IMX273LQR-C.pdf_IMX273资源-CSDN文库

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SONY IMX273LQR-C是一款由索尼半导体解决方案公司生产的CMOS固体图像传感器，它的主要特点是具有方形像素阵列和1.58M有效像素。这款传感器的对角线长度为6.3mm（1/2.9英寸），采用了全球快门设计，并且具有可变电荷积分时间的特点。IMX273LQR-C传感器的操作电压为模拟3.3V、数字1.2V以及接口1.8V的三重电源，具有低功耗特性。该传感器通过提高感光度、降低暗电流和低光斑（PLS）特性，实现了高性能。 IMX273LQR-C传感器的主要应用场景包括FA（工厂自动化）摄像机。它的功能特点包括内置的定时调整电路、水平/垂直驱动器和串行通信电路。传感器支持全像素扫描模式、垂直/水平1/2抽样模式、ROI（感兴趣区域）模式以及垂直/水平-正常/倒置读取模式。传感器的读出模式灵活，支持全像素扫描模式，可以达到以下帧率：8位数据模式下276.0帧/秒、10位数据模式下226.5帧/秒、12位数据模式下165.9帧/秒。此外，它还具有可变速度快门功能（分辨率为1H单位），以及8位、10位和12位的A/D转换器。传感器内置了CDS（相关双采样）和PGA（可编程增益放大器）功能，可支持从0dB到48dB的模拟增益调整。 IMX273LQR-C传感器的输入频率为37.125MHz、74.25MHz和54MHz。在推荐的记录像素数量方面，传感器的推荐分辨率为1440(H)×1080(V)，大约是1.55M像素。传感器的读出速度非常快，能够在全像素扫描模式下实现高达165.9帧/秒的读出速率。在I/O接口方面，IMX273LQR-C支持低电压LVDS（150mVp-p）、串行接口（2通道/4通道/8通道切换）以及DDR输出。适合的镜头光圈F数为2.8或更大（近端），推荐的出瞳距离为-100mm到无穷大。在图像传感器结构方面，IMX273LQR-C是基于CMOS技术的图像传感器。它的图像尺寸和总像素数分别为1456(H)×1098(V)和大约1.60M像素。在有效像素方面，也有类似的数值，大约为1.58M像素。需要注意的是，索尼半导体解决方案公司保留在没有事先通知的情况下更改产品规格的权利。所提供的应用电路仅供参考，不能保证使用这些电路不会出现任何问题。通过对IMX273LQR-C传感器的分析，可以发现它在工业自动化相机领域具有很高的应用价值，尤其适合在需要高速、高分辨率图像捕获的应用中。索尼的设计确保了该传感器在高帧率操作下的低噪声和高动态范围，使其成为工业视觉应用中的一款优秀图像采集设备。同时，其全局快门功能使得该传感器能够有效地捕捉快速移动的物体，并在各种光照条件下提供一致的图像质量。此外，低功耗设计使得该传感器特别适合用于需要长时间运行且对能耗有限制的应用场景。

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Diagonal 6.3 mm (Type 1 / 2.9) CMOS solid-state Image Sensor with Square Pixel for

Color Cameras

IMX273LQR-C

Description

The IMX273LQR-C is a diagonal 6.3mm (Type 1 / 2.9) CMOS active pixel type solid-state image sensor with a

square pixel array and 1.58 M effective pixels. This chip features a global shutter with variable charge-integration

time. This chip operates with analog 3.3 V, digital 1.2 V, and interface 1.8 V triple power supply, and has low power

consumption. High sensitivity, low dark current and low PLS characteristics are achieved.

(Applications: FA cameras)

Features

◆ CMOS active pixel type dots

◆ Built-in timing adjustment circuit, H/V driver and serial communication circuit

◆ Global shutter function

◆ Input frequency

37.125 MHz / 74.25 MHz / 54 MHz

◆ Number of recommended recording pixels: 1440 (H) × 1080 (V) approx. 1.55 M pixels

Readout mode

All-pixel scan mode

Vertical / Horizontal 1 / 2 Subsampling mode

ROI mode

Vertical / Horizontal‐Normal / Inverted readout mode

◆ Readout rate

Maximum frame rate in

All-pixel scan mode: 8 bit 276.0 frame/s, 10 bit: 226.5 frame/s, 12 bit: 165.9 frame/s

