JEDEC Publication No. 30-A100A
-i-
PART MODEL ASSEMBLY PROCESS CLASSIFICATION GUIDELINE FOR ELECTRONIC-
DEVICE PACKAGES - XML REQUIREMENTS
Contents
Page
1 Scope ..................................................................................................................... 1
1.1 Purpose .................................................................................................................. 1
2 Applicable Documents ............................................................................................ 1
2.1 JEDEC .................................................................................................................... 1
2.2 IPC ......................................................................................................................... 1
2.3 ECA/IPC/JEDEC ..................................................................................................... 2
2.4 IPC/JEDEC ............................................................................................................. 2
2.5 ECIA ....................................................................................................................... 2
3 Requirements ......................................................................................................... 2
3.1 Terms and Definitions ............................................................................................. 2
3.2 XML Schema Key Terms and Definitions ................................................................ 3
4 Part Model Schema Definition ................................................................................. 4
4.1 Part Model Parent - Assembly Process Classification Section ................................ 4
4.2 Manufacturer Part Number-Array ............................................................................ 5
4.3 Linking the Manufacturing Part Number to a specific Assembly Process
Classification Data set ............................................................................................ 6
4.3.1 Linking the Manufacturing Part Number to Process Sensitivity Level ..................... 7
4.3.2 Linking the Manufacturing Part Number to Moisture Sensitivity Level .................... 8
4.3.3 Linking the Manufacturing Part Number to Storage Temperature .......................... 9
4.4 Assembly Process Classification .......................................................................... 10
4.4.1 Process Sensitivity Levels Family .........................................................................11
4.4.1.1 Reflow Process Sensitivity Levels Type ................................................................13
4.4.1.1.1 Reflow Classification Profile Type ......................................................................... 14
4.4.1.1.1.1 Preheat ................................................................................................................. 15
4.4.1.1.1.2 Temperature Ramp up Rate ................................................................................. 15
4.4.1.1.1.3 Time above Liquidus Temperature ........................................................................ 16
4.4.1.1.1.4 Peak Package Body Temperature ........................................................................ 16
4.4.1.1.1.5 Time within 5 °C of Classification Temperature ..................................................... 17
4.4.1.1.1.6 Temperature Ramp down Rate ............................................................................. 17
4.4.1.1.1.7 Time from 25 °C -to-Peak Temperature ................................................................ 17
4.4.1.1.1.8 Flux Limitation....................................................................................................... 18
4.4.1.1.2 Reflow Limitations Type ........................................................................................ 19
4.4.1.2 Wave Process Sensitivity Levels Type ..................................................................20
4.4.1.2.1 Wave Classification Profile Type ........................................................................... 21
4.4.1.2.1.1 Preheat Soak ........................................................................................................ 22
4.4.1.2.1.2 Device Thermal Spike ........................................................................................... 23
4.4.1.2.1.3 Wave Solder Temperature .................................................................................... 23
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