Rev. 0.0, Jan.2009
S5PV210
RISC Microprocessor
Revision 1.00
February 2010
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© 2010 Samsung Electronics Co., Ltd. All rights reserved.
SAMSUNG CONFIDENTIAL
Rev. 0.0, Jan.2009
Important Notice
The information in this publication has been carefully
checked and is believed to be entirely accurate at the
time of publication. Samsung assumes no
responsibility, however, for possible errors or
omissions, or for any consequences resulting from the
use of the information contained herein.
Samsung reserves the right to make changes in its
products or product specifications with the intent to
improve function or design at any time and without
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semiconductor devices described herein any license
under the patent rights of Samsung or others.
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or incidental damages.
"Typical" parameters can and do vary in different
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S5PV210 RISC Microprocessor
User's Manual, Revision 1.00
Copyright © 2010 Samsung Electronics Co., Ltd.
All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted in
any form or by any means, electric or mechanical, by photocopying, recording, or otherwise, without the prior
written consent of Samsung Electronics.
Samsung Electronics Co., Ltd.
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TEL : (82)-(31)-209-0810
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SAMSUNG CONFIDENTIAL
Rev. 0.0, Jan.2009
Revision History
Revision No. Date Description Author(s)
0.00 February 27, 2010 - Initial draft S.H Yoon
SAMSUNG CONFIDENTIAL
Section 1
OVERVIEW
SAMSUNG CONFIDENTIAL
Table of Contents
1 Overview of S5PV210.................................................................................1-1
1.1 Architectural Overview .....................................................................................................
........................ 1-1
1.2 Block Diagram of S5PV210
..................................................................................................................... 1-2
1.3 Key Features of S5PV210 ....................................................................................................................... 1-3
1.3.1 Microprocess
or ................................................................................................................................. 1-4
1.3.2 Memory Subsys
tem.......................................................................................................................... 1-5
1.3.3 Multimedia ........................................................................................................................................ 1-6
1.3.4 Audio Subsy
stem.............................................................................................................................. 1-9
1.3.5 Security Subsys
tem.......................................................................................................................... 1-9
1.3.6 Connectivity .............................................................................................................
....................... 1-10
1.3.7 System Peripheral .......................................................................................................................... 1-13
1.4 Conventions ........................................................................................................................................... 1-15
1.4.1 Regis
ter R/W Conventions ............................................................................................................. 1-15
1.4.2 Regis
ter Value Conventions
........................................................................................................... 1-15
2 Memory Map ...............................................................................................2-1
2.1 Memory Address Map
.............................................................................................................................. 2-1
2.1.1 Device Specific Address
Space........................................................................................................ 2-2
2.1.2 Special Function Register Map
......................................................................................................... 2-4
3 SIZE & BALL MAP .........................................................................................1
3.1 Pin Assignment ............................................................................................................................................1
3.1.1 Pin As
signment Diagram - 584-ball FCFBGA ......................................................................................1
3.1.2 Pin Number Order.........................................................................................................
........................2
3.1.3 Power Pins
..........................................................................................................................................10
3.2 Pin Discription ........................................................................................................................................ 3-13
3.2.1 Power Domain ................................................................................................................................ 3-38
3.2.2 Pack
age Dimension
........................................................................................................................ 3-51
SAMSUNG CONFIDENTIAL
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