TDC1011
ZHCSDU9 –JULY 2015
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1)(2)
MIN MAX UNIT
V
DD
Analog supply voltage, VDD pins –0.3 6.0 V
V
IO
I/O supply voltage (V
IO
must always be lower than or equal to V
DD
supply) –0.3 6.0 V
V
I
Voltage on any analog input pin
(3)
–0.3 V
DD
+ 0.3 V
V
I
Voltage on any digital input pin
(3)
–0.3 V
IO
+ 0.3 V
I
I
Input current at any pin 5 mA
T
J
Operating junction temperature –40 125 °C
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) When the input voltage at a pin exceeds the power supplies, the current at that pin must not exceed 5 mA and the voltage (V
I
) at that
pin must not exceed 6.0 V.
6.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per AEC A100-002
(1)
±2000
All pins ±500
V
(ESD)
Electrostatic discharge V
Charged-device model (CDM), per AEC
Corner pins (1, 14, 15
Q100-011
±750
and 28)
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
DD
Analog supply voltage, VDD pins 2.7 5.5 V
V
IO
Digital supply voltage, (V
IO
must always be lower than or equal to V
DD
supply) 1.8 V
DD
V
V
I
Voltage on any analog input pin GND V
DD
V
V
I
Voltage on any digital input pin GND V
IO
V
ƒ
CLKIN
Operating frequency 0.06 16 MHz
T
J
Operating junction temperature –40 125 °C
6.4 Thermal Information
(1)
TDC1011
THERMAL METRIC TSSOP UNIT
PW (28 PINS)
R
θJA
Junction-to-ambient thermal resistance 83.5
R
θJC(top)
Junction-to-case (top) thermal resistance 29.9
R
θJB
Junction-to-board thermal resistance 40.8 °C/W
ψ
JT
Junction-to-top characterization parameter 2.4
ψ
JB
Junction-to-board characterization parameter 40.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4 Copyright © 2015, Texas Instruments Incorporated
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