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FAILURE MECHANISM BASED STRESS TEST QUALIFICATION FOR INTEGRATED CIRCUITS IN AUTOMOTIVE APPLICATIONS
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AEC - Q100 - REV-J
August 11, 2023
FAILURE MECHANISM BASED
STRESS TEST QUALIFICATION
FOR
INTEGRATED CIRCUITS
IN AUTOMOTIVE APPLICATIONS
Component Technical Committee
Automotive Electronics Council
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AEC - Q100 - REV-J
August 11, 2023
Component Technical Committee
Automotive Electronics Council
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AEC - Q100 - REV-J
August 11, 2023
Component Technical Committee
Automotive Electronics Council
TABLE OF CONTENTS
1. SCOPE ......................................................................................................................................... 1
1.1 Purpose ........................................................................................................................... 1
1.2 Reference Documents .................................................................................................... 1
1.2.1 Automotive ......................................................................................................... 1
1.2.2 Military ................................................................................................................ 2
1.2.3 Industrial ............................................................................................................. 2
1.3 Definitions ....................................................................................................................... 2
1.3.1 AEC Q100 Qualification ..................................................................................... 2
1.3.2 AEC Certification ................................................................................................ 2
1.3.3 Approval for Use in an Application ..................................................................... 2
1.3.4 Definition of Part Operating Temperature Grade ............................................... 3
1.3.5 Capability Measures Cpk ................................................................................... 3
1.3.6 Flip-Chip Ball Grid Array (FC-BGA) Package Configuration ............................. 3
2. GENERAL REQUIREMENTS ...................................................................................................... 4
2.1 Objective ......................................................................................................................... 4
2.1.1 Zero Defects ....................................................................................................... 4
2.2 Precedence of Requirements ......................................................................................... 4
2.3 Customer Specific Lifetime Requirements (Mission Profiles) ......................................... 4
2.4 Use of Generic Data to Satisfy Qualification and Requalification Requirements ........... 4
2.4.1 Definition of Generic Data .................................................................................. 4
2.4.2 Time Limit for Acceptance of Generic Data ....................................................... 5
2.5 Test Samples .................................................................................................................. 5
2.5.1 Lot Requirements ............................................................................................... 5
2.5.2 Production Requirements .................................................................................. 6
2.5.3 Reusability of Test Samples .............................................................................. 6
2.5.4 Sample Size Requirements ............................................................................... 6
2.5.5 Pre- and Post-stress Test Requirements ........................................................... 6
2.6 Definition of Test Failure After Stressing ........................................................................ 6
3. QUALIFICATION AND REQUALIFICATION ............................................................................... 6
3.1 Qualification of a New Device ......................................................................................... 6
3.2 Requalification of a Changed Device .............................................................................. 7
3.2.1 Process Change Notification .............................................................................. 7
3.2.2 Changes Requiring Requalification.................................................................... 7
3.3 Criteria for Passing Qualification and Requalification ..................................................... 7
3.4 User Approval ................................................................................................................. 7
3.5 Qualification of a Pb-Free Device ................................................................................... 7
3.6 Qualification of a Device Using Copper (Cu) Wire Interconnects ................................... 7
4. QUALIFICATION TESTS ............................................................................................................. 8
4.1 General Tests .................................................................................................................. 8
4.2 Device Specific Tests ...................................................................................................... 8
4.3 Wearout Reliability Tests ................................................................................................ 8
Appendix 1: Definition of a Product Qualification Family ......................................................................... 20
Appendix 2: Q100 Certification of Design, Construction and Qualification .............................................. 26
Appendix 3: Plastic Package Opening for Wire Bond Testing ................................................................. 29
Appendix 4: Minimum Requirements for Qualification Plans and Results ............................................... 30
Appendix 5: Part Design Criteria to Determine Need for EMC Testing ................................................... 35
Appendix 6: Part Design Criteria to Determine Need for SER Testing .................................................... 36
Appendix 7: AEC-Q100 and the Use of Mission Profiles .......................................................................... 37
Revision History ........................................................................................................................................ 44
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AEC - Q100 - REV-J
August 11, 2023
Component Technical Committee
Automotive Electronics Council
Revision Summary
This informative section briefly describes the changes made in the AEC-Q100 Rev-J document, compared to
previous document version, AEC-Q100 Rev-H (Sept. 11, 2014). Punctuation and text improvements are not
included in this summary.
