MPU-6500
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense, Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: PS-MPU-6500A-01
Revision: 1.3
Rev. Date: 05/15/2020
MPU-6500
Product Specification
Revision 1.3
MPU-6500
Document Number: PS-MPU-6500A-01 Page 2 of 39
Revision: 1.3
TABLE OF CONTENTS
1 INTRODUCTION .......................................................................................................................................... 5
1.1 PURPOSE AND SCOPE .......................................................................................................................... 5
1.2 PRODUCT OVERVIEW ........................................................................................................................... 5
1.3 APPLICATIONS ..................................................................................................................................... 5
2 FEATURES .................................................................................................................................................. 6
2.1 GYROSCOPE FEATURES ....................................................................................................................... 6
2.2 ACCELEROMETER FEATURES ............................................................................................................... 6
2.3 ADDITIONAL FEATURES ........................................................................................................................ 6
2.4 MOTIONPROCESSING® ........................................................................................................................ 6
3 ELECTRICAL CHARACTERISTICS ........................................................................................................... 7
3.1 GYROSCOPE SPECIFICATIONS .............................................................................................................. 7
3.2 ACCELEROMETER SPECIFICATIONS ....................................................................................................... 8
3.3 ELECTRICAL SPECIFICATIONS ............................................................................................................... 9
3.4 I
2
C TIMING CHARACTERIZATION.......................................................................................................... 13
3.5 SPI TIMING CHARACTERIZATION ......................................................................................................... 14
3.6 ABSOLUTE MAXIMUM RATINGS ........................................................................................................... 16
4 APPLICATIONS INFORMATION .............................................................................................................. 17
4.1 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION ..................................................................................... 17
4.2 TYPICAL OPERATING CIRCUIT ............................................................................................................. 18
4.3 BILL OF MATERIALS FOR EXTERNAL COMPONENTS .............................................................................. 18
4.4 BLOCK DIAGRAM ............................................................................................................................... 19
4.5 OVERVIEW ........................................................................................................................................ 19
4.6 THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING ................................ 20
4.7 THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING ........................ 20
4.8 DIGITAL MOTIONPROCESSOR® .......................................................................................................... 20
4.9 PRIMARY I
2
C AND SPI SERIAL COMMUNICATIONS INTERFACES ............................................................ 20
4.10 AUXILIARY I
2
C SERIAL INTERFACE ...................................................................................................... 22
4.11 SELF-TEST ........................................................................................................................................ 23
4.12 CLOCKING ......................................................................................................................................... 23
4.13 SENSOR DATA REGISTERS ................................................................................................................. 24
4.14 FIFO ................................................................................................................................................ 24
4.15 INTERRUPTS ...................................................................................................................................... 24
4.16 DIGITAL-OUTPUT TEMPERATURE SENSOR .......................................................................................... 24
4.17 BIAS AND LDOS ................................................................................................................................ 24
MPU-6500
Document Number: PS-MPU-6500A-01 Page 3 of 39
Revision: 1.3
4.18 CHARGE PUMP .................................................................................................................................. 25
4.19 STANDARD POWER MODES ................................................................................................................ 25
5 PROGRAMMABLE INTERRUPTS ............................................................................................................ 26
5.1 WAKE-ON-MOTION INTERRUPT ........................................................................................................... 27
6 DIGITAL INTERFACE ............................................................................................................................... 28
6.1 I
2
C AND SPI SERIAL INTERFACES ....................................................................................................... 28
6.2 I
2
C INTERFACE .................................................................................................................................. 28
6.3 I
2
C COMMUNICATIONS PROTOCOL ...................................................................................................... 28
6.4 I
2
C TERMS ........................................................................................................................................ 31
6.5 SPI INTERFACE ................................................................................................................................. 32
7 SERIAL INTERFACE CONSIDERATIONS ............................................................................................... 33
7.1 MPU-6500 SUPPORTED INTERFACES ................................................................................................. 33
8 ASSEMBLY ............................................................................................................................................... 34
8.1 ORIENTATION OF AXES ...................................................................................................................... 34
8.2 PACKAGE DIMENSIONS ...................................................................................................................... 35
9 PART NUMBER PACKAGE MARKING ................................................................................................... 36
10 RELIABILITY ............................................................................................................................................. 37
10.1 QUALIFICATION TEST POLICY ............................................................................................................. 37
10.2 QUALIFICATION TEST PLAN ................................................................................................................ 37
11 REFERENCE ............................................................................................................................................. 38
12 REVISION HISTORY ................................................................................................................................. 39
