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TI的TDC1011是一款专为液位和浓度感测设计的单通道超声波模拟前端(AFE)芯片，适用于汽车、工业、医疗和消费类电子产品。这款AFE的特点在于其高度集成和可编程性，能够适应各种不同的应用需求。 TDC1011的主要特性包括： 1. **测量范围**：高达8毫秒的测量时间，使得该器件可以用于远距离的液位和浓度检测。 2. **低功耗**：工作电流仅为1.8微安（在2样本/秒的采样速率下），适合电池供电的应用。 3. **可编程激励**：频率范围从31.25kHz到4MHz，可设置多达31个脉冲，以适应不同的传感器频率和应用场景。 4. **接收器通道**：具有低噪声、可编程增益放大器，能对不同介质中传播的超声波进行精确检测。 5. **高精度**：STOP逐周期抖动仅为50ps RMS，确保了皮秒级别的分辨率和精度。 6. **温度测量**：内置2个PT1000/500 RTD接口，可进行温度测量，匹配精度达到0.02°C RMS。 7. **工作温度范围**：-40°C至125°C，保证了在宽温范围内的稳定性能。 8. **可编程阈值比较器**：针对回声质量检查，可根据应用需求设置阈值。 9. **低功耗模式**：支持长时间飞行时间(TOF)测量，降低功耗。 10. **灵活的信号链设计**：允许访问外部滤波器，便于系统优化。 TDC1011的工作模式可选，特别适合低功耗应用。配合MSP430或C2000 MCU，以及电源、无线网络和源代码，TI提供了完整的超声波传感解决方案。该器件的封装为TSSOP (PW-28)，尺寸为9.70mm x 4.40mm。在应用方面，TDC1011可以用于： 1. **液位测量**：在不同材料的容器中测量液位，如汽车油箱、工业储罐等。 2. **液体鉴别与浓度感测**：通过分析回声特性，可以识别和测量液体的类型和浓度。 3. **接近/远距感测**：在安全关键应用中，如障碍物检测和距离测量。在实施应用时，用户需要了解TDC1011的寄存器映射，以便进行编程和配置。TI提供的数据表和应用指南将详细介绍这些内容，以帮助设计者优化系统性能。 TDC1011是一款高度灵活、低功耗的超声波AFE，适用于各种液位和浓度检测场景，其强大的可编程能力和出色的精度使其成为此类应用的理想选择。通过与TI的其他组件和软件配合，可以构建出高效、可靠的超声波传感系统。

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Design

TDC1011

ZHCSDU9 –JULY 2015

TDC1011 面面向向液液位位感感测测、、浓浓度度感感测测应应用用的的单单通通道道超超声声波波感感测测模模拟拟前前端端

(AFE)

1 特特性性 3 说说明明

• 测量范围：高达 8ms

TDC1011 是一款全集成超声波感测模拟前端 (AFE)，

常用于汽车、工业、医疗和消费品市场中的液位、液体

• 工作电流：1.8µA (2 SPS)

鉴别/浓度以及接近传感/远距感测应用。与

• 发送器通道 TX

MSP430/C2000 MCU、电源、无线网络和源代码配套

– 支持单传感器应用

使用时，TI 可提供完整的超声波感测解决方案。

– 可编程激励：31.25kHz 至 4MHz，多达 31 个

脉冲

TI 的超声波 AFE 可编程且具有灵活性，可适应广泛的

• 接收器通道 RX

应用和终端设备。 TDC10111 可针对多种发射脉冲和

– STOP 逐周期抖动：50ps

RMS

频率、增益和信号阈值进行配置，以便在多种传感器频

– 低噪声、可编程增益放大器

率（31.25kHz 至 4MHz）和 Q 系数下使用。同样，

– 可访问外部滤波器的信号链设计

接收路径可编程设定，因此在更远的距离/更大的箱体

– 针对回声质检的可编程阈值比较器

尺寸范围内也能够检测到通过多种介质传播的超声波。

– 针对较长 TOF 测量的可编程低功耗模式

TDC1011 可选择不同的工作模式，并且针对低功耗进

• 温度测量

行了优化，这使得它成为电池供电应用的理想选择。

– 2 个 PT1000/500 RTD 接口

低噪声放大器和比较器产生的抖动极低，可实现皮秒级

– RTD 间的匹配精度为 0.02°C

RMS

分辨率和精度。

• 工作温度范围：-40°C 至 125°C

器器件件信信息息

(1)

