Preconditioning of Nonhermetic
Surface Mount Devices Prior to
(Revision of JESD22A113D, August 2003)
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JEDEC Standard No. 22A113E
This document provides an industry standard test method for preconditioning components that is
representative of a typical industry multiple solder reflow operation.
The typical use of surface mount devices (SMD) involves subjecting the SMDs to elevated
temperatures during board assembly, which combined with moisture in the package can induce
internal package damage that could be a reliability concern. Preconditioning of SMD packages
is used to simulate the effects of board assembly on moisturized packages, prior to reliability
testing. This allows reliability testing at the component level on as shippable products with a
board assembly simulation. During preconditioning, test samples are subjected to temperature
cycling (optional), dry bake, moisture soaking, solder reflow simulation, flux, rinse, dry, and
electrical test before reliability testing.