JEDEC Standard No. 22B117B
Page 1
Test Method B117B
(Revision of B117A)
TEST METHOD B117B: SOLDER BALL SHEAR
(From JEDEC Board Ballot, JCB-14-10, formulated under the cognizance of the JC-14.1 Subcommittee
on Reliability Test Methods for Packaged Devices.)
1
Scope
This document describes a test method only; acceptance criteria and qualification requirements
are not defined. This test method applies to solder ball shear force/energy testing prior to end-use
attachment. Solder balls are sheared individually; force, fracture energy and failure mode data
are collected and analyzed. Both low- and high-speed testing are covered by this document.
Depending on test sample configuration, application, and purpose of the test (characterization,
qualification, production, etc.), other solder joint integrity assessment methods such as JEDEC
Solder Ball Pull Test Method JESD22-B115, may be more appropriate. Generally, solder ball
shear is most appropriate for devices that experience shear loading during either the
manufacturing/shipment process, or end use.
This test method is used to assess the ability of solder balls to withstand mechanical shear forces
that may be applied during device manufacturing, handling, test, shipment, and end-use
conditions. Solder ball shear is a destructive test. This test method provides qualitative results
and is suitable for process and material characterization.
2 Terms and definitions
base material: The substrate of the device where the solder balls are attached.
clamping fixture: A fixture that holds the device rigidly during solder ball shear testing
(see Figure 2).
elapsed time after reflow: The elapsed time between solder ball shear and last reflow of solder
ball.
failure mode: The type or location of failure observed after the solder ball is sheared.
fracture energy: The total energy required to fracture the solder ball.
NOTE Typically fracture energy is calculated by integrating the force versus displacement during the
solder-ball-shear process.
high-speed shear: Shear occurring at a speed that produces a low-energy interfacial fracture of
the solder ball; that speed is typically greater than 50 mm/s.