2 应应用用

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

• 不同材料箱中的各项测量：

TDC1011 TSSOP (PW-28) 9.70mm x 4.40mm

– 液位

(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。

– 液体鉴别/浓度

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SNAS662

TDC1011

ZHCSDU9 –JULY 2015

www.ti.com.cn

目目录录

8.3 Feature Description................................................. 12

1 特特性性.......................................................................... 1

8.4 Device Function Description ................................... 19

2 应应用用.......................................................................... 1

8.5 Programming .......................................................... 28

3 说说明明.......................................................................... 1

8.6 Register Maps......................................................... 30

4 修修订订历历史史记记录录 ........................................................... 2

9 Application and Implementation ........................ 36

5 Pin Configuration and Functions......................... 3

9.1 Application Information............................................ 36

6 Specifications......................................................... 4

9.2 Typical Applications ................................................ 36

6.1 Absolute Maximum Ratings ...................................... 4

10 Power Supply Recommendations ..................... 41

6.2 ESD Ratings ............................................................ 4

11 Layout................................................................... 42

6.3 Recommended Operating Conditions....................... 4

11.1 Layout Guidelines ................................................. 42

6.4 Thermal Information.................................................. 4

11.2 Layout Example .................................................... 42

6.5 Electrical Characteristics........................................... 5

12 器器件件和和文文档档支支持持 ..................................................... 43

6.6 Timing Requirements................................................ 7

12.1 器件支持................................................................ 43

6.7 Switching Characteristics.......................................... 7

12.2 社区资源................................................................ 43

6.8 Typical Characteristics.............................................. 8

12.3 商标 ....................................................................... 43

7 Parameter Measurement Information ................ 10

12.4 静电放电警告......................................................... 43

8 Detailed Description ............................................ 11

12.5 Glossary................................................................ 43

8.1 Overview ................................................................. 11

13 机机械械、、封封装装和和可可订订购购信信息息....................................... 43

8.2 Functional Block Diagram ....................................... 11

4 修修订订历历史史记记录录

日日期期修修订订版版本本注注释释

2015 年 7 月 * 首次发布。

TDC1011

ZHCSDU9 –JULY 2015

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)(2)

MIN MAX UNIT

Analog supply voltage, VDD pins –0.3 6.0 V

I/O supply voltage (V

must always be lower than or equal to V

supply) –0.3 6.0 V

Voltage on any analog input pin

(3)

–0.3 V

+ 0.3 V

Voltage on any digital input pin

(3)

–0.3 V

+ 0.3 V

Input current at any pin 5 mA

Operating junction temperature –40 125 °C

stg

Storage temperature range –65 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to ground, unless otherwise specified.

(3) When the input voltage at a pin exceeds the power supplies, the current at that pin must not exceed 5 mA and the voltage (V

) at that

pin must not exceed 6.0 V.

6.2 ESD Ratings

VALUE UNIT

Human-body model (HBM), per AEC A100-002

(1)

±2000

All pins ±500

(ESD)

Electrostatic discharge V

Charged-device model (CDM), per AEC

Corner pins (1, 14, 15

Q100-011

±750

and 28)

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

MIN MAX UNIT

Analog supply voltage, VDD pins 2.7 5.5 V

Digital supply voltage, (V

must always be lower than or equal to V

supply) 1.8 V

Voltage on any analog input pin GND V

Voltage on any digital input pin GND V

CLKIN

Operating frequency 0.06 16 MHz

Operating junction temperature –40 125 °C

6.4 Thermal Information

(1)

TDC1011

THERMAL METRIC TSSOP UNIT

PW (28 PINS)

θJA

Junction-to-ambient thermal resistance 83.5

θJC(top)

Junction-to-case (top) thermal resistance 29.9

θJB

Junction-to-board thermal resistance 40.8 °C/W

Junction-to-top characterization parameter 2.4

Junction-to-board characterization parameter 40.3

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

TDC1011

www.ti.com.cn

ZHCSDU9 –JULY 2015

6.5 Electrical Characteristics

The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. These

specifications are interpreted as conditions that do not degrade the device parametric or functional specifications for the life of

the product containing it. T

= 25°C, V

= V

= 3.7 V, V

COM

= V

/ 2, C

VCOM

= 10 nF (unless otherwise noted).

