 32
Table 29.ACC_Z_MSB register .................................................................................................................................. 32
Table 30.FIFO_STATUS register ................................................................................................................................. 32
Table 31.MOTION_FLAG register description ........................................................................................................... 32
Table 32.MOTION_FLAG register .............................................................................................................................. 33
Table 33.MOTION_FLAG register description ........................................................................................................... 33
Table 34.NEWDATA_FLAG register............................................................................................................................ 33
Table 35.NEWDATA_FLAG register description ........................................................................................................ 33
Table 36.TAP_ACTIVE_STATUS register .................................................................................................................... 34
Table 37.TAP_ACTIVE_STATUS register description ................................................................................................. 34
Table 38.ORIENT_STATUS register............................................................................................................................ 35
Table 39.ORIENT_STATUS register description......................................................................................................... 35
Table 40.STEPS_MSB register ................................................................................................................................... 35
Table 41.STEPS_LSB register ..................................................................................................................................... 35
Table 42.RESOLUTION_RANGE register .................................................................................................................... 36