◆ Variable-speed shutter function (resolution 1 H units)

◆ 8-bit / 10-bit / 12-bit A/D converter

◆ CDS / PGA function

0 dB to 24 dB: Analog Gain (0.1 dB step)

24.1 dB to 48 dB: Analog Gain: 24 dB + Digital Gain: 0.1 dB to 24 dB (0.1 dB step)

◆ I/O interface

Low voltage LVDS (150 mVp-p) serial (2 ch / 4 ch / 8 ch switching) DDR output

◆ Recommended lens F number: 2.8 or more (Close side)

◆ Recommended exit pupil distance: –100 mm to –∞

Sony Semiconductor Solutions Corporation reserves the right to change products and specifications without prior notice.

This information does not convey any license by any implication or otherwise under any patents or other right.

Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony Semiconductor Solutions

Corporation cannot assume responsibility for any problems arising out of the use of these circuits.

E17806B95

IMX273LQR-C

USE RESTRICTION NOTICE

This USE RESTRICTION NOTICE ("Notice") is for customers who are considering or currently using the

image sensor products ("Products") set forth in this specifications book. Sony Semiconductor Solutions

Corporation ("SSS") may, at any time, modify this Notice which will be available to you in the latest

specifications book for the Products. You should abide by the latest version of this Notice. If a SSS

subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will

additionally apply between you and the subsidiary or distributor. You should consult a sales representative of

the subsidiary or distributor of SSS on such a use restriction notice when you consider using the Products.

Use Restrictions



The Products are intended for incorporation into such general electronic equipment as office products,

communication products, measurement products, and home electronics products in accordance with

the terms and conditions set forth in this specifications book and otherwise notified by SSS from time

to time.



You should not use the Products for critical applications which may pose a life- or injury-threatening

risk or are highly likely to cause significant property damage in the event of failure of the Products. You

should consult your sales representative beforehand when you consider using the Products for such

critical applications. In addition, you should not use the Products in weapon or military equipment.



SSS disclaims and does not assume any liability and damages arising out of misuse, improper use,

modification, use of the Products for the above-mentioned critical applications, weapon and military

equipment, or any deviation from the requirements set forth in this specifications book.

Design for Safety



SSS is making continuous efforts to further improve the quality and reliability of the Products; however,

failure of a certain percentage of the Products is inevitable. Therefore, you should take sufficient care

to ensure the safe design of your products such as component redundancy, anti-conflagration features,

and features to prevent mis-operation in order to avoid accidents resulting in injury or death, fire or

other social damage as a result of such failure.

Export Control



If the Products are controlled items under the export control laws or regulations of various countries,

approval may be required for the export of the Products under the said laws or regulations.

You should be responsible for compliance with the said laws or regulations.

No License Implied



The technical information shown in this specifications book is for your reference purposes only. The

availability of this specifications book shall not be construed as giving any indication that SSS and its

licensors will license any intellectual property rights in such information by any implication or otherwise.

SSS will not assume responsibility for an

y problems in connection with your use of such information or

for any infringement of third-party rights due to the same. It is therefore your sole legal and financial

responsibility to resolve any such problems and infringement.

Governing Law



This Notice shall be governed by and construed in accordance with the laws of Japan, without reference

to principles of conflict of laws or choice of laws. All controversies and disputes arising out of or relating

to this Notice shall be submitted to the exclusive jurisdiction of the Tokyo District Court in Japan as the

court of first instance.

Other Applicable Terms and Conditions



The terms and conditions in the SSS additional specifications, which will be made available to you when

you order the Products, shall also be applicable to your use of the Products as well as to this

specifications book. You should review those terms and conditions when you consider purchasing

and/or using the Products.

