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MIL-PRF-38535J

w/AMENDMENT 1

14 May 2012

SUPERSEDING

MIL-PRF-38535J

28 December 2010

PERFORMANCE SPECIFICATION

INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING,

GENERAL SPECIFICATION FOR

AMSC N/A FSC 5962

INCH-POUND

Comments, suggestions, or questions on this document should be addressed to: DLA Land and Maritime,

ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to [email protected]. Since contact

information can change, you may want to verify the currency of this address information using the ASSIST

Online database at https://assist.daps.dla.mil.

The documentation and process conversion measures

necessary to comply with this AMENDMENT shall be

completed by June 30, 2012.

MIL-PRF-38535J

w/AMENDMENT 1

CONTENTS

PARAGRAPH PAGE

1 SCOPE ...................................................................................................................................................................... 1

1.1 Scope ...................................................................................................................................................................... 1

2. APPLICABLE DOCUMENTS .................................................................................................................................... 1

2.1 General ................................................................................................................................................................... 1

2.2 Government documents .......................................................................................................................................... 2

2.2.1 Specifications, standards, and handbooks ........................................................................................................... 2

2.2.2 Other Government documents, drawings, and publications ................................................................................. 2

2.3 Non-Government publications ................................................................................................................................. 2

2.4 Order of precedence ............................................................................................................................................... 3

3. REQUIREMENTS ..................................................................................................................................................... 3

3.1 General ................................................................................................................................................................... 3

3.1.1 Reference to applicable device specification ........................................................................................................ 3

3.2 Item requirements ................................................................................................................................................... 3

3.2.1 Certification of conformance and acquisition traceability ...................................................................................... 4

3.3 Quality management (QM) program ........................................................................................................................ 5

3.3.1 Manufacturer's review system .............................................................................................................................. 5

3.3.2 QM plan................................................................................................................................................................ 5

3.3.3 Self-assessment program .................................................................................................................................... 5

3.3.4 Change control procedures .................................................................................................................................. 5

3.3.4.1 Discontinuation of products ............................................................................................................................... 5

3.4 Requirements for listing on a QML .......................................................................................................................... 5

3.4.1 QML certification requirements ............................................................................................................................ 6

3.4.1.1 Process capability demonstration ...................................................................................................................... 6

3.4.1.1.1 New technology insertion ............................................................................................................................... 6

3.4.1.2 Management and technology validation ............................................................................................................ 7

3.4.1.3 On-site validation .............................................................................................................................................. 7

3.4.1.3.1 Second and third party validations ................................................................................................................. 7

3.4.1.3.2 Radiation source of supply (RSS) validations ................................................................................................ 7

3.4.1.4 Technology validation ....................................................................................................................................... 7

3.4.1.4.1 Package design selection reviews ................................................................................................................. 8

3.4.1.5 Manufacturer self-validation .............................................................................................................................. 9

3.4.1.6 Change management system ........................................................................................................................... 9

3.4.1.7 Deficiencies and concerns ................................................................................................................................ 9

3.4.1.8 Letter of certification .......................................................................................................................................... 9

3.4.2 QML qualification requirements ............................................................................................................................ 9

3.4.2.1 Qualification extension ...................................................................................................................................... 9

3.4.3 Qualification to RHA levels ................................................................................................................................. 10

3.4.4 QML listing ......................................................................................................................................................... 10

3.4.5 Maintenance and retention of QML .................................................................................................................... 10

3.4.6 QML line shutdown ............................................................................................................................................ 10

3.4.7 Revalidation reviews .......................................................................................................................................... 10

3.4.8 Performance requirements for class T devices .................................................................................................. 10

3.4.8.1 Class T radiation requirements ....................................................................................................................... 11

3.5 Device specification .............................................................................................................................................. 11

3.6 Marking of microcircuits ........................................................................................................................................ 11

3.6.1 Index point .......................................................................................................................................................... 11

3.6.2 Part or identification number (PIN) ..................................................................................................................... 12

3.6.2.1 RHA designator ............................................................................................................................................... 13

3.6.2.2 Drawing designator ......................................................................................................................................... 13

3.6.2.2.1 Military designator ........................................................................................................................................ 13

