Page 1 of 4 AEC-Q100-REV H-QTP
Component Technical Committee
Automotive Electronics Council
Q100 Qualification Test Plan
Automotive Grade Level = {Select Grade} MSL = {Select MSL}
Supplier Name:
General Specification:
AEC-Q100 Rev. H
Supplier Code:
Supplier Wafer Fabrication:
Supplier Part Number:
Supplier Wafer Test:
Supplier Contact:
Supplier Assembly Site:
Supplier Family Type:
Supplier Final Test Site:
Device Description:
Supplier Reliability Signature:
PPAP Submission Date:
Customer Test ID:
Reason for Qualification:
{Select Reason}
Customer Part Number:
Prepared by Signature:
Date:
Customer Approval Signature:
Date:
Test
#
Reference
Test Conditions
Lots
S.S.
Total
Results
Lot/Pass/Fail
Comments:
(N/A =Not Applicable)
TEST GROUP A – ACCELERATED ENVIRONMENT STRESS TESTS
PC
A1
JESD22 A113
J-STD-020
Preconditioning: (Test @ Rm)
SMD only; Moisture Preconditioning for THB/HAST,
AC/UHST, TC, & PTC; Peak Reflow Temp =
Min. MSL = 3
MSL =
THB
or
HAST
A2
JESD22 A101
JESD22 A110
Temperature Humidity Bias: (Test @ Rm/Hot)
Highly Accelerated Stress Test: (Test @ Rm/Hot/)
3
77
231
of
AC or
UHST
or TH
A3
JESD22 A102
JESD22 A118
or JESD22-A101
Autoclave: (Test @ Rm)
Unbiased Highly Accelerated Stress Test: (Test @ Rm)
Temperature Humidity without Bias: (Test @ Rm)
3
77
231
of
TC
A4
JESD22 A104
Temperature Cycle: (Test @ Hot)
3
77
231
of
PTC
A5
JESD22 A105
Power Temperature Cycle: (Test @ Rm/Hot)
1
45
45
of
HTSL
A6
JESD22 A103
High Temperature Storage Life: (Test @ Rm/Hot)
1
45
45
of