General-0.0.9

IMX273LQR-C

CONTENTS

Description ............................................................................................................................................................................. 1

Features ................................................................................................................................................................................. 1

Device Structure ..................................................................................................................................................................... 2

Absolute Maximum Ratings .................................................................................................................................................... 3

Recommended Operating Conditions .................................................................................................................................... 3

USE RESTRICTION NOTICE ................................................................................................................................................ 4

Chip Center and Optical Center ............................................................................................................................................. 7

Pixel Arrangement .................................................................................................................................................................. 8

Block Diagram and Pin Configuration ..................................................................................................................................... 9

Pin Description ...................................................................................................................................................................... 11

Electrical Characteristics ...................................................................................................................................................... 14

DC Characteristics ............................................................................................................................................................ 14

Power Consumption ......................................................................................................................................................... 14

AC Characteristics ............................................................................................................................................................ 15

Master Clock (INCK) Waveform Diagram ...................................................................................................................... 15

XVS / XHS Input Characteristics in Slave Mode (XMASTER = High) ........................................................................... 16

XTRIG Input Characteristics in Slave Mode (XMASTER = High) only .......................................................................... 16

Serial Communication ................................................................................................................................................... 17

DLCKP1 / DLCKM1, DLOPx1 / DLOMx1 ...................................................................................................................... 19

I/O Equivalent Circuit Diagram ............................................................................................................................................. 20

Spectral Sensitivity Characteristics ...................................................................................................................................... 21

Image Sensor Characteristics .............................................................................................................................................. 22

Zone Definition of Video Signal Shading .......................................................................................................................... 22

Image Sensor Characteristics Measurement Method........................................................................................................... 23

Measurement Conditions .................................................................................................................................................. 23

Color Coding of Physical Pixel Array ................................................................................................................................ 23

Definition of standard imaging conditions ......................................................................................................................... 23

Measurement Method ....................................................................................................................................................... 24

Setting Registers Using Serial Communication .................................................................................................................... 25

Description of Setting Registers (4-wire) .......................................................................................................................... 25

Register Communication Timing (4-wire) .......................................................................................................................... 26

Register Write and Read (4-wire) ..................................................................................................................................... 27

Description of Setting Registers (I

C) ............................................................................................................................... 28

C) ............................................................................................................................... 29

C Communication Protocol ............................................................................................................................................. 30

C Serial Communication Read/Write Operation ............................................................................................................. 31

Single Read from Random Location ............................................................................................................................. 31

Single Read from Current Location ............................................................................................................................... 31

Sequential Read Starting from Random Location ......................................................................................................... 32

Sequential Read Starting from Current Location ........................................................................................................... 32

Single Write to Random Location .................................................................................................................................. 33

Sequential Write Starting from Random Location ......................................................................................................... 33

Register Map ........................................................................................................................................................................ 34

Chip ID = 02 (Write: Chip ID = 02h, Read: Chip ID = 82h, I

C: 30**h) .......................................................................... 35

Chip ID = 03 (Write: Chip ID = 03h, Read: Chip ID = 83h, I

C: 31**h) .......................................................................... 41

Chip ID = 04 (Write: Chip ID = 04h, Read: Chip ID = 84h, I

C: 32**h) .......................................................................... 42

Chip ID = 05 (Write: Chip ID = 05h, Read: Chip ID = 85h, I

C: 33**h) .......................................................................... 44

Chip ID = 06 (Write: Chip ID = 06h, Read: Chip ID = 86h, I

C: 34**h) .......................................................................... 45

Chip ID = 07 (Write: Chip ID = 07h, Read: Chip ID = 87h, I

C: 35**h) .......................................................................... 45

Chip ID = 08 (Write: Chip ID = 08h, Read: Chip ID = 88h, I

C: 36**h) .......................................................................... 45

Chip ID = 09 (Write: Chip ID = 09h, Read: Chip ID = 89h, I

C: 37**h) .......................................................................... 45

Chip ID = 0A (Write: Chip ID = 0Ah, Read: Chip ID = 8Ah, I

C: 38**h) ......................................................................... 45

Chip ID = 0B (Write: Chip ID = 0Bh, Read: Chip ID = 8Bh, I

C: 39**h) ......................................................................... 45

Chip ID = 0C (Write: Chip ID = 0Ch, Read: Chip ID = 8Ch, I

C: 3A**h) ........................................................................ 45

Chip ID = 0D (Write: Chip ID = 0Dh, Read: Chip ID = 8Dh, I

C: 3B**h) ........................................................................ 45

Chip ID = 0E (Write: Chip ID = 0Eh, Read: Chip ID = 8Eh, I

C: 3C**h) ......................................................................... 45

Chip ID = 0F (Write: Chip ID = 0Fh, Read: Chip ID = 8Fh, I

C: 3D**h) ......................................................................... 45

Chip ID = 10 (Write: Chip ID = 10h, Read: Chip ID = 90h, I

C: 3E**h) .......................................................................... 45

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