JEDEC
STANDARD
Preconditioning of Nonhermetic
Surface Mount Devices Prior to
Reliability Testing
JESD22A113E
(Revision of JESD22A113D, August 2003)
MARCH 2006
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and
approved through the JEDEC Board of Directors level and subsequently reviewed and approved
by the JEDEC legal counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and
improvement of products, and assisting the purchaser in selecting and obtaining with minimum
delay the proper product for use by those other than JEDEC members, whether the standard is to
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption
may involve patents or articles, materials, or processes. By such action JEDEC does not assume
any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or
publication may be further processed and ultimately become an ANSI standard.
No claims to be in conformance with this standard may be made unless all requirements stated in
the standard are met.
Inquiries, comments, and suggestions relative to the content of this JEDEC standard or
publication should be addressed to JEDEC at the address below, or call (703) 907-7559 or
www.jedec.org
Published by
©JEDEC Solid State Technology Association 2006
2500 Wilson Boulevard
Arlington, VA 22201-3834
This document may be downloaded free of charge; however JEDEC retains the
copyright on this material. By downloading this file the individual agrees not to
charge for or resell the resulting material.
PRICE: Please refer to the current
Catalog of JEDEC Engineering Standards and Publications online at
http://www.jedec.org/Catalog/catalog.cfm
Printed in the U.S.A.
All rights reserved
PLEASE!
DON’T VIOLATE
THE
LAW!
This document is copyrighted by JEDEC and may not be
reproduced without permission.
Organizations may obtain permission to reproduce a limited number of copies
through entering into a license agreement. For information, contact:
JEDEC Solid State Technology Association
2500 Wilson Boulevard
Arlington, Virginia 22201-3834
or call (703) 907-7559
JEDEC Standard No. 22A113E
-i-
Foreword
This document provides an industry standard test method for preconditioning components that is
representative of a typical industry multiple solder reflow operation.
Introduction
The typical use of surface mount devices (SMD) involves subjecting the SMDs to elevated
temperatures during board assembly, which combined with moisture in the package can induce
internal package damage that could be a reliability concern. Preconditioning of SMD packages
is used to simulate the effects of board assembly on moisturized packages, prior to reliability
testing. This allows reliability testing at the component level on as shippable products with a
board assembly simulation. During preconditioning, test samples are subjected to temperature
cycling (optional), dry bake, moisture soaking, solder reflow simulation, flux, rinse, dry, and
electrical test before reliability testing.
