APH001: DW1000 HARDWARE DESIGN GUIDE
© Decawave 2016 This document is confidential and contains information which is proprietary
to Decawave Limited. No reproduction is permitted without prior express written permission of
the author
Table of Contents
1 INTRODUCTION ........................................................................................................................................ 5
1.1 OVERVIEW ................................................................................................................................................. 5
1.2 DOCUMENT STRUCTURE ................................................................................................................................ 5
2 DW1000 HARDWARE SYSTEM OVERVIEW ................................................................................................ 6
2.1 OVERVIEW ................................................................................................................................................. 6
2.2 SYSTEM BLOCK DIAGRAM .............................................................................................................................. 6
2.3 DW1000 APPLICATION CIRCUIT .................................................................................................................... 7
3 PCB TECHNOLOGY .................................................................................................................................... 9
3.1 OVERVIEW ................................................................................................................................................. 9
3.2 NUMBER OF LAYERS ..................................................................................................................................... 9
3.3 RECOMMENDED 4-LAYER PCB STACK-UP SOLUTION ........................................................................................ 11
4 LAYOUT FLOORPLAN .............................................................................................................................. 12
4.1 OVERVIEW ............................................................................................................................................... 12
4.2 POWER ARCHITECTURE ............................................................................................................................... 12
4.3 ANTENNA CONSIDERATIONS ........................................................................................................................ 14
4.4 EXAMPLE FLOORPLAN ................................................................................................................................. 16
5 POWER MANAGEMENT .......................................................................................................................... 17
5.1 SWITCHED-MODE POWER SUPPLIES .............................................................................................................. 17
6 DW1000 TRANSCEIVER ........................................................................................................................... 18
6.1 LOCAL POWER SUPPLY ROUTING AND DECOUPLING ......................................................................................... 18
6.2 EFFECTIVE CAPACITIVE DECOUPLING .............................................................................................................. 19
6.3 DECOUPLING NOISE WITH MULTIPLE CAPACITORS ............................................................................................ 19
6.3.1 VDDPA1 and VDDPA2 Routing ...................................................................................................... 19
6.4 RF LAYOUT ............................................................................................................................................... 20
6.4.1 Transmission Lines ........................................................................................................................ 20
6.4.2 Placement of Sensitive RF Components ........................................................................................ 22
6.5 TCXO GUIDELINES ..................................................................................................................................... 23
6.6 MICROCONTROLLER INTERFACE .................................................................................................................... 24
6.6.1 SPI Mode Selection ........................................................................................................................ 24
6.6.2 Interrupt Request Output .............................................................................................................. 24
6.6.3 Reset Pin ....................................................................................................................................... 25
7 RF CONNECTORS .................................................................................................................................... 26
7.1 SURFACE-MOUNT CONNECTORS................................................................................................................... 26
7.2 SMA CONNECTORS ................................................................................................................................... 27
7.3 SEMI-RIGID ADAPTERS ................................................................................................................................ 28
8 ANTENNAS ............................................................................................................................................. 29
8.1 OVERVIEW ............................................................................................................................................... 29
8.2 ANTENNA REFERENCE DESIGNS FROM DECAWAVE ........................................................................................... 29
8.2.1 WB001 .......................................................................................................................................... 29
8.2.2 WB002 .......................................................................................................................................... 30
9 ELECTROMAGNETIC INTERFERENCE ....................................................................................................... 31
9.1 OVERVIEW ............................................................................................................................................... 31
9.2 PCB GROUND STITCHING VIAS ..................................................................................................................... 31
9.3 EMI SHIELD CANS ..................................................................................................................................... 32
9.4 EMI FROM PCB INTERFACES ....................................................................................................................... 33
