Rev. 0.0, Jan.2009
S5PV210
RISC Microprocessor
Revision 1.00
February 2010
U
U
s
s
e
e
r
r
'
'
s
s
M
M
a
a
n
n
u
u
a
a
l
l
© 2010 Samsung Electronics Co., Ltd. All rights reserved.
SAMSUNG CONFIDENTIAL
Rev. 0.0, Jan.2009
Important Notice
The information in this publication has been carefully
checked and is believed to be entirely accurate at the
time of publication. Samsung assumes no
responsibility, however, for possible errors or
omissions, or for any consequences resulting from the
use of the information contained herein.
Samsung reserves the right to make changes in its
products or product specifications with the intent to
improve function or design at any time and without
notice and is not required to update this
documentation to reflect such changes.
This publication does not convey to a purchaser of
semiconductor devices described herein any license
under the patent rights of Samsung or others.
Samsung makes no warranty, representation, or
guarantee regarding the suitability of its products for
any particular purpose, nor does Samsung assume
any liability arising out of the application or use of any
product or circuit and specifically disclaims any and all
liability, including without limitation any consequential
or incidental damages.
"Typical" parameters can and do vary in different
applications. All operating parameters, including
"Typicals" must be validated for each customer
application by the customer's technical experts.
Samsung products are not designed, intended, or
authorized for use as components in systems intended
for surgical implant into the body, for other
applications intended to support or sustain life, or for
any other application in which the failure of the
Samsung product could create a situation where
personal injury or death may occur.
Should the Buyer purchase or use a Samsung product
for any such unintended or unauthorized application,
the Buyer shall indemnify and hold Samsung and its
officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs,
damages, expenses, and reasonable attorney fees
arising out of, either directly or indirectly, any claim of
personal injury or death that may be associated with
such unintended or unauthorized use, even if such
claim alleges that Samsung was negligent regarding
the design or manufacture of said product.
S5PV210 RISC Microprocessor
User's Manual, Revision 1.00
Copyright © 2010 Samsung Electronics Co., Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in
any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior
written consent of Samsung Electronics.
Samsung Electronics Co., Ltd.
San #24 Nongseo-Dong, Giheung-Gu
Yongin-City, Gyeonggi-Do, Korea 446-711
TEL : (82)-(31)-209-0810
FAX : (82)-(31)-209-0837
Home Page: http://www.samsungsemi.com
Printed in the Republic of Korea
SAMSUNG CONFIDENTIAL
Rev. 0.0, Jan.2009
Revision History
Revision No. Date Description Author(s)
0.00 February 27, 2010 - Initial draft S.H Yoon
SAMSUNG CONFIDENTIAL
Section 1
OVERVIEW
SAMSUNG CONFIDENTIAL
Table of Contents
1 Overview of S5PV210.................................................................................1-1
1.1 Architectural Overview .....................................................................................................
........................ 1-1
1.2 Block Diagram of S5PV210
..................................................................................................................... 1-2
1.3 Key Features of S5PV210 ....................................................................................................................... 1-3
1.3.1 Microprocess
or ................................................................................................................................. 1-4
1.3.2 Memory Subsys
tem.......................................................................................................................... 1-5
1.3.3 Multimedia ........................................................................................................................................ 1-6
1.3.4 Audio Subsy
stem.............................................................................................................................. 1-9
1.3.5 Security Subsys
tem.......................................................................................................................... 1-9
1.3.6 Connectivity .............................................................................................................
....................... 1-10
1.3.7 System Peripheral .......................................................................................................................... 1-13
1.4 Conventions ........................................................................................................................................... 1-15
1.4.1 Regis
ter R/W Conventions ............................................................................................................. 1-15
1.4.2 Regis
ter Value Conventions
........................................................................................................... 1-15
2 Memory Map ...............................................................................................2-1
2.1 Memory Address Map
.............................................................................................................................. 2-1
2.1.1 Device Specific Address
Space........................................................................................................ 2-2
2.1.2 Special Function Register Map
......................................................................................................... 2-4
3 SIZE & BALL MAP .........................................................................................1
3.1 Pin Assignment ............................................................................................................................................1
3.1.1 Pin As
signment Diagram - 584-ball FCFBGA ......................................................................................1
3.1.2 Pin Number Order.........................................................................................................
........................2
3.1.3 Power Pins
..........................................................................................................................................10
3.2 Pin Discription ........................................................................................................................................ 3-13
3.2.1 Power Domain ................................................................................................................................ 3-38
3.2.2 Pack
age Dimension
........................................................................................................................ 3-51
SAMSUNG CONFIDENTIAL