3.6.2.3 Device class designator .................................................................................................................................. 13

3.6.2.4 Case outline .................................................................................................................................................... 13

3.6.2.5 Lead finish ....................................................................................................................................................... 13

3.6.3 Certification mark ............................................................................................................................................... 13

3.6.3.1 QD certification mark ....................................................................................................................................... 13

MIL-PRF-38535J

w/AMENDMENT 1

CONTENTS

PARAGRAPH PAGE

iii

3.6.3.2 JAN or J mark ................................................................................................................................................. 14

3.6.4 Manufacturer's identification ............................................................................................................................... 14

3.6.4.1 Code for assembly sites .................................................................................................................................. 14

3.6.5 Country of origin ................................................................................................................................................. 14

3.6.6 Date code ........................................................................................................................................................... 14

3.6.7 Marking location and sequence .......................................................................................................................... 14

3.6.7.1 Beryllium oxide package identifier ................................................................................................................... 14

3.6.7.2 Electrostatic discharge (ESD) sensitivity identifier .......................................................................................... 14

3.6.8 QML marked product ......................................................................................................................................... 15

3.6.9 Marking on container .......................................................................................................................................... 15

3.7 Remarking ............................................................................................................................................................. 15

3.8 Screening and test ................................................................................................................................................ 15

3.9 Technology conformance inspection (TCI) ............................................................................................................ 15

3.9.1 TCI assessment ................................................................................................................................................. 15

3.10 Solderability ......................................................................................................................................................... 15

3.11 Traceability .......................................................................................................................................................... 15

3.12 ESD control ......................................................................................................................................................... 15

3.13 Recycled, recovered, or environmentally preferable materials ............................................................................ 15

3.14 Alternate test requirements ................................................................................................................................. 16

3.15 Passive elements ................................................................................................................................................ 16

3.15.1 Capacitors ........................................................................................................................................................ 16

4. VERIFICATION ....................................................................................................................................................... 17

4.1 Verification ............................................................................................................................................................ 17

4.2 Screening .............................................................................................................................................................. 17

4.2.1 Screen testing failures ........................................................................................................................................ 17

4.2.2 Screening resubmission criteria ......................................................................................................................... 17

4.2.3 Electrostatic discharge (ESD) sensitivity ............................................................................................................ 17

4.3 Technology conformance inspection (TCI) ............................................................................................................ 17

4.4 Qualification inspection ......................................................................................................................................... 17

5. PACKAGING ........................................................................................................................................................... 23

5.1 Packaging ............................................................................................................................................................. 23

6. NOTES .................................................................................................................................................................... 23

6.1 Intended use ......................................................................................................................................................... 23

6.1.1 Class T ............................................................................................................................................................... 23

6.2 Acquisition requirements ....................................................................................................................................... 23

6.3 Qualification .......................................................................................................................................................... 23

6.4 Terms and definitions ............................................................................................................................................ 23

6.4.1 Microelectronics ................................................................................................................................................. 23

6.4.2 Element (of a microcircuit or integrated circuit) .................................................................................................. 23

6.4.3 Substrate (of a microcircuit or integrated circuit) ................................................................................................ 24

6.4.4 Integrated circuit (microcircuit) ........................................................................................................................... 24

6.4.4.1 Multichip microcircuit ....................................................................................................................................... 24

6.4.4.2 Monolithic microcircuit ..................................................................................................................................... 24

6.4.4.3 Microcircuit module ......................................................................................................................................... 24

6.4.5 Production lot ..................................................................................................................................................... 24

6.4.6 Inspection lot ...................................................................................................................................................... 24

6.4.7 Wafer lot ............................................................................................................................................................. 24

6.4.8 Percent defective allowable (PDA) ..................................................................................................................... 24

6.4.9 Delta limit ........................................................................................................................................................... 24

6.4.10 Rework ............................................................................................................................................................. 24

6.4.11 Final seal .......................................................................................................................................................... 24

6.4.12 Acquiring activity .............................................................................................................................................. 25

6.4.13 Qualifying activity (QA) ..................................................................................................................................... 25

6.4.14 Parts per million (PPM) .................................................................................................................................... 25

