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JEDEC

PUBLICATION

Understanding Electrical Overstress -

EOS

JEP174

SEPTEMBER 2016

JEDEC SOLID STATE TECHNOLOGY ASSOCIATION

NOTICE

JEDEC standards and publications contain material that has been prepared, reviewed, and approved

through the JEDEC Board of Directors level and subsequently reviewed and approved by the

JEDEC legal counsel.

JEDEC standards and publications are designed to serve the public interest through eliminating

misunderstandings between manufacturers and purchasers, facilitating interchangeability and

improvement of products, and assisting the purchaser in selecting and obtaining with minimum

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used either domestically or internationally.

JEDEC standards and publications are adopted without regard to whether or not their adoption may

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JEDEC standards or publications.

The information included in JEDEC standards and publications represents a sound approach to

product specification and application, principally from the solid state device manufacturer

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publication may be further processed and ultimately become an ANSI standard.

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should be addressed to JEDEC at the address below, or refer to www.jedec.org under Standards and

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Published by

©JEDEC Solid State Technology Association 2016

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This document may be downloaded free of charge; however JEDEC retains the

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PRICE: Contact JEDEC

Printed in the U.S.A.

JEDEC Publication No. 174

-i-

UNDERSTANDING ELECTRICAL OVERSTRESS - EOS

Contents

Introduction ....................................................................................................................................................................... iii

I.1 Purpose ................................................................................................................................................................ iii

I.2 Traditional Perceptions of EOS ........................................................................................................................... iv

I.3 Industry Council Worldwide Survey ................................................................................................................... iv

I.4 New Definition of EOS Incorporating AMR and EIPD ....................................................................................... v

I.5 EOS Root Causes ............................................................................................................................................... vii

I.6 EOS Root Cause Diagnostics ............................................................................................................................ viii

I.7 EOS Case Studies and IC Designs ...................................................................................................................... ix

I.8 EOS Mitigation and Communication ................................................................................................................... x

I.9 Summary .............................................................................................................................................................. x

I.10 Outlook................................................................................................................................................................. x

1 Scope .................................................................................................................................................................... 1

2 References ........................................................................................................................................................... 1

3 Terms and Definitions ........................................................................................................................................ 7

4 History of EOS ................................................................................................................................................... 9

4.1 Outline of History of Relevant Professional Societies ....................................................................................... 11

4.2 EOS – A Brief History ....................................................................................................................................... 11

4.3 Transition to Present .......................................................................................................................................... 14

5 EOS Damage in the Factory and Field ........................................................................................................... 15

5.1 Motivation for Field Returns Analysis of Failures Exhibiting EOS Damage .................................................... 15

5.2 Transients ........................................................................................................................................................... 16

5.3 EOS Survey for Gathering Data on EOS Damage ............................................................................................. 17

5.4 Impact of EOS Damage ..................................................................................................................................... 32

5.5 Failure Reports of Products Exhibiting EOS Damage ....................................................................................... 33

6 The Definition of EOS – Finding Common Understanding.......................................................................... 34

6.1 Existing Documentation Practices of AMR Values ........................................................................................... 35

6.2 Unified Understanding of AMR and EOS.......................................................................................................... 37

6.3 Additional Comments on Usage of the Term “EOS” ......................................................................................... 38

6.4 Conclusion ......................................................................................................................................................... 38

7 EOS Root Causes .............................................................................................................................................. 39

7.1 Root Cause Categories ....................................................................................................................................... 39

7.2 EOS Damage during Unpowered Handling ....................................................................................................... 40

7.3 EOS during Powered Handling .......................................................................................................................... 43

7.4 EOS Damage during AC Operation and Switching ........................................................................................... 47

7.5 Analysis of Electrically Induced Physical Damage and Conclusions on EOS Events ....................................... 48

8 Case Studies on EOS ........................................................................................................................................ 50

8.1 Case 1: Incorrect ESD Qualification Leading to EOS ....................................................................................... 51

8.2 Case 2: EOS Due to Misapplication ................................................................................................................... 54

8.3 Case 3: EOS due to Hot Plugging ...................................................................................................................... 57

8.4 Case 4: EOS due to Intermittent Battery Ground Connection ............................................................................ 61

8.5 Case 5: EOS due to Ground Offset .................................................................................................................... 63

8.6 Case 6: EOS Case Study "Automotive Knock Sensor" ...................................................................................... 65

8.7 Case 7: EMI – Transient Surge .......................................................................................................................... 70

8.8 Case 8: EMI – Board Design .............................................................................................................................. 73

8.9 Case 9: Supply Capacitor Switching .................................................................................................................. 76

8.10 Case 10: CBE in DSP IC .................................................................................................................................... 78

8.11 Case 11: Reliability Testing ............................................................................................................................... 83

8.12 Lessons Learned ................................................................................................................................................. 88

8.13 Conclusions ........................................................................................................................................................ 88