JEDEC
STANDARD
Preconditioning of Nonhermetic
Surface Mount Devices Prior to
Reliability Testing
JESD22-A113I
(Revision of JESD22-A113H, November 2016)
APRIL 2020
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
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JEDEC Standard No. 22-A113I
-i- Test Method A113I
(Revision of A113H)
TEST METHOD A113I
PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES
PRIOR TO RELIABILITY TESTING
Foreword
This document provides an industry standard test method for preconditioning packaged devices that is
representative of a typical industry multiple solder reflow operation.
Introduction
The typical use of surface mount devices (SMD) involves subjecting the SMDs to elevated temperatures
during board assembly, which, by itself or combined with moisture in the package can induce internal
package damage that could be a reliability concern. Preconditioning of SMD packages is used to simulate
the effects of board assembly prior to reliability testing. This allows reliability testing at the packaged
device level on as shippable products with a board assembly simulation. During preconditioning, test
samples are subjected to temperature cycling (optional), dry bake, moisture soaking, solder reflow
simulation, flux, rinse, dry, and electrical test before reliability testing.
This test method references the reflow profiles stated in J-STD-020. If a packaged device is not able to
withstand the full thermal profile as stated in J-STD-020, J-STD-075 should be used to evaluate and
classify process sensitivities.
JEDEC Standard No. 22-A113I
Test Method A113I -ii-
(Revision of A113H)
JEDEC Standard No. 22-A113I
Page 1
Test Method A113I
(Revision of A113H)
TEST METHOD A113I
PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES
PRIOR TO RELIABILITY TESTING
(From JEDEC Board ballot JCB-20-10, formulated under the cognizance of the JC-14.1 Subcommittee on
Reliability Test Methods for Packaged Devices.)
1 Scope
This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs
that is representative of a typical industry multiple solder reflow operation. These SMDs should be
subjected to the appropriate preconditioning sequence of this document by the manufacturer prior to being
submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long
term reliability (which might be impacted by solder reflow).
Devices that could be surface mounted, but are designed/intended to only be socketed, are out of scope of
this test method.
NOTE For good correlation of results between moisture/reflow-induced stress sensitivity testing (per J-STD-020
and JESD22-A113) and actual reflow conditions used, identical temperature measurements by both the SMD
manufacturer and the board assembler are necessary. Therefore, it is recommended that the package temperature at
the top center of the package be determined during assembly board reflow profile setup, to ensure that it does not
exceed the evaluation temperature based on package thickness and volume as stated in J-STD-020.
2 Normative reference
IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface
Mount Devices
IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface
Mount Devices
ECIA/IPC/JEDEC J-STD-075, Classification of Passive and Solid State Devices for Assembly Processes
JESD22-B101, External Visual
JESD22-A104, Temperature Cycling
JESD625, Requirements for Handling Electrostatic Discharge Sensitive (ESD) Devices
JESD47, Stress-Test-Driven Qualification of Integrated Circuits
JESD94, Application Specific Qualification Using Knowledge Based Test Methodology