6.4.15 Device type ...................................................................................................................................................... 25

MIL-PRF-38535J

w/AMENDMENT 1

CONTENTS

PARAGRAPH PAGE

6.4.16 Die type ............................................................................................................................................................ 25

6.4.17 Radiation hardness assurance (RHA) .............................................................................................................. 25

6.4.18 Electrostatic discharge (ESD) sensitivity .......................................................................................................... 25

6.4.19 Package family ................................................................................................................................................. 25

6.4.20 Technology flow ............................................................................................................................................... 25

6.4.21 Qualified Manufacturer's Listing (QML) ............................................................................................................ 25

6.4.22 Third party design center.................................................................................................................................. 25

6.4.23 Radiation source of supply (RSS) .................................................................................................................... 25

6.4.24 Form ................................................................................................................................................................. 26

6.4.25 Fit ..................................................................................................................................................................... 26

6.4.26 Function ........................................................................................................................................................... 26

6.4.27 Class M ............................................................................................................................................................ 26

6.4.28 Class N............................................................................................................................................................. 26

6.4.29 Class Q ............................................................................................................................................................ 26

6.4.30 Class V ............................................................................................................................................................. 26

6.4.31 Class B ............................................................................................................................................................. 26

6.4.32 Class S ............................................................................................................................................................. 26

6.4.33 Class T ............................................................................................................................................................. 26

6.4.34 Qualified manufacturer’s line ............................................................................................................................ 26

6.4.35 Test optimization .............................................................................................................................................. 26

6.4.36 Audit team ........................................................................................................................................................ 26

6.4.37 Class level B .................................................................................................................................................... 26

6.4.38 Class level S .................................................................................................................................................... 26

6.4.39 Class level vs Class ......................................................................................................................................... 27

6.4.40 Second party facility ......................................................................................................................................... 27

6.4.41 Third party facility ............................................................................................................................................. 27

6.4.42 New technology ................................................................................................................................................ 27

6.4.43 Mature technology ............................................................................................................................................ 27

6.4.44 Lot date code ................................................................................................................................................... 27

6.4.45 Storage temperature ........................................................................................................................................ 27

6.5 Discussion ............................................................................................................................................................. 28

6.6 Additional reference documents ............................................................................................................................ 30

6.7 Subject term (key word) listing .............................................................................................................................. 31

6.8 List of acronyms .................................................................................................................................................... 32

6.9 Environmentally preferable material ...................................................................................................................... 34

6.10 Changes from previous issue .............................................................................................................................. 34

A.1 SCOPE ................................................................................................................................................................. 35

A.1.1 Scope................................................................................................................................................................. 35

A.2 APPLICABLE DOCUMENTS ................................................................................................................................ 35

A.2.1 General .............................................................................................................................................................. 35

A.2.2 Government documents..................................................................................................................................... 35

A.2.2.1 Specifications, standards, and handbooks...................................................................................................... 35

A.2.2.2 Other Government documents, drawings, and publications............................................................................ 36

A.2.3 Non-Government publications ........................................................................................................................... 36

A.2.4 Order of precedence .......................................................................................................................................... 37

A.3 REQUIREMENTS ................................................................................................................................................. 37

A.3.1 General .............................................................................................................................................................. 37

A.3.1.1 Reference to device specification or drawing .................................................................................................. 37

A.3.1.2 Conflicting requirements ................................................................................................................................. 38

A.3.1.3 Terms, definitions, and symbols ..................................................................................................................... 38

A.3.1.3.1 Microelectronics ........................................................................................................................................... 38

A.3.1.3.2 Element (of a microcircuit or integrated circuit) ............................................................................................ 38

A.3.1.3.3 Substrate (of a microcircuit or integrated circuit) .......................................................................................... 38

A.3.1.3.4 Microcircuit ................................................................................................................................................... 38

A.3.1.3.4.1 Multichip microcircuit ................................................................................................................................. 38

MIL-PRF-38535J

w/AMENDMENT 1

CONTENTS

PARAGRAPH PAGE

A.3.1.3.4.2 Hybrid microcircuit .................................................................................................................................... 38

A.3.1.3.4.3 Monolithic microcircuit (or integrated circuit) ............................................................................................. 38