MPU-6500
Document Number: PS-MPU-6500A-01 Page 4 of 39
Revision: 1.3
Table of Figures
Figure 1. I
2
C Bus Timing Diagram ...................................................................................................................................... 13
Figure 2. SPI Bus Timing Diagram ..................................................................................................................................... 14
Figure 3. Pin out Diagram for MPU-6500 3.0x3.0x0.9mm QFN ........................................................................................ 17
Figure 4. MPU-6500 QFN Application Schematic. (a) I
2
C operation, (b) SPI operation. ................................................... 18
Figure 5. MPU-6500 Block Diagram .................................................................................................................................. 19
Figure 6. MPU-6500 Solution Using I
2
C Interface ............................................................................................................. 21
Figure 7. MPU-6500 Solution Using SPI Interface ............................................................................................................ 22
Figure 8. Wake-on-Motion Interrupt Configuration ......................................................................................................... 27
Figure 9. START and STOP Conditions .............................................................................................................................. 28
Figure 10. Acknowledge on the I
2
C Bus ............................................................................................................................ 29
Figure 11. Complete I
2
C Data Transfer ............................................................................................................................. 30
Figure 12. Typical SPI Master / Slave Configuration ......................................................................................................... 32
Figure 13. I/O Levels and Connections ............................................................................................................................. 33
Figure 14. Orientation of Axes of Sensitivity and Polarity of Rotation ............................................................................. 34
Table of Tables
Table 1. Gyroscope Specifications ...................................................................................................................................... 7
Table 2. Accelerometer Specifications ............................................................................................................................... 8
Table 3. D.C. Electrical Characteristics ................................................................................................................................ 9
Table 4. A.C. Electrical Characteristics .............................................................................................................................. 11
Table 5. Other Electrical Specifications ............................................................................................................................ 12
Table 6. I
2
C Timing Characteristics ................................................................................................................................... 13
Table 7. SPI Timing Characteristics ................................................................................................................................... 14
Table 8. fCLK = 20 MHz ..................................................................................................................................................... 15
Table 9. Absolute Maximum Ratings ................................................................................................................................ 16
Table 10. Signal Descriptions ............................................................................................................................................ 17
Table 11. Bill of Materials ................................................................................................................................................. 18
Table 12. Standard Power Modes for MPU-6500 ............................................................................................................. 25
Table 13. Table of Interrupt Sources ................................................................................................................................ 26
Table 14. Serial Interface .................................................................................................................................................. 28
Table 15. I
2
C Terms ........................................................................................................................................................... 31
Table 16. Accelerated Life Tests ....................................................................................................................................... 37
Table 17. Device Component Level Tests ......................................................................................................................... 37
MPU-6500
Document Number: PS-MPU-6500A-01 Page 5 of 39
Revision: 1.3
1 INTRODUCTION
1.1 PURPOSE AND SCOPE
This document is a product specification, providing a description, specifications, and design related information on the
MPU-6500™ MotionTracking device. The device is housed in a small 3x3x0.90mm QFN package.
Specifications are subject to change without notice. For references to register map and descriptions of individual
registers, please refer to the MPU-6500 Register Map and Register Descriptions document.
1.2 PRODUCT OVERVIEW
The MPU-6500 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, and a Digital
MotionProcessor® (DMP®) all in a small 3x3x0.9mm package. It also features a 512-byte FIFO that can lower the traffic
on the serial bus interface, and reduce power consumption by allowing the system processor to burst read sensor data
and then go into a low-power mode. With its dedicated I
2
C sensor bus, the MPU-6500 directly accepts inputs from
external I
2
C devices. MPU-6500, with its 6-axis integration, on-chip DMP, and run-time calibration firmware, enables
manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete
devices, guaranteeing optimal motion performance for consumers. MPU-6500 is also designed to interface with
multiple non-inertial digital sensors, such as pressure sensors, on its auxiliary I
2
C port.
The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec and very low rate
noise at 0.01 dps/√Hz. The accelerometer has a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g,
and ±16g. Factory-calibrated initial sensitivity of both sensors reduces production-line calibration requirements.
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, a precision clock with 1%
drift from -40°C to 85°C, an embedded temperature sensor, and programmable interrupts. The device features I
2
C and
SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital IO supply, VDDIO from 1.71V to
3.6V.
Communication with all registers of the device is performed using either I
2
C at 400kHz or SPI at 1MHz. For applications
requiring faster communications, the sensor and interrupt registers may be read using SPI at 20MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with
companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a
footprint and thickness of 3x3x0.90mm (24-pin QFN), to provide a very small yet high performance low cost package.
The device provides high robustness by supporting 10,000g shock reliability.
1.3 APPLICATIONS
• TouchAnywhere™ technology (for “no touch” UI Application Control/Navigation)
• MotionCommand™ technology (for Gesture Short-cuts)
• Motion-enabled game and application framework
• Location based services, points of interest, and dead reckoning
• Handset and portable gaming
• Motion-based game controllers
• 3D remote controls for Internet connected DTVs and set top boxes, 3D mice
• Wearable sensors for health, fitness and sports
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