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

TRANSMITTER SIGNAL PATH (TX)

HIGH V

– 0.32 V

OUT(TX)

Output voltage swing ƒ

out

= 1 MHz, R

= 75 Ω to V

LOW 0.32 V

OUT(TX)

Output drive current ƒ

out

= 1 MHz, R

= 75 Ω to V

22 mA

RMS

CLKIN

= 8 MHz, divide-by-2 (programmable;

OUT(TX)

Output TX frequency 4 MHz

see Transmitter Signal Path)

RECEIVER SIGNAL PATH (RX)

LNA capacitive feedback, G

PGA

= 6 dB, ƒ

= 1

STOP cycle-to-cycle

Δt

STOP

MHz, V

= 100 mV

, C

VCOM

= 1 µF and 50 ps

RMS

jitter

Figure 14

LNA

Capacitive feedback, C

= 300 pF, ƒ

= 1

LNA

LNA gain 20 dB

MHz, R

= 100 kΩ to V

, C

VCOM

= 1 µF

LNA input referred Capacitive feedback, C

= 300 pF, ƒ = 1 MHz,

LNA

2 nV/√Hz

noise density V

= 3.1 V, V

= V

, R

= ∞, C

VCOM

= 1 µF

HIGH V

+ (V

– 0.24) / (G

LNA

) V

Resistive feedback, R

= 1 kΩ to

IN(LNA)

Input voltage range

, C

VCOM

= 1 µF

LOW V

– (V

– 0.24) / (G

LNA

) V

HIGH V

– 0.24 V

Resistive feedback, R

= 1 kΩ to

OUT(LNA)

Output voltage range

, C

VCOM

= 1 µF

LOW GND + 0.24 V

Resistive feedback, R

= 1 kΩ to V

, 100mV

LNA

Slew rate

(1)

9 V/μs

step, C

VCOM

= 1 µF

Capacitive feedback, C

= 300 pF, R

= 100 kΩ

LNA

–3-dB bandwidth 5 MHz

to V

, C

VCOM

= 1 µF

LNA input offset

OS(LNA)

Resistive mode, V

= V

, R

= ∞ ±320 µV

voltage

VCOM

COM

VCOM output voltage V

VCOM

= 1 µF

VCOM output error 0.5%

PGA

HIGH V

+ (V

– 0.06) / (G

PGA

) V

= 100 kΩ to V

, C

= 10 pF

IN(PGA)

PGA input range

to GND

LOW V

– (V

– 0.06) / (G

PGA

) V

PGAMIN

PGA min gain 0 dB

PGAMAX

PGA max gain DC, R

= ∞, C

= 10 pF 21 dB

ΔG

PGA

PGA gain step size 3 dB

E(PGA)

PGA gain error DC, G

PGA

= 0 dB, R

= ∞, C

= 10 pF 5%

PGA gain temperature

TCG

PGA

DC, G

PGA

= 0 dB, R

= ∞, C

= 10 pF 170 ppm/°C

coefficient

PGA input referred G

PGA

= 21 dB, ƒ = 1 MHz, V

= 3.1V, V

PGA

3.1 nV/√Hz

noise density V

, R

= ∞, C

VCOM

= 1 µF

HIGH V

– 0.06 V

= 100 kΩ to V

, C

= 10 pF

OUT(PGA)

Output range

to GND

LOW 60 mV

PGA

= 21 dB, R

= 100 kΩ to V

, C

= 10

PGA

–3-db bandwidth 5 MHz

pF, C

VCOM

= 1 µF

PGA

= 21 dB, R

= 100 kΩ to V

, C

= 10

PGA

Slew rate

(1)

12.5 V/µs

pF, C

VCOM

= 1 µF

(1) The slew rate is measured from 10% to 90% and is represented by the average of the rising and falling slew rates.

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