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JEDEC JEP30-P100A-2023
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Part Model Package Guidelines for Electronic-Device Packages.pdf
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JEDEC
PUBLICATION
Part Model Package Guidelines for
Electronic-Device Packages – XML
Requirements
JEP30-P100A
(Revision of JEP30-P100.01, May 2018)
MARCH 2023
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
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JEDEC
NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and
approved through the JEDEC Board of Directors level and subsequently reviewed and approved
by the JEDEC legal counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and
improvement of products, and assisting the purchaser in selecting and obtaining with minimum
delay the proper product for use by those other than JEDEC members, whether the standard is to
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption
may involve patents or articles, materials, or processes. By such action JEDEC does not assume
any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or
publication may be further processed and ultimately become an ANSI standard.
No claims to be in conformance with this standard may be made unless all requirements stated in
the standard are met.
Inquiries, comments, and suggestions relative to the content of this JEDEC standard or
publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under
Standards and Documents for alternative contact information.
Published by
©JEDEC Solid State Technology Association 2023
3103 North 10th Street
Suite 240 South
Arlington, VA 22201-2108
JEDEC retains the copyright on this material. By downloading this file the individual agrees not
to charge for or resell the resulting material.
PRICE: Contact JEDEC
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This document is copyrighted by JEDEC and may not be
reproduced without permission.
Organizations may obtain permission to reproduce a limited number of copies
through entering into a license agreement. For information, contact:
JEDEC Solid State Technology Association
3103 North 10th Street
Suite 240 South
Arlington, VA 22201-2107
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JEDEC
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JEDEC
JEDEC Publication No. 30-P100A
-i-
PART MODEL PACKAGE GUIDELINE FOR ELECTRONIC-DEVICE PACKAGES - XML
REQUIREMENTS
Contents
Page
1 Scope .......................................................................................................... 1
1.1 Purpose ....................................................................................................... 1
2 Applicable Documents ................................................................................. 1
2.1 JEDEC (www.jedec.org) .............................................................................. 1
2.2 IPC (www.ipc.org) ....................................................................................... 1
2.3 ASME (www.asme.org) ............................................................................... 2
3 Requirements .............................................................................................. 2
3.1 Terms and Definitions ................................................................................. 2
3.2 XML Schema Key Terms and Definitions .................................................... 2
4 Part Model Schema Definition ..................................................................... 3
4.1 Part Model - Package Section ..................................................................... 3
4.2 Manufacturer Part Number-Array ................................................................ 4
4.3 Linking the MPN to a specific Package Family Data set .............................. 5
4.3.1 Linking the Manufacturing Part Number to Package Content ...................... 6
4.3.2 Linking the Manufacturing Part Number to Physical Model Content ............ 7
4.4 Package ...................................................................................................... 8
4.5 Package Terminal Position ........................................................................ 10
4.5.1 Bottom ....................................................................................................... 11
4.5.2 Dual .......................................................................................................... 12
4.5.2.1 Dual Left-to-Right and Back-to-Front
......................................................... 13
4.5.2.2 Dual Corners ............................................................................................. 14
4.5.3 Diagonal .................................................................................................... 15
4.5.4 Quad ......................................................................................................... 16
4.5.5 Radial ........................................................................................................ 17
4.5.6 Single ........................................................................................................ 18
4.5.6.1 Single Side ................................................................................................ 19
4.5.6.2 Corner - Internal ........................................................................................ 19
4.5.6.3 Corner - External ....................................................................................... 20
4.5.7 Triple ......................................................................................................... 21
4.5.7.1 Triple – Multi Side position ........................................................................ 22
4.6 Package Outline Style ............................................................................... 23
4.6.1 Microelectronics Assembly ........................................................................ 24
4.6.2 Post Mount ................................................................................................ 24
4.7 Package Terminal Code ............................................................................ 25
4.7.1 Ball ............................................................................................................ 26
4.7.2 Lug ............................................................................................................ 26
4.7.3 Flat ............................................................................................................ 27
4.7.4 Gull-wing ................................................................................................... 27
4.7.5 Post Terminal
............................................................................................ 27
4.7.6 L-bend ....................................................................................................... 28
4.7.7 Column ...................................................................................................... 28
4.7.8 Surface Terminal ....................................................................................... 29
4.7.9 Pressfit ...................................................................................................... 30
4.7.10 Pin ............................................................................................................. 30
4.7.11 Wraparound .............................................................................................. 31
4.7.12 S-Bend ...................................................................................................... 32
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