A.3.1.3.4.4 Film microcircuit (or film integrated circuit) ................................................................................................ 38

A.3.1.3.5 Microcircuit module ...................................................................................................................................... 38

A.3.1.3.6 Production lot ............................................................................................................................................... 39

A.3.1.3.7 Inspection lot - class level S ......................................................................................................................... 39

A.3.1.3.8 Inspection lot - class level B ......................................................................................................................... 39

A.3.1.3.9 Inspection sublot - class level S ................................................................................................................... 39

A.3.1.3.10 Inspection lot split - class level B ............................................................................................................... 39

A.3.1.3.11 Wafer lot .................................................................................................................................................... 39

A.3.1.3.12 Package type ............................................................................................................................................. 39

A.3.1.3.13 Microcircuit group ...................................................................................................................................... 39

A.3.1.3.14 Percent defective allowable (PDA) ............................................................................................................ 39

A.3.1.3.15

Delta limit (∆)

............................................................................................................................................. 39

A.3.1.3.16 Rework ....................................................................................................................................................... 40

A.3.1.3.17 Final seal ................................................................................................................................................... 40

A.3.1.3.18 Acquiring activity ........................................................................................................................................ 40

A.3.1.3.19 Qualifying activity ....................................................................................................................................... 40

A.3.1.3.20 Device type ................................................................................................................................................ 40

A.3.1.3.21 Die type ...................................................................................................................................................... 40

A.3.1.3.22 Antistatic .................................................................................................................................................... 40

A.3.1.3.23 Conductive ................................................................................................................................................. 40

A.3.1.3.24 Insulating ................................................................................................................................................... 40

A.3.1.3.25 Dissipative ................................................................................................................................................. 40

A.3.1.3.26 Radiation hardness assurance (RHA)........................................................................................................ 40

A.3.1.3.27 Electrostatic discharge (ESD) sensitivity .................................................................................................... 40

A.3.1.3.28 Custom microcircuit ................................................................................................................................... 41

A.3.1.3.29 Die family ................................................................................................................................................... 41

A.3.1.3.30 Package family .......................................................................................................................................... 41

A.3.1.3.31 Military operating temperature range ......................................................................................................... 41

A.3.1.3.32 Process monitor ......................................................................................................................................... 41

A.3.1.3.33 Device specification ................................................................................................................................... 41

A.3.1.3.34 Class level B .............................................................................................................................................. 41

A.3.1.3.35 Class level S .............................................................................................................................................. 41

A.3.2 Item requirements .............................................................................................................................................. 41

A.3.2.1 Electrical test requirements ............................................................................................................................. 41

A.3.2.2 Alternate die/fabrication requirements ............................................................................................................ 42

A.3.2.2.1 Example C of C ............................................................................................................................................ 42

A.3.2.2.2 Die evaluation requirements ........................................................................................................................ 43

A.3.3 Classification of requirements ............................................................................................................................ 43

A.3.3.1 Certification of conformance and acquisition traceability ................................................................................ 44

A.3.4 Quality assurance requirements ........................................................................................................................ 45

A.3.4.1 Qualification .................................................................................................................................................... 45

A.3.4.1.1 Compliance validation .................................................................................................................................. 45

A.3.4.1.2 Process monitor programs ........................................................................................................................... 45

A.3.4.1.2.1 Inspection by scanning electron microscope (SEM) ................................................................................. 45

A.3.4.1.2.2 Wire bonding ............................................................................................................................................. 45

A.3.4.1.2.3 Die attachment .......................................................................................................................................... 45

A.3.4.1.2.4 Lid seal ..................................................................................................................................................... 45

A.3.4.1.2.5 Particle detection ...................................................................................................................................... 45

A.3.4.1.2.6 Lead trimming and final lead finish thickness ............................................................................................ 46

A.3.4.1.3 Qualification to RHA levels .......................................................................................................................... 46

A.3.4.1.4 Qualification to ESD classes ........................................................................................................................ 47

A.3.4.2 Changes and notification of change to product or quality assurance program ............................................... 48

A.3.4.2.1 Discontinuation of products .......................................................................................................................... 48