没有合适的资源?快使用搜索试试~ 我知道了~
JESD22-B113B手持电子产品组件互连可靠性特性的板级循环弯曲试验方法.pdf
需积分: 5 0 下载量 129 浏览量
2024-08-31
07:57:30
上传
评论
收藏 442KB PDF 举报
温馨提示
相关标准
资源推荐
资源详情
资源评论
JEDEC
STANDARD
Board Level Cyclic Bend Test Method
for Interconnect Reliability
Characterization of SMT ICs for
Handheld Electronic Products
JESD22-B113B
(Revision of JESD22-B113A, September 2012)
AUGUST 2018
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
Downloaded by Xu Jin (junes.xu@foxmail.com) on Jan 20, 2022, 1:50 am PST
Jade
NOTICE
JEDEC standards and publications contain material that has been prepared, reviewed, and
approved through the JEDEC Board of Directors level and subsequently reviewed and approved
by the JEDEC legal counsel.
JEDEC standards and publications are designed to serve the public interest through eliminating
misunderstandings between manufacturers and purchasers, facilitating interchangeability and
improvement of products, and assisting the purchaser in selecting and obtaining with minimum
delay the proper product for use by those other than JEDEC members, whether the standard is to
be used either domestically or internationally.
JEDEC standards and publications are adopted without regard to whether or not their adoption
may involve patents or articles, materials, or processes. By such action JEDEC does not assume
any liability to any patent owner, nor does it assume any obligation whatever to parties adopting
the JEDEC standards or publications.
The information included in JEDEC standards and publications represents a sound approach to
product specification and application, principally from the solid state device manufacturer
viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or
publication may be further processed and ultimately become an ANSI standard.
No claims to be in conformance with this standard may be made unless all requirements stated in
the standard are met.
Inquiries, comments, and suggestions relative to the content of this JEDEC standard or
publication should be addressed to JEDEC at the address below, or refer to www.jedec.org under
Standards and Documents for alternative contact information.
Published by
©JEDEC Solid State Technology Association 2018
3103 North 10th Street
Suite 240 South
Arlington, VA 22201-2108
JEDEC retains the copyright on this material. By downloading this file the individual agrees not
to charge for or resell the resulting material.
PRICE: Contact JEDEC
Printed in the U.S.A.
All rights reserved
Downloaded by Xu Jin (junes.xu@foxmail.com) on Jan 20, 2022, 1:50 am PST
Jade
PLEASE!
DON’T VIOLATE
THE
LAW!
This document is copyrighted by JEDEC and may not be
reproduced without permission.
For information, contact:
JEDEC Solid State Technology Association
3103 North 10th Street
Suite 240 South
Arlington, VA 22201-2107
or refer to www.jedec.org under Standards-Documents/Copyright Information.
Downloaded by Xu Jin (junes.xu@foxmail.com) on Jan 20, 2022, 1:50 am PST
Jade
Downloaded by Xu Jin (junes.xu@foxmail.com) on Jan 20, 2022, 1:50 am PST
Jade
JEDEC Standard No. 22-B113B
-i-
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT
RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD
ELECTRONIC PRODUCTS
Contents
Foreword ......................................................................................................................................... ii
Introduction ..................................................................................................................................... ii
1 Scope ......................................................................................................................................... 1
2 Apparatus .................................................................................................................................. 1
3 Terms and definitions ............................................................................................................... 2
4 Applicable documents ............................................................................................................... 4
5 Test Method .............................................................................................................................. 4
6 SMT ICs .................................................................................................................................... 5
7 Test Board and SMT IC locations ............................................................................................ 5
8 Test board assembly ................................................................................................................ 10
9 Test procedure ......................................................................................................................... 11
10 Electrical monitoring requirements and failure criteria .......................................................... 13
11 Test duration requirements ..................................................................................................... 14
12 Reporting................................................................................................................................. 14
Annex A Validity of parameters specified in this standard ......................................................... 15
Annex B (informative) Differences between revisions ................................................................ 17
Downloaded by Xu Jin (junes.xu@foxmail.com) on Jan 20, 2022, 1:50 am PST
Jade
剩余25页未读,继续阅读
资源评论
有地气的小圈子
- 粉丝: 373
- 资源: 675
上传资源 快速赚钱
- 我的内容管理 展开
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
最新资源
资源上传下载、课程学习等过程中有任何疑问或建议,欢迎提出宝贵意见哦~我们会及时处理!
点击此处反馈
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功