• Section 1.2.1 – Automotive Reference Documents: Added reference to AEC-Q006, SAE J1879, and
IATF 16949; added AEC-Q100 sub specifications to list of references for clarification
• Section 1.2.3 – Industrial Reference Documents: Added reference to J-STD-002, JESD94, JESD671,
JEP155, JEP157, JEP178
• Section 1.2.4: Decommissioned references: Removed
• Section 1.3.1 – AEC-Q100 Qualification Statement: Guidance for ESD level reporting adapted to
requirements
• NEW Section 1.3.6 – Flip-Chip Ball Grid Array (FC-BGA) Package Configuration: Added new definition
for FC-BGA
• NEW Figure 1 – Illustration of a Flip-Chip BGA Package Configuration: Added new Figure illustrating FC-
BGA
• NEW: Section 2.3 – Customer Specific Lifetime Requirements (Mission Profiles): Add new Section to
define entry point in Appendix 7 in main part of the document
• Section 3.3 – Criteria for Passing Qualification and Requalification: Explicitly include initial qualification
• NEW Section 3.6 – Qualification of a Device Using Copper (Cu) Wire Interconnects: Added new Section
on qualification of devices using Cu wire
• Section 4.3 – Wearout Reliability Tests: Added recommendation for technology qualification
• Figure 3: Adaption to changes in Table 2
• Table 2 – Qualification Test Methods:
o Column notes: added notes F, C and W to applicable tests
o Test A1: Added delamination requirement
o Test A2: Added interim readout test temperature requirement
o Test A3: Added preference for UHST
o Test A4: Change of requirement for Grade 0. Added requirement for availability of
delamination data
o Test A5: Rework of trigger criteria to efficiently identify products where test is applicable
o Test B1: Alternative TEST sequence added, drift analysis requirement added
o Test C3: Application of J-STD-002 clarified
o Added NEW Test C7 (BST – Bump Shear Test)
o Test E2: Acceptance criteria for advanced CMOS nodes added
o Test E3: Acceptance criteria for advanced CMOS nodes added
o Table 2 Legend: Added Note C reference for Cu wire devices, Note F for FC-BGA device
specific tests, and Note W for devices with wires not covered in mold compound
• Table 3 – Process Change Qualification Guidelines for the Selection of Tests:
o Added NEW Test C7 (BST – Bump Shear Test)
o Added NEW Wafer Bumping section and process change items Redistribution Layer, Under
Bump Metal, Bump Material, and Bump Site Transfer
• Appendix 1 – Definition of a Product Qualification Family: Complete revision
o Section A1.3 – Assembly Process: Added reference for FC-BGA
• Appendix 2 – Q100 Certification of Design, Construction and Qualification
o Added NEW Section 12a – Wafer Bump and sub-items UBM stack & thickness, UBM
dimensions, Bump dimensions, and Bump material
• Appendix Template 4A – AEC-Q100 Qualification Test Plan:
o Rework to be in line with changes to Table 2
• Appendix Template 4B – AEC-Q100 Generic Data:
o Rework to be in line with changes to Table 2
• Appendix 7
o New description of the flow graphs to provide more clarity to the reader
o Table A7.1: Clarify that this is a calculation example and not a standard condition described
here
![](https://csdnimg.cn/release/download_crawler_static/88809420/bg5.jpg)
AEC - Q100 - REV-J
August 11, 2023
Component Technical Committee
Automotive Electronics Council
Acknowledgment
Any document involving a complex technology brings together experience and skills from many sources. The
Automotive Electronics Council would especially like to recognize the following significant contributors to the
revision of this document:
AEC Q100 Sub-Committee Members:
Suhail Moosa
AMD
Desmond Yeo
AMD
Krimo Semmoud
AMD (formerly Xilinx)
Inderjit Singh
AMD (formerly Xilinx)
Heinz Reiter
ams OSRAM
Jeff Aquino
Analog Devices
Mark Sears
Bose
Jim Gallagher
Bose
Mike Klucher
Cirrus Logic
Carsten Ohlhoff
Continental Automotive
Keith Edwards
Diodes Inc.
Markus Dahlen
Elmos Semiconductor
Steven Sibrel
Harman
Ludger Kappius
Hella
Jiong Xu
Horizon Robotics
Wenlong He
Horizon Robotics
Rebecca Zhang
Horizon Robotics
Ulrich Abelein (Sub-Committee Chair)
Infineon Technologies
Banjie Bautista
ISSI
Warren Chen
Macronix
John Grogan
Macronix
Arnaud Devos
Melexis
Mykola Blyznyuk
Melexis
Mike Buzinski
Microchip
Wilhelm Binder
Microchip
Christian Merkel
Murata Manufacturing Co. Ltd
Alex Yanez
Murata Manufacturing Co. Ltd
Carmen Cotofana
Nexperia
KM Shin
NVIDIA
René Rongen
NXP
Romuald Roucou
NXP
Zhongning Liang
NXP
Daniel Vanderstraeten
onsemi
Peter Turlo
onsemi
Mr. Tamura
Renesas Electronics
Mr. Watanabe
Renesas Electronics
Michael Wieberneit
Renesas Electronics
Paul Koop
Robert Bosch
Jinsoo Bae
Samsung Electronics
Bassel Atala
STMicroelectronics
Allan Webber
Texas Instruments
Larry Ting
Texas Instruments
Matt Marudachalam
Texas Instruments
François Gouyou
Valeo
Friedbald Kiel
Valeo
Arthur Chiang
Vishay
Raya Kozlov
Western Digital
Larry Dudley
ZF
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